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11. 发明授权

US07195364B2 Backlight apparatus reduced in thickness 失效
标题翻译：背光装置的厚度减小
公开(公告)号：US07195364B2
公开(公告)日：2007-03-27
申请号：US11059406
申请日：2005-02-17
申请人： Hun Joo Hahm , Hyung Suk Kim , Jung Kyu Park , Ho Sik Anh , Young Sam Park , Bum Jin Kim , Young June Jeong
发明人： Hun Joo Hahm , Hyung Suk Kim , Jung Kyu Park , Ho Sik Anh , Young Sam Park , Bum Jin Kim , Young June Jeong
IPC分类号： G01D11/28
CPC分类号： G02B6/0068 , G02B6/0016 , G02B6/0043 , G02F1/133603
摘要： In a backlight apparatus for an LCD, a plurality of bar-shaped first LED light sources are arranged on the reflective plate to laterally emit light. A plurality of light shades are arranged above the first light sources. A transparent plate is placed above the light shades. Scattering patterns are formed in the bottom of the transparent plate in positions corresponding to the light shades. A bar-shaped second LED light source is arranged at a side of the transparent plate to emit light into the transparent plate. The light source arranged at the side of the transparent plate prevents the formation of dark areas as a problem in the prior art, thereby enhancing the entire uniformity of light. Then, the backlight apparatus can be maintained thin even when applied to a large-sized LCD.
摘要翻译：在用于LCD的背光装置中，多个条形的第一LED光源被布置在反射板上以横向发光。多个浅色调布置在第一光源的上方。透明板放置在浅色调之上。散射图案形成在透明板底部的对应于浅色调的位置上。在透明板的一侧设置条状的第二LED光源，以将光发射到透明板中。布置在透明板一侧的光源防止了现有技术中的黑色区域的形成，从而增强了光的整体均匀性。然后，即使应用于大型LCD也能够使背光装置保持薄型化。

12. 发明授权

US07176503B2 Light emitting diode package and light source comprising the same 失效
标题翻译：发光二极管封装和包含该发光二极管封装的光源
公开(公告)号：US07176503B2
公开(公告)日：2007-02-13
申请号：US10967212
申请日：2004-10-19
申请人： Hyung Suk Kim , Young Sam Park , Hun Joo Hahm , Jung Kyu Park , Young June Jeong
发明人： Hyung Suk Kim , Young Sam Park , Hun Joo Hahm , Jung Kyu Park , Young June Jeong
IPC分类号： H01L29/24 , H01L31/12
CPC分类号： H01L25/0753 , H01L2924/0002 , H01L2924/00
摘要： An LED package comprises a substrate, one or three terminals formed on a first side of the substrate, three terminals formed on a second side opposite to the first side, and two or three LEDs disposed on the substrate, one of the LEDS being electrically connected to one of the terminals formed on the first side while being electrically connected to one of the terminals formed on the second side, and other LEDS being electrically connected to two terminals formed on the first side or to two terminals formed on the second side. A light source comprises the LED packages having the structure as described above. Without being arranged in a line, the LEDs emitting the same color are differently arranged in every LED package, thereby solving the problem of non-uniform combination of the colors according to the positions of the LEDs on an LED package-mounting substrate.
摘要翻译： LED封装包括基板，形成在基板的第一侧上的一个或三个端子，形成在与第一侧相对的第二侧上的三个端子和设置在基板上的两个或三个LED，其中一个LED电连接连接到形成在第一侧上的端子中的一个端子，同时电连接到形成在第二侧上的端子之一，并且其它LEDS电连接到形成在第一侧上的两个端子或形成在第二侧上的两个端子。光源包括具有如上所述结构的LED封装。不排列成一行，发光相同颜色的LED在每个LED封装中被不同地排列，从而解决了根据LED封装安装基板上LED的位置的颜色不均匀组合的问题。

