专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

11. 发明申请

US20070200220A1 FLEXIBLE SUBSTRATE 审中-公开
标题翻译：柔性基板
公开(公告)号：US20070200220A1
公开(公告)日：2007-08-30
申请号：US11678309
申请日：2007-02-23
申请人： Makoto Murai , Ryosuke Usui
发明人： Makoto Murai , Ryosuke Usui
IPC分类号： H01L23/053
CPC分类号： H01L23/4985 , H01L2924/0002 , H05K1/0366 , H05K1/0393 , H05K2201/029 , H01L2924/00
摘要： A flexible substrate is provided which contains not only flexibility but also rigidity and hear resistance. A flexible substrate includes a first wiring layer, an insulating resin layer, a glass cloth and a second wiring layer. The insulating layer is formed by an insulating material, such as a BT resin, epoxy resin or the like that contains a high elastic modulus, heat resistance and moisture resistance. The film thickness of the insulating resin layer is thinned down to about 60 μm. As a reinforcing material, the glass cloth is embedded in the insulating resin layer. With this structure, the flexible substrate attains flexibility and at the same time in any of the first wiring layer and the second wiring layer, circuit elements can be mounted both on a curved area and a non-curved area of the wiring layers.
摘要翻译：提供了柔性基板，其不仅包含柔性，而且包含刚性和听阻力。挠性基板包括第一布线层，绝缘树脂层，玻璃布和第二布线层。绝缘层由包含高弹性模量，耐热性和耐湿性的BT树脂，环氧树脂等绝缘材料形成。绝缘树脂层的膜厚变薄至约60μm。作为增强材料，玻璃布嵌入绝缘树脂层中。利用这种结构，柔性基板具有灵活性，并且同时在第一布线层和第二布线层中的任一个中，电路元件既可以安装在布线层的弯曲区域和非弯曲区域上。

12. 发明申请

US20050280805A1 Mura defect inspection mask, apparatus and method of inspecting the mura defect, and method of producing a photomask 失效
标题翻译： Mura缺陷检查掩模，检查mura缺陷的装置和方法以及制造光掩模的方法
公开(公告)号：US20050280805A1
公开(公告)日：2005-12-22
申请号：US11139970
申请日：2005-05-31
申请人： Makoto Murai
发明人： Makoto Murai
IPC分类号： G01B11/30 , G01M11/00 , G01N21/88 , G01N21/956 , G03F1/84 , H01L21/027
CPC分类号： G01N21/956
摘要： Plural repetitive patterns 61 are formed on a transparent substrate 62 in the unit of a chip 65. Each of the repetitive patterns has plural pseudo mura defects 66 to which intensities of mura defects occurring in a predetermined repetitive pattern are allocated with being stepwise changed, for respective kinds of the mura defects. The mura defects are a CD Mura based on an abnormality in critical dimension of unit patterns 63 in the repetitive patterns, a Pitch Mura based on an abnormality in interval of the repetitive patterns, a Butting Mura-based on a positional displacement of the repetitive patterns, and a Defect mura based on a pattern defect of unit patterns in the repetitive patterns.
摘要翻译：多个重复图案61以芯片65为单位形成在透明基板62上。每个重复图案具有多个伪mura缺陷66，对于各种mura缺陷，分配以预定重复图案发生的mura缺陷的强度逐步改变。基于重复图案中的单位图案63的临界尺寸的异常，基于重复图案的间隔异常的间隔Mura，基于重复图案的位置偏移的对接Mura，基于Mura缺陷，以及基于重复模式中单位模式的模式缺陷的缺陷缺陷。

13. 发明授权

US06970910B2 Method for participating in network type game, server system for the same, and recording medium upon which program for the same is recorded 失效
标题翻译：用于参与网络型游戏的方法，用于其的服务器系统以及记录有相同程序的记录介质
公开(公告)号：US06970910B2
公开(公告)日：2005-11-29
申请号：US09982743
申请日：2001-10-18
申请人： Makoto Murai
发明人： Makoto Murai
IPC分类号： A63F13/12 , A63F13/00 , H04L29/06 , G06F15/16 , A63F9/24
CPC分类号： H04L67/38
摘要： A moving image for a game which is conducted at a specific location are distributed in real time, so as to implement a network participation type game which has an enhanced feeling of reality. By this game being distributed as a moving image in real time via a transmission line such as the Internet or a telephone line network, and by an unspecified number of people entering into conversation via terminal devices which receive this game, the game conducted at the specific location is executed, and thereby the feeling of reality is increased. Furthermore by including, in this game which is distributed as a moving image, reference time information which absorbs the time difference between the game which is conducted at the specific location and the game which is conducted upon the terminal device, players can participate in this game simultaneously in real time.
摘要翻译：在特定位置进行的游戏的运动图像被实时地分布，以实现具有增强的现实感的网络参与型游戏。通过这样的游戏，通过诸如因特网或电话线网络之类的传输线，以及通过接收该游戏的终端设备进入对话的未指定数量的人被实时地作为运动图像分发，执行位置，从而增加了现实感。此外，通过在作为动态图像分发的游戏中包含吸收在特定位置进行的游戏与在终端装置之间进行的游戏之间的时差的参考时间信息，玩家可以参与该游戏同时实时。

