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11. 发明授权

US07203564B2 Treatment condition decision method, treatment condition decision system, treatment system, treatment condition decision calculator program, program recording medium, and semiconductor device manufacturing method 有权
标题翻译：治疗条件决定方法，治疗条件决定系统，治疗系统，治疗条件决定计算器程序，程序记录介质和半导体器件制造方法
公开(公告)号：US07203564B2
公开(公告)日：2007-04-10
申请号：US10924201
申请日：2004-08-24
申请人： Tatsuya Senga , Yoshijiro Ushio
发明人： Tatsuya Senga , Yoshijiro Ushio
IPC分类号： G06F19/00
CPC分类号： B24B37/042 , B24B49/00 , H01L21/31053 , H01L21/3212 , H01L21/76819 , H01L21/7684
摘要： In step S11, quantities that are varied (parameters) are respectively varied in a stepwise manner at a specified pitch, and standard working conditions consisting of combinations of these parameters are determined. For all of the standard working conditions, a working is actually performed, and the treated shapes that are obtained as a result are taken as the standard treated shapes for the respective standard working conditions (step S12). In cases where an appropriate simulation program is available, the standard treated shapes may be determined by simulation without actually performing a working. The standard working conditions and standard treated shapes thus determined are stored in a memory device. When the desired shape that is to be obtained by working is given in step S13, a standard treated shape that is close to the desired shape is sought in step S14. Thus, when a treated shape is given, the working conditions for this treated shape can be determined.
摘要翻译：在步骤S11中，变化量（参数）分别以指定的间距逐步地变化，并且确定由这些参数的组合组成的标准工作条件。对于所有标准工作条件，实际执行工作，并将作为结果获得的处理形状作为相应标准工作条件的标准处理形状（步骤S12）。在适当的仿真程序可用的情况下，标准处理的形状可以通过仿真来确定，而不实际执行工作。由此确定的标准工作条件和标准处理形状被存储在存储装置中。当在步骤S13中给出期望的通过加工获得的形状时，在步骤S14中寻求接近所需形状的标准处理形状。因此，当给出处理形状时，可以确定该处理形状的工作条件。

12. 发明申请

US20050176348A1 Treatment condition decision method, treatment condition decision system, treatment system, treatment condition decision calculator program, program recording medium, and semiconductor device manufacturing method 有权
标题翻译：治疗条件决定方法，治疗条件决定系统，治疗系统，治疗条件决定计算器程序，程序记录介质和半导体器件制造方法
公开(公告)号：US20050176348A1
公开(公告)日：2005-08-11
申请号：US10924201
申请日：2004-08-24
申请人： Tatsuya Senga , Yoshijiro Ushio
发明人： Tatsuya Senga , Yoshijiro Ushio
IPC分类号： B24B37/04 , B24B49/00 , H01L21/3105 , H01L21/321 , H01L21/768
CPC分类号： B24B37/042 , B24B49/00 , H01L21/31053 , H01L21/3212 , H01L21/76819 , H01L21/7684
摘要： In step S11, quantities that are varied (parameters) are respectively varied in a stepwise manner at a specified pitch, and standard working conditions consisting of combinations of these parameters are determined. For all of the standard working conditions, a working is actually performed, and the treated shapes that are obtained as a result are taken as the standard treated shapes for the respective standard working conditions (step S12). In cases where an appropriate simulation program is available, the standard treated shapes may be determined by simulation without actually performing a working. The standard working conditions and standard treated shapes thus determined are stored in a memory device. When the desired shape that is to be obtained by working is given in step S13, a standard treated shape that is close to the desired shape is sought in step S14. Thus, when a treated shape is given, the working conditions for this treated shape can be determined.
摘要翻译：在步骤S11中，分别以规定间距逐步地改变（参数）的量，并且确定由这些参数的组合组成的标准工作条件。对于所有标准工作条件，实际执行工作，并将作为结果获得的处理形状作为相应标准工作条件的标准处理形状（步骤S12）。在适当的仿真程序可用的情况下，标准处理的形状可以通过仿真来确定，而不实际执行工作。由此确定的标准工作条件和标准处理形状被存储在存储装置中。当在步骤S13中给出期望的通过加工获得的形状时，在步骤S14中寻求接近所需形状的标准处理形状。因此，当给出处理形状时，可以确定该处理形状的工作条件。

