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11. 发明申请

US20110114989A1 Light-emitting device, method of manufacturing the same, method of mounting the same and lighting device 有权
标题翻译：发光装置及其制造方法，其安装方法和照明装置
公开(公告)号：US20110114989A1
公开(公告)日：2011-05-19
申请号：US12926253
申请日：2010-11-04
申请人： Yoshinobu Suehiro , Seiji Yamaguchi , Katsunori Arakane , Koji Tasumi
发明人： Yoshinobu Suehiro , Seiji Yamaguchi , Katsunori Arakane , Koji Tasumi
IPC分类号： H01L33/56 , H01L21/603
CPC分类号： H01L33/56 , H01L24/97 , H01L25/0753 , H01L33/486 , H01L33/54 , H01L2224/16225 , H01L2924/01322 , H01L2924/15747 , H01L2924/15787 , H01L2924/181 , H01L2933/005 , H01L2924/00
摘要： A method of manufacturing a light-emitting device includes a hole forming process for forming a through-hole that continues from a front surface to a back surface of a mounting substrate, a pattern forming process for continuously forming a circuit pattern on an inner surface of the through-hole in the mounting substrate, from an end portion of the through-hole on the front surface of the mounting substrate to a mounting portion of a light-emitting element, and on a periphery of the through-hole on the back surface of the mounting substrate, a mounting process for mounting the light-emitting element on the mounting portion, and a hot pressing process in that an inorganic material softened by heating is placed on the surface of the mounting substrate and is advanced into the through-hole while sealing the light-emitting element by pressing and bonding the inorganic material to the surface of the mounting substrate.
摘要翻译：一种制造发光器件的方法包括用于形成从安装基板的前表面延伸到后表面的通孔的孔形成工艺，用于在内表面上连续形成电路图案的图案形成工艺安装基板中的通孔，从安装基板的前表面上的通孔的端部到发光元件的安装部，并且在后表面上的通孔的周边的安装基板，将发光元件安装在安装部上的安装工序以及通过加热软化的无机材料配置在安装基板的表面上并进入通孔的热压工序同时通过将无机材料压入和粘合到安装基板的表面来密封发光元件。

12. 发明授权

US07825575B2 Solid-state element device and light-emitting apparatus using same 有权
标题翻译：固态元件器件和使用其的发光装置
公开(公告)号：US07825575B2
公开(公告)日：2010-11-02
申请号：US11517588
申请日：2006-09-08
申请人： Naruhito Sawanobori , Masaaki Ohtsuka , Kazuya Aida , Hiroko Sakaji , Hiroki Watanabe , Seiji Yamaguchi , Yoshinobu Suehiro , Koji Tasumi
发明人： Naruhito Sawanobori , Masaaki Ohtsuka , Kazuya Aida , Hiroko Sakaji , Hiroki Watanabe , Seiji Yamaguchi , Yoshinobu Suehiro , Koji Tasumi
IPC分类号： H05B33/00
CPC分类号： H01L33/505 , H01L25/0753 , H01L33/486 , H01L33/507 , H01L33/56 , H01L33/60 , H01L2224/16225
摘要： A solid-state element device having: a solid-state element; a power receiving/supplying portion for mounting thereto the solid-state element, and receiving/supplying a power from/to the solid-state element; and a wavelength converting portion having a phosphor layer formed inside a sealing glass having the same coefficient of thermal expansion as that of the power receiving/supplying portion for sealing the solid-state element, the phosphor layer being obtained by mixing a glass and a phosphor with each other, and melting the glass.
摘要翻译：一种具有固态元件的固态元件器件; 用于安装固体元件的电力接收/供应部分，以及从固态元件接收/供给电力的装置; 以及波长转换部分，其具有形成在具有与用于密封固态元件的受电/供应部分相同的热膨胀系数的密封玻璃内的荧光体层，所述荧光体层通过将玻璃和荧光体相互融合，融化玻璃。

