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    • 11. 发明专利
    • DE10158706B4
    • 2007-06-21
    • DE10158706
    • 2001-11-29
    • ELPIDA MEMORY INC
    • NISSA MITSUO
    • H01L29/78H01L21/265H01L21/316H01L21/336H01L21/8234H01L21/8242H01L27/088H01L27/108
    • A semiconductor device is disclosed that can include a gate electrode (6) having a lower layer (6a) and a higher layer (6b), a mask insulating film (7) formed over a higher layer (6b). A side surface insulating film (9) may be formed on sides of a gate electrode (6) and a side wall insulating film (8) may be formed on the sides of a gate electrode (6) and mask insulating film (7). A low density impurity region (3) may be formed with a gate electrode (6) and side surface insulating film (9) as a mask. A higher density impurity region (4) may be formed with a gate electrode (6) and side wall insulating film (8) as a mask. A contact plug (10) may be formed between side wall insulating films (8) that contacts a higher density impurity region (4). A gate electrode (6) may have a reverse tapered shape when viewed in cross section. A lower layer (6a) may have a reverse tapered shape and/or a side surface insulating film (9) may have a greater thickness on sides of a higher layer (6b) than on a lower layer (6a).
    • 15. 发明专利
    • DE69915158T2
    • 2005-04-07
    • DE69915158
    • 1999-04-22
    • ELPIDA MEMORY INC
    • NOBUTOKI TOMOKOMINE KOUJI
    • G11C11/41G11C5/02G11C5/06G11C8/10G11C11/401H01L27/10G11C8/00
    • It is an object of the invention to provide a semiconductor memory device with a reduced access time by devising a layout of a circuit without elaborate modification. A Y address buffer is situated on the side of an address pad array (the right side), and outputs a signal for controlling Y address decoder situated on the right side and a circuit block communicated therewith. The Y address decoders on the right side control the Y addresses of memory cells in the memory cell arrays C and D in case that data are read therefrom or written thereinto. The circuit block communicated with the Y address buffer outputs a signal to the address decoders on the side of a DQ pad array (the left side) in accordance with the signal inputted from the Y address buffer. The Y address decoders on the left side control the Y addresses of the memory cells in the memory cell arrays A and B in accordance with the signal inputted from the circuit block communicated with the Y address buffer. Data amplifiers combined with the memory cell arrays A, B, C and d respectively amplify the data read from the memory cells in the memory cell arrays A, B, C and D. The circuit blocks situated on both the side ends of a semiconductor chip respectively output activation signals for activating the data amplifiers combined with the memory cell arrays A, B, C and D. The data amplifier-activation signals outputted from the circuit blocks on the left side end are respectively inputted to the delay circuits DL1 and DL2.