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    • 11. 发明授权
    • Display device and manufacturing method thereof
    • 显示装置及其制造方法
    • US08421940B2
    • 2013-04-16
    • US12405396
    • 2009-03-17
    • Takeshi NodaTakuo KaitohHidekazu MiyakeTakahiro Kamo
    • Takeshi NodaTakuo KaitohHidekazu MiyakeTakahiro Kamo
    • G02F1/136
    • H01L27/1251H01L27/1229H01L27/1285
    • A display device includes a TFT substrate in which a plurality of first TFT elements each having an active layer of an amorphous semiconductor and a plurality of second TFT elements each having an active layer of a polycrystalline semiconductor are disposed on a surface of an insulating substrate, wherein the first TFT element and the second TFT element each have a structure with a gate electrode, a gate insulating film, and the active layer stacked in this order on the surface of the insulating substrate and a source electrode and a drain electrode both connected to the active layer via a contact layer above the active layer, and the active layer of the second TFT element has a thickness of more than 60 nm in a position where the contact layer is stacked.
    • 显示装置包括TFT基板,其中在绝缘基板的表面上设置有多个具有非晶半导体的有源层的第一TFT元件和多个具有多晶半导体的有源层的第二TFT元件, 其中所述第一TFT元件和所述第二TFT元件各自具有在所述绝缘基板的表面上依次堆叠的栅电极,栅极绝缘膜和所述有源层的结构,以及源电极和漏电极都连接到 通过有源层上方的接触层的有源层和第二TFT元件的有源层在接触层堆叠的位置具有大于60nm的厚度。
    • 12. 发明授权
    • Display device and manufacturing method thereof
    • 显示装置及其制造方法
    • US08319225B2
    • 2012-11-27
    • US12611951
    • 2009-11-04
    • Takahiro KamoTakeshi Noda
    • Takahiro KamoTakeshi Noda
    • H01L33/00
    • H01L27/1214H01L29/66765H01L29/78621H01L29/78627H01L29/78678H01L29/78696
    • A display device includes: a conductive layer on which gate electrodes are formed; a first insulation layer which is formed on the conductive layer; a semiconductor layer which is formed on the first insulation layer and is provided for forming semiconductor films which contain poly-crystalline silicon above the gate electrodes; and a second insulation layer which is formed on the semiconductor layer. Here, the semiconductor film includes a channel region which overlaps with the gate electrode as viewed in a plan view. In the channel region, a portion of the semiconductor film which is in contact with the second insulation layer exhibits higher impurity concentration than a portion of the semiconductor film which is in contact with the first insulation layer.
    • 显示装置包括:形成栅电极的导电层; 形成在导电层上的第一绝缘层; 半导体层,形成在第一绝缘层上,用于形成在栅电极上方含有多晶硅的半导体膜; 以及形成在所述半导体层上的第二绝缘层。 这里,半导体膜包括与平面图中的栅电极重叠的沟道区域。 在沟道区域中,与第二绝缘层接触的半导体膜的一部分比与第一绝缘层接触的半导体膜的部分显示更高的杂质浓度。
    • 15. 发明申请
    • Semiconductor device and method for manufacturing the same
    • 半导体装置及其制造方法
    • US20060270130A1
    • 2006-11-30
    • US11440180
    • 2006-05-25
    • Takeshi SatoTakahiro KamoTakeshi Noda
    • Takeshi SatoTakahiro KamoTakeshi Noda
    • H01L21/84H01L29/76
    • H01L21/02667H01L21/02422H01L21/02532H01L21/02683H01L21/2026H01L27/1285H01L29/78603
    • Regions serving as semiconductor devices on a substrate GLS are separated by a substrate cutting position CUT. Each region is provided with a pixel region PXD, a gate line driving circuit region GCR and a signal line driving circuit region DCR for driving pixels, and a terminal region ELD where connection terminals will be formed. TFTs using a polycrystalline Si film not irradiated with a CW laser beam is formed in the pixel region PXD and the gate line driving circuit region GCR. A region CWD irradiated with the CW laser beam is formed in a part of the signal line driving circuit region DCR, and TFTs using a polycrystalline Si film made of crystals grown laterally are formed. A region UCW not irradiated with the CW laser beam is provided in the substrate cutting position CUT. The substrate GLS excluding the vicinities of the substrate cutting position CUT is irradiated with the CW laser beam. Tensile stress of the substrate surface near the substrate cutting position CUT is lower than tensile stress of the substrate surface in the region CWD so that cracks caused by substrate cutting is suppressed. Thus, it is possible to prevent cracks from occurring at the time of cutting a glass substrate having a semiconductor film crystallized by a CW laser beam.
    • 在衬底GLS上用作半导体器件的区域被衬底切割位置CUT隔开。 每个区域设置有像素区域PXD,栅极线驱动电路区域GCR和用于驱动像素的信号线驱动电路区域DCR以及将形成连接端子的端子区域ELD。 在像素区域PXD和栅极线驱动电路区域GCR中形成使用未被CW激光束照射的多晶Si膜的TFT。 在信号线驱动电路区域DCR的一部分中形成用CW激光束照射的区域CWD,并且形成使用由横向生长的晶体制成的多晶Si膜的TFT。 在基板切断位置CUT中设置没有用CW激光束照射的区域UCW。 用CW激光束照射除基板切断位置CUT附近的基板GLS。 衬底切割位置CUT附近的衬底表面的拉伸应力低于区域CWD中的衬底表面的拉伸应力,从而抑制由衬底切割引起的裂纹。 因此,可以防止在切割具有通过CW激光束结晶的半导体膜的玻璃基板时发生裂纹。
    • 17. 发明授权
    • Manufacturing method of display device
    • 显示装置的制造方法
    • US07811910B2
    • 2010-10-12
    • US12043159
    • 2008-03-06
    • Mikio HongoAkio YazakiTakahiro Kamo
    • Mikio HongoAkio YazakiTakahiro Kamo
    • H01L21/268
    • H01L21/268H01L21/02675H01L27/1285
    • In crystallization of a silicon film by annealing using a linear-shaped laser beam having a width of the short axis of the beam is ununiform, the profile (intensity distribution) of the laser beam is evaluated and the results are fed back to a condition of oscillating the laser beam or an optical condition for projecting the laser beam onto the silicon film, whereby a display device comprising a high-quality crystalline silicon film is manufactured. The energy distribution of the linear-shaped laser beam is determined by a detector type CCD camera which is moved stepwise in the directions in which its long axis and short axis extend, respectively, and a value obtained by dividing an accumulated intensity E in the long axis direction obtained by accumulating the detected signal in the direction parallel to the short axis by the square root of the width W of the short axis of the above linear-shaped laser beam in each position of the long axis: E/√{square root over ( )}(W), is determined in all the positions of a cross section of the linear-shaped laser beam to evaluate the above intensity distribution.
    • 在通过使用具有波束的短轴宽度的线形激光束进行退火的硅膜的结晶化不均匀的情况下,评价激光束的轮廓(强度分布),并将结果反馈到 振荡激光束或将激光束投射到硅膜上的光学条件,由此制造包括高质量结晶硅膜的显示装置。 线状激光束的能量分布由分别在其长轴和短轴延伸的方向上逐步移动的检测器型CCD照相机确定,并且通过将长时间的累积强度E除以获得的值 将上述线状激光的短轴的宽度W的平方根在长轴的各位置上沿着与短轴平行的方向累积检测信号而得到的轴方向:E /√{平方根 在线形激光束的横截面的所有位置中确定over()}(W),以评估上述强度分布。