13. 发明授权

US07417220B2 Solid state device and light-emitting element 有权
标题翻译：固态器件和发光元件
公开(公告)号：US07417220B2
公开(公告)日：2008-08-26
申请号：US11220405
申请日：2005-09-07
申请人： Yoshinobu Suehiro , Masayoshi Ichikawa , Satoshi Wada , Koji Tasumi
发明人： Yoshinobu Suehiro , Masayoshi Ichikawa , Satoshi Wada , Koji Tasumi
IPC分类号： H01L27/15 , H01L33/00
CPC分类号： H01L31/0203 , H01L23/3121 , H01L33/08 , H01L33/38 , H01L33/486 , H01L33/56 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/05624 , H01L2224/16 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/09701 , H01L2924/12041 , H01L2924/181 , Y10S362/80 , H01L2924/00012 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A solid-state device having: a flip-chip mounted solid-state element; a power receiving/feeding portion having a mounting substrate to allow that a mounting surface of the solid-state element forms substantially the same plane as a surface of the mounting substrate; and an inorganic sealing portion made of an inorganic sealing material having a thermal expansion coefficient equal to that of the power receiving/feeding portion for sealing the solid-state element.
摘要翻译：一种固态器件，具有：倒装芯片安装的固态元件; 电源接收/馈送部分，具有安装基板，以允许固态元件的安装表面与安装基板的表面形成大致相同的平面; 以及由无机密封材料制成的无机密封部分，该无机密封材料的热膨胀系数等于用于密封固态元件的电力接收/供给部分的热膨胀系数。

14. 发明申请

US20080032142A1 Light emitting device, method of making the same, and light source device comprising the same 审中-公开
标题翻译：发光装置及其制造方法以及包含该发光装置的光源装置
公开(公告)号：US20080032142A1
公开(公告)日：2008-02-07
申请号：US11882599
申请日：2007-08-02
申请人： Koji Tasumi , Yoshinobu Suehiro , Seiji Yamaguchi
发明人： Koji Tasumi , Yoshinobu Suehiro , Seiji Yamaguchi
IPC分类号： B32B9/04 , C09K11/70
CPC分类号： H01L33/56 , H01L33/507 , H01L33/54 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/13 , H01L2924/00014 , Y10T428/31663 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A light emitting device has a light emitting element mounted on a substrate, a glass member sealing the light emitting element, a transparent member to transmit light emitted from the light emitting device, the transparent member being positioned outside the glass member, and a powdery phosphor attached to an inner surface, an outer surface or both of the inner surface and outer surface of the transparent member.
摘要翻译：发光装置具有安装在基板上的发光元件，密封发光元件的玻璃构件，透明构件，用于透射从发光装置发射的光，透明构件位于玻璃构件外部，以及粉末状荧光体连接到透明构件的内表面，外表面或内表面和外表面两者。

15. 发明申请

US20070097692A1 Light emitting device 有权
标题翻译：发光装置
公开(公告)号：US20070097692A1
公开(公告)日：2007-05-03
申请号：US11589296
申请日：2006-10-30
申请人： Yoshinobu Suehiro , Koji Tasumi
发明人： Yoshinobu Suehiro , Koji Tasumi
IPC分类号： F21V29/00
CPC分类号： F21V29/83 , F21K9/00 , F21V29/74 , F21V29/76 , F21V29/763 , F21V29/767 , F21V29/773 , F21Y2115/10 , F28F3/02 , Y10S362/80
摘要： A light emitting device has a light source having a light emitting element; and a radiator having plural plate members formed of a thermally-conductive material. The plural plate members are stacked on each other while allowing formation of a space between each other at an end portion thereof. The light source is mounted on a side surface of the plural stacked plate members.
摘要翻译：发光器件具有光源，其具有发光元件; 以及具有由导热材料形成的多个板构件的散热器。多个板构件彼此堆叠，同时在其端部处形成彼此之间的空间。光源安装在多个堆叠板构件的侧表面上。