13. 发明授权

US07473937B2 Side-emission type LED package 有权
标题翻译：侧面发射型LED封装
公开(公告)号：US07473937B2
公开(公告)日：2009-01-06
申请号：US11318837
申请日：2005-12-28
申请人： Young Sam Park , Hyung Suk Kim , Jung Kyu Park , Ho Sik Ahn , Young June Jeong , Hun Joo Hahm , Bum Jin Kim
发明人： Young Sam Park , Hyung Suk Kim , Jung Kyu Park , Ho Sik Ahn , Young June Jeong , Hun Joo Hahm , Bum Jin Kim
IPC分类号： H01L29/22
CPC分类号： H01L33/60 , F21K9/68 , H01L33/54
摘要： A side-emission type LED package is provided. The LED package includes an LED chip, a lower structure, and an upper structure. The lower structure has a lower mirror and a transparent sealing member. The lower structure supports the LED chip. The lower mirror is extended upward and outward@ from the LED chip so as to reflect light from the LED chip upward. The transparent sealing member is formed around the LED chip inside the lower mirror. The upper structure is combined to an upper portion of the lower structure so as to reflect the light reflected upward by the lower structure to a radial lateral direction. As described above, the lower structure and the upper structure are separately provided and combined with each other, whereby molding efficiency of the sealing member is improved and the side-emission type LED package can be manufactured in an easy manner.
摘要翻译：提供了侧面发射型LED封装。 LED封装包括LED芯片，下部结构和上部结构。下部结构具有下反射镜和透明密封构件。下部结构支持LED芯片。下镜从LED芯片向上和向外延伸，从而将来自LED芯片的光线向上反射。透明密封件形成在下反射镜内部的LED芯片周围。上部结构组合到下部结构的上部，以将由下部结构向上反射的光反射到径向横向方向。如上所述，下部结构和上部结构彼此分开设置并组合，从而提高了密封构件的模制效率，并且可以容易地制造侧面发射型LED封装。

14. 发明授权

US07097337B2 Vertical light emitting type backlight module 失效
标题翻译：垂直发光型背光模组
公开(公告)号：US07097337B2
公开(公告)日：2006-08-29
申请号：US10917383
申请日：2004-08-13
申请人： Hyung Suk Kim , Young Sam Park , Hun Joo Hahm , Jung Kyu Park , Young June Jeong
发明人： Hyung Suk Kim , Young Sam Park , Hun Joo Hahm , Jung Kyu Park , Young June Jeong
IPC分类号： F21V8/00
CPC分类号： G02F1/133603 , F21K9/00 , F21Y2105/10 , F21Y2115/10
摘要： Disclosed herein is a vertical light emitting type backlight module, for irradiating white light to the rear side of a liquid crystal display in the perpendicular direction. The vertical light emitting type backlight module comprises a) one or more LED array modules, each comprising a substrate having conductive patterns printed on upper and lower surfaces of the substrate, respectively, a plurality of LED devices mounted on the upper and lower surfaces of the substrate, respectively, for emitting light toward the front of respective surfaces of the substrate with the LED devices mounted thereon, and a plurality of lenses formed to surround the LED devices, respectively, for directing the light emitted from the LED devices in a direction perpendicular to the LED while being within a predetermined angle from an axis parallel to a plane of the backlight module, the substrate being mounted perpendicular to the plane of the backlight module such that the light emitted from the LED devices is emitted in a direction approximately parallel to the plane of the backlight module, and b) a reflection plate for each of the LED array modules for reflecting the light spread in the horizontal direction to change path of the light to the perpendicular direction.
摘要翻译：本文公开了一种用于在垂直方向上将白光照射到液晶显示器的后侧的垂直发光型背光模块。垂直发光型背光模块包括：a）一个或多个LED阵列模块，每个LED阵列模块分别包括印刷在基板的上表面和下表面上的导电图案的基板，安装在基板的上表面和下表面上的多个LED装置基板，分别用于在安装有LED器件的基板的各个表面的前面发射光，以及分别形成为围绕LED器件的多个透镜，用于将LED器件发出的光沿垂直方向引导在与来自平行于背光模块的平面的轴线处于预定角度内的LED上，所述基板垂直于所述背光模块的平面安装，使得从所述LED装置发射的光在大致平行于背光模块的平面，以及b）用于反射光sp的每个LED阵列模块的反射板在水平方向读取，以将光线的路径改变为垂直方向。

15. 发明授权

US06972439B1 Light emitting diode device 失效
标题翻译：发光二极管装置
公开(公告)号：US06972439B1
公开(公告)日：2005-12-06
申请号：US10916525
申请日：2004-08-12
申请人： Hyung Suk Kim , Young Sam Park , Hun Joo Hahm , Jung Kyu Park , Young June Jeong
发明人： Hyung Suk Kim , Young Sam Park , Hun Joo Hahm , Jung Kyu Park , Young June Jeong
IPC分类号： G02F1/13357 , H01L29/22 , H01L33/54 , H01L33/60
CPC分类号： H01L33/54 , H01L33/60
摘要： Disclosed herein is a light emitting diode (LED) device. The light emitting diode device comprises a package formed with a terminal for applying an electrical signal, one or more LED chips mounted on the package such that the LED chips are electrically connected to the terminal, a lens formed to surround the LED chips on the package for changing path of light emitted from the LED chips to the horizontal direction with the difference of the refraction rates of the media, and a reflector formed on the lens for reflecting the light, emitted above the lens without being refracted in the horizontal direction at the lens, to the horizontal direction. The LED device reflects the light, which is deviated from the optical design range of the lens and emitted above the lens, back to the lens, thereby preventing the hot spot from being generated, and enhancing horizontal emission efficiency of the light.
摘要翻译：这里公开了一种发光二极管（LED）装置。发光二极管装置包括形成有用于施加电信号的端子的封装，安装在封装上的一个或多个LED芯片，使得LED芯片电连接到端子，形成为围绕封装上的LED芯片的透镜用于随着介质的折射率的差异而将从LED芯片发射的光的路径改变到水平方向，以及形成在透镜上的用于反射透镜的反射器的反射器，而不是在透镜的上方沿水平方向折射镜头，水平方向。 LED装置将从透镜的光学设计范围偏离的光反射回透镜，从而防止产生热点，提高光的水平发光效率。

