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    • 11. 发明授权
    • Sputter ion pump
    • 溅射离子泵
    • US07819633B2
    • 2010-10-26
    • US11478421
    • 2006-06-28
    • Li QianJie TangLiang LiuJing QiPi-Jin ChenZhao-Fu HuShou-Shan Fan
    • Li QianJie TangLiang LiuJing QiPi-Jin ChenZhao-Fu HuShou-Shan Fan
    • F04B37/02
    • F04B37/02F04B37/14H01J41/20
    • A sputter ion pump includes one vacuum chamber, two parallel anode poles and one cold cathode electron emitter. The vacuum chamber includes at least one aperture located in an outer wall thereof. The two parallel anode poles are positioned in the vacuum chamber and arranged in a symmetrical configuration about a center axis of the vacuum chamber. The cold cathode electron emission device is located on or proximate the outer wall of the vacuum chamber and faces a corresponding aperture. The cold cathode electron emission device is thus configured for injecting electrons through the corresponding aperture and into the vacuum chamber. The sputter ion pump produces a saddle-shaped electrostatic field and is free of a magnetic field. The sputter ion pump has a simplified structure and a low power consumption.
    • 溅射离子泵包括一个真空室,两个平行的阳极和一个冷阴极电子发射器。 真空室包括位于其外壁中的至少一个孔。 两个平行的阳极极位于真空室中,并以关于真空室的中心轴线的对称构型布置。 冷阴极电子发射装置位于真空室的外壁上或靠近真空室的外壁并面对相应的孔。 因此,冷阴极电子发射器件被配置用于通过相应的孔注入电子并进入真空室。 溅射离子泵产生鞍形静电场并且没有磁场。 溅射离子泵具有简化的结构和低功耗。
    • 12. 发明授权
    • Ion generator
    • 离子发生器
    • US07442941B2
    • 2008-10-28
    • US11460610
    • 2006-07-27
    • Li QianJing QiJie TangLiang LiuZhao-Fu HuPi-Jin ChenShou-Shan Fan
    • Li QianJing QiJie TangLiang LiuZhao-Fu HuPi-Jin ChenShou-Shan Fan
    • H01J27/02H01J37/08G21K1/02
    • H01J27/04
    • An ion generator (10) generally includes: a shielding shell (11), a cathode device (16), and an annular anode (14). The shielding shell has a first end (113), an opposite second end (115) and a main body (111) therebetween. The first end has an electron-input hole (13). The second end has an ion-output hole (15). The main body has a gas inlet (170) for introducing an ionizable gas (170). The cathode device faces the electron-input hole for emitting electrons to enter the shielding shell so as to ionize the ionizable gas thereby generating ions. The cathode device includes a conductive base (160) and at least one field emitter (161) thereon. The annular anode is arranged in the shielding shell. The anode is aligned with the ion-output hole.
    • 离子发生器(10)通常包括:屏蔽壳(11),阴极装置(16)和环形阳极(14)。 屏蔽壳具有第一端(113),相对的第二端(115)和它们之间的主体(111)。 第一端具有电子输入孔(13)。 第二端具有离子输出孔(15)。 主体具有用于引入可电离气体(170)的气体入口(170)。 阴极器件面向用于发射电子的电子输入孔进入屏蔽壳,从而电离可电离气体,从而产生离子。 阴极器件包括导电基底(160)和至少一个场致发射体(161)。 环形阳极布置在屏蔽壳体中。 阳极与离子输出孔对准。
    • 13. 发明申请
    • ION GENERATOR
    • 离子发生器
    • US20070114475A1
    • 2007-05-24
    • US11460610
    • 2006-07-27
    • Li QianJing QiJie TangLiang LiuZhao-Fu HuPi-Jin ChenShou-Shan Fan
    • Li QianJing QiJie TangLiang LiuZhao-Fu HuPi-Jin ChenShou-Shan Fan
    • G21F3/00
    • H01J27/04
    • An ion generator (10) generally includes: a shielding shell (11), a cathode device (16), and an annular anode (14). The shielding shell has a first end (113), an opposite second end (115) and a main body (111) therebetween. The first end has an electron-input hole (13). The second end has an ion-output hole (15). The main body has a gas inlet (170) for introducing an ionizable gas (170). The cathode device faces the electron-input hole for emitting electrons to enter the shielding shell so as to ionize the ionizable gas thereby generating ions. The cathode device includes a conductive base (160) and at least one field emitter (161) thereon. The annular anode is arranged in the shielding shell. The anode is aligned with the ion-output hole.