16. 发明授权

US08545083B2 Light-emitting device, light source and method of manufacturing the same 有权
标题翻译：发光装置，光源及其制造方法
公开(公告)号：US08545083B2
公开(公告)日：2013-10-01
申请号：US12926955
申请日：2010-12-20
申请人： Tohru Terajima , Yoshinobu Suehiro , Koji Tasumi
发明人： Tohru Terajima , Yoshinobu Suehiro , Koji Tasumi
IPC分类号： F21V7/04
CPC分类号： G02B6/0021 , G02B6/0043 , G02B6/0046 , G02B6/0061 , G02B6/0068 , G02B6/0073 , G02F1/133603 , H01L2224/16225 , H01L2224/48091 , H01L2224/48465 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
摘要： A light-emitting device includes a light source including an element mounting substrate, an LED element mounted thereon by flip-chip connection and a sealing portion for sealing the LED element on the element mounting substrate, and a light guide plate including a housing hole for housing the light source. The housing hole extends from one surface side to another surface side of the light guide plate and an area of an inner surface thereof on which light is incident from the light source is parallel to a thickness direction of the light guide plate. The light source is housed in the housing hole so that the element mounting substrate is located on the other surface side of the light guide plate, emits light toward the one surface side of the light guide plate in the housing hole and the inner surface side of the housing hole, and has an optical axis parallel to the thickness direction of the light guide plate. A solid angle of the inner surface of the housing hole with respect to the center of an upper surface of the light source is not less than 4.44 steradians.
摘要翻译：发光装置包括：光源，其包括元件安装基板，通过倒装连接安装在其上的LED元件和用于密封元件安装基板上的LED元件的密封部分;以及导光板，其包括用于容纳光源。壳体孔从导光板的一个表面侧延伸到另一个表面侧，并且其中从光源入射的光的内表面的区域平行于导光板的厚度方向。光源容纳在容纳孔中，使得元件安装基板位于导光板的另一表面侧，朝向容纳孔中的导光板的一个表面侧发射光，并且将内部表面侧壳体孔，并且具有平行于导光板的厚度方向的光轴。壳体孔的内表面相对于光源上表面的中心的立体角度不小于4.44立方厘米。

17. 发明授权

US08017967B2 Light-emitting element including a fusion-bonding portion on contact electrodes 有权
标题翻译：发光元件包括在接触电极上的熔接部分
公开(公告)号：US08017967B2
公开(公告)日：2011-09-13
申请号：US12155820
申请日：2008-06-10
申请人： Yoshinobu Suehiro , Masayoshi Ichikawa , Satoshi Wada , Koji Tasumi
发明人： Yoshinobu Suehiro , Masayoshi Ichikawa , Satoshi Wada , Koji Tasumi
IPC分类号： H01L33/00
CPC分类号： H01L31/0203 , H01L23/3121 , H01L33/08 , H01L33/38 , H01L33/486 , H01L33/56 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/05624 , H01L2224/16 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/09701 , H01L2924/12041 , H01L2924/181 , Y10S362/80 , H01L2924/00012 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A solid-state device having: a flip-chip mounted solid-state element; a power receiving/feeding portion having a mounting substrate to allow that a mounting surface of the solid-state element forms substantially the same plane as a surface of the mounting substrate; and an inorganic sealing portion made of an inorganic sealing material having a thermal expansion coefficient equal to that of the power receiving/feeding portion for sealing the solid-state element.
摘要翻译：一种固态器件，具有：倒装芯片安装的固态元件; 电源接收/馈送部分，具有安装基板，以允许固态元件的安装表面与安装基板的表面形成大致相同的平面; 以及由无机密封材料制成的无机密封部分，该无机密封材料的热膨胀系数等于用于密封固态元件的电力接收/供给部分的热膨胀系数。

18. 发明申请

US20110149594A1 Light-emitting device, light source and method of manufacturing the same 有权
标题翻译：发光装置，光源及其制造方法
公开(公告)号：US20110149594A1
公开(公告)日：2011-06-23
申请号：US12926955
申请日：2010-12-20
申请人： Tohru Terajima , Yoshinobu Suehiro , Koji Tasumi
发明人： Tohru Terajima , Yoshinobu Suehiro , Koji Tasumi
IPC分类号： F21V7/22 , H01L33/46
CPC分类号： G02B6/0021 , G02B6/0043 , G02B6/0046 , G02B6/0061 , G02B6/0068 , G02B6/0073 , G02F1/133603 , H01L2224/16225 , H01L2224/48091 , H01L2224/48465 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
摘要： A light-emitting device includes a light source including an element mounting substrate, an LED element mounted thereon by flip-chip connection and a sealing portion for sealing the LED element on the element mounting substrate, and a light guide plate including a housing hole for housing the light source. The housing hole extends from one surface side to another surface side of the light guide plate and an area of an inner surface thereof on which light is incident from the light source is parallel to a thickness direction of the light guide plate. The light source is housed in the housing hole so that the element mounting substrate is located on the other surface side of the light guide plate, emits light toward the one surface side of the light guide plate in the housing hole and the inner surface side of the housing hole, and has an optical axis parallel to the thickness direction of the light guide plate. A solid angle of the inner surface of the housing hole with respect to the center of an upper surface of the light source is not less than 4.44 steradians.
摘要翻译：发光装置包括：光源，其包括元件安装基板，通过倒装连接安装在其上的LED元件和用于密封元件安装基板上的LED元件的密封部分;以及导光板，其包括用于容纳光源。壳体孔从导光板的一个表面侧延伸到另一个表面侧，并且其中从光源入射的光的内表面的区域平行于导光板的厚度方向。光源容纳在容纳孔中，使得元件安装基板位于导光板的另一表面侧，朝向容纳孔中的导光板的一个表面侧发射光，并且将内部表面侧壳体孔，并且具有平行于导光板的厚度方向的光轴。壳体孔的内表面相对于光源上表面的中心的立体角度不小于4.44立方厘米。