16. 发明申请

US20090321773A1 LED PACKAGE FRAME AND LED PACKAGE HAVING THE SAME 有权
标题翻译： LED包装框架和带有它的LED包装
公开(公告)号：US20090321773A1
公开(公告)日：2009-12-31
申请号：US12549252
申请日：2009-08-27
申请人： Young Sam PARK , Seung Ick Lee , Hun Joo Hahm , Hyung Suk Kim , Bum Jin Kim , Young June Jeong , Ho Sik Ahn , Jung Kyu Park
发明人： Young Sam PARK , Seung Ick Lee , Hun Joo Hahm , Hyung Suk Kim , Bum Jin Kim , Young June Jeong , Ho Sik Ahn , Jung Kyu Park
IPC分类号： H01L33/00
CPC分类号： H01L33/62 , H01L33/60 , H01L33/642 , H01L33/647 , H01L2224/48091 , H01L2224/48247 , H01L2924/01079 , H01L2924/12041 , H01L2924/00014
摘要： An LED package frame includes an LED chip and a heat conductive member made of high heat conductivity material. The heat conductive member has a receiving part at a lateral portion, and is mounted with the LED chip. A lead-coating assembly configured to be inserted into the receiving part of the heat conductive member, including a lead is inserted at one end into the receiving part of the heat conductive member, and electrically connected to the LED chip. An electrically insulating layer is placed in tight contact between the lead and the receiving part of the heat conductive member isolates the lead from the receiving part. With the lead inserted into the heat conductive member, it is possible to reduce size while maintaining high heat conductivity and stability.
摘要翻译： LED封装框架包括LED芯片和由高导热性材料制成的导热部件。导热构件在侧部具有接收部，并且安装有LED芯片。构造成插入到包括导线的导热构件的接收部分的引线涂层组件的一端插入导热构件的接收部分中，并且电连接到LED芯片。引线与导热部件的接收部之间紧密接触的电绝缘层使引线与接收部分隔离。通过将导线插入导热构件，可以在保持高导热性和稳定性的同时减小尺寸。

17. 发明授权

US07592631B2 LED package frame and LED package having the same 有权
标题翻译： LED封装框架和LED封装相同
公开(公告)号：US07592631B2
公开(公告)日：2009-09-22
申请号：US11319101
申请日：2005-12-28
申请人： Young Sam Park , Seung Ick Lee , Hun Joo Hahm , Hyung Suk Kim , Bum Jin Kim , Young June Jeong , Ho Sik Ahn , Jung Kyu Park
发明人： Young Sam Park , Seung Ick Lee , Hun Joo Hahm , Hyung Suk Kim , Bum Jin Kim , Young June Jeong , Ho Sik Ahn , Jung Kyu Park
IPC分类号： H01L27/15 , H01L31/12 , H01L33/00
CPC分类号： H01L33/62 , H01L33/60 , H01L33/642 , H01L33/647 , H01L2224/48091 , H01L2224/48247 , H01L2924/01079 , H01L2924/12041 , H01L2924/00014
摘要： An LED package frame includes an LED chip and a heat conductive member made of high heat conductivity material. The heat conductive member has a receiving part at a lateral portion, and is mounted with the LED chip. A lead-coating assembly configured to be inserted into the receiving part of the heat conductive member, including a lead is inserted at one end into the receiving part of the heat conductive member, and electrically connected to the LED chip. An electrically insulating layer is placed in tight contact between the lead and the receiving part of the heat conductive member isolates the lead from the receiving part. With the lead inserted into the heat conductive member, it is possible to reduce size while maintaining high heat conductivity and stability.
摘要翻译： LED封装框架包括LED芯片和由高导热性材料制成的导热部件。导热构件在侧部具有接收部，并且安装有LED芯片。构造成插入到包括导线的导热构件的接收部分的引线涂层组件的一端插入导热构件的接收部分中，并且电连接到LED芯片。引线与导热部件的接收部之间紧密接触的电绝缘层使引线与接收部分隔离。通过将导线插入导热构件，可以在保持高导热性和稳定性的同时减小尺寸。