    • 离子发生器(10)通常包括:屏蔽壳(11),阴极装置(16)和环形阳极(14)。 屏蔽壳具有第一端(113),相对的第二端(115)和它们之间的主体(111)。 第一端具有电子输入孔(13)。 第二端具有离子输出孔(15)。 主体具有用于引入可电离气体(170)的气体入口(170)。 阴极器件面向用于发射电子的电子输入孔进入屏蔽壳,从而电离可电离气体,从而产生离子。 阴极器件包括导电基底(160)和至少一个场致发射体(161)。 环形阳极布置在屏蔽壳体中。 阳极与离子输出孔对准。
    • 14. 发明授权
    • Reference leak
    • 参考泄漏
    • US07353687B2
    • 2008-04-08
    • US11228821
    • 2005-09-16
    • Jie TangLiang LiuPeng LiuZhao-Fu HuBing-Chu DuCai-Lin GuoPi-Jin ChenShou-Shan Fan
    • Jie TangLiang LiuPeng LiuZhao-Fu HuBing-Chu DuCai-Lin GuoPi-Jin ChenShou-Shan Fan
    • G01F25/00
    • G01M3/007
    • A reference leak includes a leak layer formed of one of a metallic material, a glass material, and a ceramic material. The metallic material is selected from the group consisting of copper, nickel, and molybdenum. The leak layer comprises a number of substantially parallel leak through holes defined therein. The leak through holes may be cylindrical holes or polyhedrical holes. A length of each of the leak through holes is preferably not less than 20 times a diameter thereof. A diameter of each of the leak through holes is generally in the range from 10 nm to 500 nm. A length of each of the leak through holes is generally in the range from 100 nm to 100 μm. A leak rate of the reference leak is in the range from 10−8 to 10−15 tor×l/s. The leak through holes have substantially same length and diameter.
    • 参考泄漏包括由金属材料,玻璃材料和陶瓷材料之一形成的泄漏层。 金属材料选自铜,镍和钼。 泄漏层包括限定在其中的多个基本上平行的泄漏通孔。 泄漏孔可以是圆柱形孔或多面孔。 每个泄漏通孔的长度优选不小于其直径的20倍。 每个泄漏通孔的直径通常在10nm至500nm的范围内。 每个泄漏通孔的长度通常在100nm至100μm的范围内。 参考泄漏的泄漏率在10 -8至10 -15 torxl / s的范围内。 泄漏孔具有基本相同的长度和直径。
    • 15. 发明授权
    • Field emission device and field emission display employing the same
    • 场致发射器件和采用其的场致发射显示器
    • US07714493B2
    • 2010-05-11
    • US11438022
    • 2006-05-19
    • Bing-chu DuJie TangCai-lin GuoLiang LiuZhao-fu HuPi-jin ChenShou-shan Fan
    • Bing-chu DuJie TangCai-lin GuoLiang LiuZhao-fu HuPi-jin ChenShou-shan Fan
    • H01J9/02H01J1/02
    • H01J3/022H01J31/127
    • A field emission device (6), in accordance with a preferred embodiment, includes a cathode electrode (61), a gate electrode (64), a separator (62), and a number of emissive units (63) composed of an emissive material. The separator includes an insulating portion (621) and a number of conductive portions (622). The insulating portion of the separator is configured between the cathode electrode and the gate electrode for insulating the cathode electrode from the gate electrode. The emissive units are configured on the separator at positions proximate to two sides of the gate electrode. The emissive units are in connection with the cathode electrode via the conductive portions respectively. The emissive units are distributed on the separator adjacent to two sides of the gate electrode, which promotes an ability of emitting electrons from the emissive material and the emitted electrons to be guided by the gate electrode toward a smaller spot they bombard.
    • 根据优选实施例的场致发射器件(6)包括阴极电极(61),栅极电极(64),隔膜(62)和由发射材料构成的多个发射单元(63) 。 分离器包括绝缘部分(621)和多个导电部分(622)。 隔板的绝缘部分配置在阴极电极和栅电极之间,用于将阴极电极与栅电极绝缘。 发射单元被配置在分离器上靠近栅电极两侧的位置处。 发射单元分别经由导电部分与阴极连接。 发射单元分布在邻近栅电极的两侧的分离器上,这促进了从发射材料发射电子的能力,并且发射的电子被栅电极引导到他们轰击的较小的位置。
    • 19. 发明申请
    • Reference leak
    • 参考泄漏
    • US20060144120A1
    • 2006-07-06
    • US11228821
    • 2005-09-16
    • Jie TangLiang LiuPeng LiuZhao-Fu HuBing-Chu DuCai-Lin GuoPi-Jin ChenShou-Shan Fan
    • Jie TangLiang LiuPeng LiuZhao-Fu HuBing-Chu DuCai-Lin GuoPi-Jin ChenShou-Shan Fan
    • G01F25/00
    • G01M3/007
    • A reference leak includes a leak layer formed of one of a metallic material, a glass material, and a ceramic material. The metallic material is selected from the group consisting of copper, nickel, and molybdenum. The leak layer comprises a number of substantially parallel leak through holes defined therein. The leak through holes may be cylindrical holes or polyhedrical holes. A length of each of the leak through holes is preferably not less than 20 times a diameter thereof. A diameter of each of the leak through holes is generally in the range from 10 nm to 500 nm. A length of each of the leak through holes is generally in the range from 100 nm to 100 μm. A leak rate of the reference leak is in the range from 10−8 to 10−15 tor×l/s. The leak through holes have substantially same length and diameter.
    • 参考泄漏包括由金属材料,玻璃材料和陶瓷材料之一形成的泄漏层。 金属材料选自铜,镍和钼。 泄漏层包括限定在其中的多个基本上平行的泄漏通孔。 泄漏孔可以是圆柱形孔或多面孔。 每个泄漏通孔的长度优选不小于其直径的20倍。 每个泄漏通孔的直径通常在10nm至500nm的范围内。 每个泄漏通孔的长度通常在100nm至100μm的范围内。 参考泄漏的泄漏率在10 -8至10 -15 torxl / s的范围内。 泄漏孔具有基本相同的长度和直径。