19. 发明授权

US07878686B2 Light emitting device having a plurality of stacked radiating plate members 有权
标题翻译：具有多个层叠的散热板部件的发光装置
公开(公告)号：US07878686B2
公开(公告)日：2011-02-01
申请号：US11589296
申请日：2006-10-30
申请人： Yoshinobu Suehiro , Koji Tasumi
发明人： Yoshinobu Suehiro , Koji Tasumi
IPC分类号： F21V29/00
CPC分类号： F21V29/83 , F21K9/00 , F21V29/74 , F21V29/76 , F21V29/763 , F21V29/767 , F21V29/773 , F21Y2115/10 , F28F3/02 , Y10S362/80
摘要： A light emitting device has a light source having a light emitting element; and a radiator having plural plate members formed of a thermally-conductive material. The plural plate members are stacked on each other while allowing formation of a space between each other at an end portion thereof. The light source is mounted on a side surface of the plural stacked plate members.
摘要翻译：发光器件具有光源，其具有发光元件; 以及具有由导热材料形成的多个板构件的散热器。多个板构件彼此堆叠，同时在其端部处形成彼此之间的空间。光源安装在多个堆叠板构件的侧表面上。

20. 发明授权

US07872410B2 Light emitting device and light emitter 有权
标题翻译：发光装置和发光二极管
公开(公告)号：US07872410B2
公开(公告)日：2011-01-18
申请号：US12081392
申请日：2008-04-15
申请人： Koji Tasumi , Yoshinobu Suehiro , Seiji Yamaguchi
发明人： Koji Tasumi , Yoshinobu Suehiro , Seiji Yamaguchi
IPC分类号： H01J63/04
CPC分类号： H01L33/501 , F21K9/00 , G02B6/0023 , G02B6/003 , G02B6/0031 , G02B6/0068 , G02B6/0073 , G02B6/0083 , H01L25/0753 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2924/00014 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A light emitting device includes a light emitting element, a substrate with a flat mounting surface for mounting the light emitting element thereon, a sealing part for the light emitting element on the mounting surface of the substrate. The sealing part is formed of glass including a phosphor to be excited by light emitted from the light emitting element to radiate a wavelength conversion light. The sealing part is shaped like a rectangular solid wherein a lateral length is defined as a distance between a center of a bottom surface of the sealing part bonded to the mounting surface and a side face perpendicular to the mounting surface, a vertical length is defined as a distance between the mounting surface and a top surface of the sealing part, and at least one of the lateral length is longer than the vertical length. The device further includes a transparent member formed on the top surface of the sealing part. The transparent member includes the phosphor at a concentration higher than the sealing part.
摘要翻译：发光装置包括发光元件，具有用于将发光元件安装在其上的平坦安装表面的基板，在基板的安装表面上的发光元件的密封部。密封部由包含荧光体的玻璃构成，该荧光体被从发光元件发射的光激发，以发射波长转换光。密封部分的形状类似于矩形固体，其中横向长度被定义为接合到安装表面的密封部分的底面的中心与垂直于安装表面的侧面之间的距离，垂直长度被定义为所述安装表面与所述密封部分的顶表面之间的距离，并且所述横向长度中的至少一个长于所述垂直长度。该装置还包括形成在密封部分的顶表面上的透明构件。透明构件包括浓度高于密封部分的荧光体。

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