13. 发明授权

US06458014B1 Polishing body, polishing apparatus, polishing apparatus adjustment method, polished film thickness or polishing endpoint measurement method, and semiconductor device manufacturing method 失效
标题翻译：抛光体，抛光装置，抛光装置调整方法，抛光膜厚度或抛光终点测量方法以及半导体器件制造方法
公开(公告)号：US06458014B1
公开(公告)日：2002-10-01
申请号：US09846339
申请日：2001-05-02
申请人： Akira Ihsikawa , Tatsuya Senga , Akira Miyaji , Yoshijiro Ushio
发明人： Akira Ihsikawa , Tatsuya Senga , Akira Miyaji , Yoshijiro Ushio
IPC分类号： B24B4900
CPC分类号： B24B37/205 , B24B37/013 , B24B49/04 , B24B49/12
摘要： After a hole is formed in a polishing pad, a transparent window plate is inserted into the hole. Here, a gap is left between the upper surface of the transparent window plate and the outermost surface constituting the working surface of the polishing pad. During polishing, the polishing head holding the wafer applies a load to the polishing pad by means of a load-applying mechanism, so that the polishing pad and transparent window plate are compressed. In this case, the system is arranged so that the gap remains constant, and so that a dimension equal to or greater than a standard value is maintained. Since the upper surface of the transparent window plate is recessed from the upper surface of the polishing pad, there is no scratching of the surface of the transparent window plate during dressing. Accordingly, the polishing pad has a long useful life.
摘要翻译：在抛光垫中形成孔之后，将透明窗板插入孔中。这里，在透明窗板的上表面和构成抛光垫的工作面的最外表面之间留有间隙。在抛光期间，保持晶片的研磨头通过负载施加机构向抛光垫施加负载，使得抛光垫和透明窗板被压缩。在这种情况下，系统被布置成使得间隙保持恒定，并且维持等于或大于标准值的尺寸。由于透明窗板的上表面从抛光垫的上表面凹陷，因此在修整期间不会刮擦透明窗板的表面。因此，抛光垫的使用寿命长。

14. 发明授权

US08675048B2 Image processing apparatus, image processing method, recording method, and recording medium 有权
标题翻译：图像处理装置，图像处理方法，记录方法和记录介质
公开(公告)号：US08675048B2
公开(公告)日：2014-03-18
申请号：US13187493
申请日：2011-07-20
申请人： Yoshijiro Ushio , Yutaka Ichihara
发明人： Yoshijiro Ushio , Yutaka Ichihara
IPC分类号： G06T15/00
CPC分类号： H04N13/261 , G02B27/2221
摘要： Provided is an image processing apparatus that stereoscopically displays a two-dimensional image, comprising a generating section that generates a left-side image and a right-side image by shifting the two-dimensional image left and right in a display region; and an output section that outputs the left-side image to a left eye of the user and the right-side image to a right eye of the user. The generating section generates the left-side image and the right-side image by shifting the two-dimensional image to the left and right within the display region by a distance no greater than a distance between pupils of a user.
摘要翻译：提供一种立体显示二维图像的图像处理装置，包括通过在显示区域中左右移动二维图像来生成左侧图像和右侧图像的生成部分; 以及输出部，其向用户的左眼输出左侧图像，将右侧图像右眼图像输出到用户的右眼。生成部通过将二维图像在显示区域内左右移动距离不大于用户的瞳孔之间的距离来生成左侧图像和右侧图像。

15. 发明授权

US6108096A Light absorption measurement apparatus and methods 失效
标题翻译：光吸收测量装置及方法
公开(公告)号：US6108096A
公开(公告)日：2000-08-22
申请号：US217332
申请日：1998-12-21
申请人： Yoshijiro Ushio , Toru Nakamura , Sumito Shimizu , Tetsuya Oshino
发明人： Yoshijiro Ushio , Toru Nakamura , Sumito Shimizu , Tetsuya Oshino
IPC分类号： G01N21/17 , G01N21/00
CPC分类号： G01N21/1702
摘要： Apparatus and methods are disclosed for measuring changes in light absorption of a sample optical component. The sample is held in a sample holder in a sample chamber during irradiation by an intense light, usually pulsatile light. Molecules of a gas are introduced into the sample chamber as the sample is irradiated. The molecules can be of a material suspected to become adhered to or absorbed by the sample in a way that causes an undesired change in light absorption by the sample. Changes in light absorption by the sample are preferably measured photoacoustically. The molecules of the gas can be generated by controlled irradiation of a "source material" with a light (which can be the same as used to irradiate the sample) sufficient to generate such molecules of gas from the source material, and routing the gaseous molecules to the sample as the sample is irradiated.
摘要翻译：公开了用于测量样品光学部件的光吸收变化的装置和方法。通过强光（通常是脉冲光）照射期间，将样品保持在样品室中的样品架中。当照射样品时，将气体的分子引入样品室。分子可以是怀疑被粘附或被样品吸收的材料，以导致样品的光吸收的不希望的变化的方式。样品的光吸收变化优选是光声测量的。气体的分子可以通过用能够从源材料产生这样的气体分子的光（其可以与用于照射样品的光相同）的受控照射“源材料”来产生，并且将气态分子随着样品的照射而进入样品。

