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    • 17. 发明授权
    • Method for manufacturing a semiconductor device
    • 半导体器件的制造方法
    • US08017518B2
    • 2011-09-13
    • US12341495
    • 2008-12-22
    • Yasunori MorinagaHideo Nakagawa
    • Yasunori MorinagaHideo Nakagawa
    • H01L21/00
    • H01L21/76814H01L21/02063H01L21/3105H01L21/76825H01L21/76826H01L21/76831
    • A method for manufacturing a semiconductor device includes the steps of: (a) forming a low dielectric constant film over a semiconductor substrate; (b) forming a recess in the low dielectric constant film; (c) after the step (b), sequentially performing the steps of (c1) applying an organic solution to the low dielectric constant film and (c2) silylating the low dielectric constant film with a silylating solution; and (d) after the step (c), embedding a metal in the recess to form at least one of a via plug and a metal wiring in the low dielectric constant film. Performing the step (c1) before the step (c2) improves a penetration property of the silylating solution into the low dielectric constant film.
    • 一种制造半导体器件的方法包括以下步骤:(a)在半导体衬底上形成低介电常数膜; (b)在低介电常数膜中形成凹部; (c)在步骤(b)之后,顺序地执行步骤(c1)将有机溶液施加到低介电常数膜上,和(c2)用甲硅烷基化溶液甲硅烷基化低介电常数膜; 和(d)在步骤(c)之后,将金属嵌入凹槽中以在低介电常数膜中形成通孔塞和金属布线中的至少一个。 在步骤(c2)之前执行步骤(c1)改善了甲硅烷基化溶液渗透到低介电常数膜中的渗透性。