18. 发明授权

US07385653B2 LED package and backlight assembly for LCD comprising the same 失效
标题翻译：用于LCD的LED封装和背光组件包括相同的
公开(公告)号：US07385653B2
公开(公告)日：2008-06-10
申请号：US10965257
申请日：2004-10-15
申请人： Hyung Suk Kim , Young Sam Park , Hun Joo Hahm , Jung Kyu Park , Young June Jeong
发明人： Hyung Suk Kim , Young Sam Park , Hun Joo Hahm , Jung Kyu Park , Young June Jeong
IPC分类号： G02F1/13357 , F21V7/04
CPC分类号： H01L33/54 , G02F1/133603 , H01L25/0753 , H01L2924/0002 , H01L2924/00
摘要： An LED package used as a light source in a backlight assembly for an LCD includes a substrate, a plurality of light scattering protrusions on the upper surface of the substrate, LEDs separated from each other by designated intervals and arranged in a line on the substrate, and a molding portion, for sealing the upper surface of the substrate including the LEDs, and having an upper surface including two cylindrical surface sections. Each of the cylindrical surface sections has a curvature for totally reflecting light emitted from the LEDs.
摘要翻译：在LCD背光组件中用作光源的LED封装包括：衬底，在衬底的上表面上的多个光散射突起，以指定间隔彼此分开并以衬底方式布置的LED，以及用于密封包括LED的基板的上表面并具有包括两个圆柱形表面部分的上表面的模制部分。每个圆柱形表面部分具有用于全反射从LED发射的光的曲率。

19. 发明授权

US07273291B2 Direct-illumination backlight apparatus having transparent plate acting as light guide plate 失效
标题翻译：具有用作导光板的透明板的直接照明背光装置
公开(公告)号：US07273291B2
公开(公告)日：2007-09-25
申请号：US11136529
申请日：2005-05-25
申请人： Hyung Suk Kim , Jung Kyu Park , Ho Sik Ahn , Young June Jeong , Young Sam Park , Hun Joo Hahm , Bum Jin Kim
发明人： Hyung Suk Kim , Jung Kyu Park , Ho Sik Ahn , Young June Jeong , Young Sam Park , Hun Joo Hahm , Bum Jin Kim
IPC分类号： G01D11/28
CPC分类号： G02B6/0021 , G02B6/0038 , G02B6/0041 , G02F1/133603
摘要： A direct-illumination backlight apparatus using LEDs includes a flat reflective plate, an LED light source, a transparent plate, a scattering pattern, and a light guide. The light guide serves to introduce a partial light from an LED light source at such an angle that the partial light is trapped inside the transparent plate, and the scattering pattern serves to scatter the trapped light beam at a position directly above the LED light source so that the scattered light beam escapes out of the transparent plate toward an LCD panel.
摘要翻译：使用LED的直接照明背光装置包括平面反射板，LED光源，透明板，散射图案和导光体。该光导用于从LED光源引入部分光，使得部分光被捕获在透明板的内部，散射图用于将捕获的光束分散在LED光源正上方的位置，从而散射的光束从透明板向LCD面板逸出。

20. 发明授权

US07914194B2 Backlight unit having light emititng diodes and method of manufacturing the same 有权
标题翻译：具有发光二极管的背光单元及其制造方法
公开(公告)号：US07914194B2
公开(公告)日：2011-03-29
申请号：US12071836
申请日：2008-02-27
申请人： Jung Kyu Park , Hun Joo Hahm , Chul Hee Yoo , Young June Jeong , Young Sam Park , Seong Yeon Han
发明人： Jung Kyu Park , Hun Joo Hahm , Chul Hee Yoo , Young June Jeong , Young Sam Park , Seong Yeon Han
IPC分类号： F21V7/04
CPC分类号： H05K1/053 , G02F1/133603 , G02F2001/133612 , H05K1/092 , H05K3/1216 , H05K3/125 , H05K2201/10106 , H05K2203/013
摘要： There is provided a backlight unit including: a chassis having an insulating layer formed on a top thereof; a circuit pattern formed on the insulating layer; a plurality of light emitting diodes formed on the insulating layer to electrically connect to the circuit pattern.
摘要翻译：提供了一种背光单元，包括：具有形成在其顶部上的绝缘层的底架; 形成在绝缘层上的电路图案; 多个发光二极管形成在绝缘层上以电连接到电路图案。

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