16. 发明授权

US6102775A Film inspection method 失效
标题翻译：电影检查方式
公开(公告)号：US6102775A
公开(公告)日：2000-08-15
申请号：US62636
申请日：1998-04-20
申请人： Yoshijiro Ushio , Motoo Koyama
发明人： Yoshijiro Ushio , Motoo Koyama
IPC分类号： B24B37/013 , B24B49/04 , B24B49/12
CPC分类号： B24B49/12 , B24B37/013 , B24B49/04
摘要： In the polishing apparatus and film inspection method, a polishing apparatus for polishing an object causes a relative movement between a polishing body and the polishing object. A polishing agent is then interposed between the polishing body and the polishing object. The polishing apparatus includes an optical measuring system capable of measuring at least one of a polished surface state of the polishing object or a film thickness of the polishing object and a position detection system capable of detecting relative positions of the optical measuring system and the polishing object. A control system is also included, and is capable of controlling at least one of the optical measuring system or the polishing object in accordance with position detection system signals so that prescribed endpoint detection regions of the polishing object are measured by the optical measuring system. A film thickness inspection method optically detects the film thickness of the outermost layer on a semiconductor substrate on which desired wiring patterns are formed in predetermined chip regions by laminating a plurality of layers. The film thickness inspection method includes selecting regions other than the chip regions on the semiconductor substrate, and the film thickness is optically detected by illuminating these regions with light.
摘要翻译：在抛光装置和膜检查方法中，用于抛光物体的抛光装置引起研磨体和抛光对象之间的相对移动。然后将抛光剂插入在抛光体和抛光对象之间。抛光装置包括能够测量抛光对象的抛光表面状态或抛光对象的膜厚度中的至少一个的光学测量系统以及能够检测光学测量系统和抛光对象的相对位置的位置检测系统。还包括控制系统，并且能够根据位置检测系统信号来控制光学测量系统或抛光对象中的至少一个，使得通过光学测量系统测量抛光对象的规定的端点检测区域。薄膜厚度检查方法通过层叠多层光学地检测在预定的芯片区域中形成了所需布线图案的半导体基板上的最外层的膜厚度。膜厚检查方法包括选择半导体衬底上的芯片区域以外的区域，通过用光照亮这些区域来光学检测膜厚度。

17. 发明授权

US5641597A Circuit forming method and apparatus therefor 失效
标题翻译：电路形成方法及其装置
公开(公告)号：US5641597A
公开(公告)日：1997-06-24
申请号：US524478
申请日：1995-09-07
申请人： Yoshijiro Ushio , Tatsuo Niwa
发明人： Yoshijiro Ushio , Tatsuo Niwa
IPC分类号： G03G15/10 , G03G15/16 , G03G15/22 , H05K3/02 , H05K3/06 , G03G15/14 , G03G13/22
CPC分类号： G03G15/1625 , H05K3/065
摘要： A circuit forming method having the step of forming, on an insulating board or a metallic foil layer, a resist pattern layer for patterning the metallic foil layer to be laminated to the board with a predetermined circuit by means of etching or lift-off, wherein the resist pattern layer forming step comprises the steps of forming an electric field distribution latent image corresponding to the circuit pattern by illuminating a predetermined area on a surface of a photoconductor charged beforehand with light for removing the charge of the surface of the photoconductor, forming a resist image corresponding to the circuit pattern by attaching a resist member charged reversely with respect to the latent image to the latent image, and transferring the resist image to the board or the metallic foil layer as the resist pattern layer.
摘要翻译：一种电路形成方法，具有在绝缘板或金属箔层上形成用于通过蚀刻或剥离以预定电路将要层压到所述基板上的金属箔层图案化的抗蚀剂图案层的步骤，其中抗蚀剂图案层形成步骤包括以下步骤：通过照射预先充电的感光体的表面上的预定区域来形成与电路图案相对应的电场分布潜像，以除去感光体的表面的电荷，形成通过将相对于潜像反向充电的抗蚀剂部件附着到潜像上，并将抗蚀剂图像转印到作为抗蚀剂图案层的基板或金属箔层上来抵抗与电路图案相对应的图像。

18. 发明授权

US5148306A Electrochromic device with specific resistances 失效
标题翻译：具有特殊电阻的电致发光器件
公开(公告)号：US5148306A
公开(公告)日：1992-09-15
申请号：US798368
申请日：1991-11-21
申请人： Masayuki Yamada , Yoshijiro Ushio
发明人： Masayuki Yamada , Yoshijiro Ushio
IPC分类号： G02F1/153 , G02F1/155 , G02F1/163
CPC分类号： G02F1/155 , G02F1/1533 , G02F1/163
摘要： An electrochromic device comprises a first electrode layer, an intermediate layer including an electrochromic layer, a second electrode layer, the first electrode layer, intermediate layer and second electrode layer being laminated in succession, and an electrode member connected to one of the first and second electrode layers and extending in a predetermined direction perpendicular to the direction of lamination of the first electrode layer, intermediate layer and second electrode layer. The resistances R.sub.1, R.sub.2 respectively of the first and second electrode layers and the internal resistance R.sub.3 of the intermediate layer satisfy predetermined conditions to achieve uniform coloration.

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