会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 13. 发明授权
    • Sputtering system
    • 溅射系统
    • US08382966B2
    • 2013-02-26
    • US12825285
    • 2010-06-28
    • Seung-Ho ChoiSuk-Won JungYoung-Mook ChoiHyun-Keun Song
    • Seung-Ho ChoiSuk-Won JungYoung-Mook ChoiHyun-Keun Song
    • C23C14/35
    • C23C14/352H01J37/32449H01J37/3405H01J37/3417H01J37/345H01J37/347
    • A sputtering system is disclosed. The sputtering system includes: a first sputter unit including: a first deposition material plate, a second deposition material plate, where the first and second deposition material plates face each other, and a first magnetic field generator disposed behind each of the first deposition material plate and the second deposition material plate, configured to generate a magnetic field, a second sputter unit including: a third deposition material plate, disposed next to the first deposition material plate, a fourth deposition material plate, disposed next to the second deposition plate, where the third and fourth deposition material plates face each other, and a second magnetic field generator disposed behind each of the third deposition material plate and the fourth deposition material plate, configured to generate a magnetic field, a first gas supply pipe disposed between the first and third deposition material plates, configured to discharge gas to the second and fourth deposition material plates, a second gas supply pipe disposed between the second fourth deposition material plates, configured to discharge gas to the first and third deposition material plates, a first substrate support unit, configured to support a first deposition substrate, oriented toward outer edges of the first and second deposition material plates, and a second substrate support unit, configured to support a second deposition substrate, oriented toward outer edges of the third and fourth deposition material plates.
    • 公开了溅射系统。 溅射系统包括:第一溅射单元,包括:第一沉积材料板,第二沉积材料板,其中第一和第二沉积材料板彼此面对;以及第一磁场发生器,其布置在每个第一沉积材料板的后面 和第二沉积材料板,被配置为产生磁场;第二溅射单元,包括:第三沉积材料板,设置在第一沉积材料板旁边;第四沉积材料板,设置在第二沉积板旁边,其中 所述第三和第四沉积材料板彼此面对;以及第二磁场发生器,设置在每个所述第三沉积材料板和所述第四沉积材料板的后面,被配置为产生磁场;第一气体供给管,设置在所述第一和第二沉积材料板之间, 第三沉积材料板,被配置为将气体排放到第二和第四沉积物 第二气体供给管,设置在第二第四沉积材料板之间,被配置为将气体排放到第一和第三沉积材料板;第一基板支撑单元,被配置为支撑第一沉积基板, 第一和第二沉积材料板和第二衬底支撑单元,其被配置为支撑朝向第三和第四沉积材料板的外边缘定向的第二沉积衬底。