14. 发明授权

US5380596A Glass joint body and method of manufacturing the same 失效
标题翻译：玻璃接头体及其制造方法
公开(公告)号：US5380596A
公开(公告)日：1995-01-10
申请号：US212650
申请日：1994-03-14
申请人： Akihiko Yoshida , Tomonori Takahashi , Makoto Murai
发明人： Akihiko Yoshida , Tomonori Takahashi , Makoto Murai
IPC分类号： C03C8/24 , C04B37/00 , H01M2/08 , H01M10/39 , C03C8/02
CPC分类号： H01M2/08 , C03C8/24 , C04B37/005 , H01M10/3909 , C04B2235/6565 , C04B2237/10 , C04B2237/343 , C04B2237/64 , C04B2237/704 , C04B2237/76 , C04B2237/765 , C04B2237/80 , C04B2237/88
摘要： In order to improve a reliability of a glass joint body, first ceramic member and second ceramic member are connected by using (a) glass consisting of 10.about.65 wt % of SiO.sub.2, 30 wt % or less of Na.sub.20, and the balance of B.sub.2 O.sub.3 and Al.sub.2 O.sub.3, (b) glass including less than 10 wt % of SiO.sub.2, and 30.about.80 wt % of B.sub.2 O.sub.3, (c) glass including substantially none of SiO.sub.2, and 30.about.80 wt % of B.sub.2 O.sub.3, or (d) glass consisting of 10.about.65 wt % of SiO.sub.2, 20 wt % or less of Na.sub.2 O, 30 wt % or less of Al.sub.2 O.sub.3, 20 wt % or less of MgO, and the balance of B.sub.2 O.sub.3.
摘要翻译：为了提高玻璃接合体的可靠性，第一陶瓷部件和第二陶瓷部件通过使用（a）由10重量％的SiO 2，30重量％以下的Na 2 O，和余量的B 2 O 3组成的玻璃连接和（b）包含小于10重量％的SiO 2和30重量％的B 2 O 3的玻璃，（c）基本上不含SiO 2和30重量％的B 2 O 3的玻璃，或（d）玻璃组成的玻璃的10重量％的SiO 2，20重量％以下的Na 2 O，30重量％以下的Al 2 O 3，20重量％以下的MgO，余量的B 2 O 3。

15. 发明申请

US20110288118A1 PHARMACEUTICAL COMPOSITION COMPRISING SOLIFENACIN 有权
标题翻译：包含SOLIFENACIN的药物组合物
公开(公告)号：US20110288118A1
公开(公告)日：2011-11-24
申请号：US13110295
申请日：2011-05-18
申请人： Tatsunobu YOSHIOKA , Makoto Murai , Hiroaki Tasaki
发明人： Tatsunobu YOSHIOKA , Makoto Murai , Hiroaki Tasaki
IPC分类号： A61K31/439 , A61P11/00 , A61P11/08 , A61P13/10 , A61P1/00 , A61P1/06 , A61P13/06 , A61P13/00 , A61P11/06
CPC分类号： A61K31/439 , A61K47/32 , A61K47/58 , A61K47/585
摘要： Disclosed is a pharmaceutical composition comprising a complex between solifenacin or a pharmaceutically acceptable salt thereof and an ion exchange resin, and an acrylic based polymer.
摘要翻译：公开了一种药物组合物，其包含索非立新或其药学上可接受的盐与离子交换树脂和丙烯酸类聚合物之间的络合物。

16. 发明申请

US20100249413A1 STABILIZED PHARMACEUTICAL COMPOSITION 审中-公开
标题翻译：稳定的药物组合物
公开(公告)号：US20100249413A1
公开(公告)日：2010-09-30
申请号：US12377461
申请日：2007-08-24
申请人： Makoto Murai , Yuichi Yonemochi , Kohsuke Shakushiro , Akihiro Kasai
发明人： Makoto Murai , Yuichi Yonemochi , Kohsuke Shakushiro , Akihiro Kasai
IPC分类号： C07D403/06
CPC分类号： A61K9/19 , A61K9/0019 , A61K31/497 , A61K47/12 , A61K47/20 , A61K47/22
摘要： [Problem] A stable liquid-form pharmaceutical composition wherein the decomposition with time is prevented and a stabilization method thereof is provided, for providing a liquid-form pharmaceutical composition of 1-(2-methoxyethyl)-2-methyl-4,9-dioxo-3-(pyrazin-2-ylmethyl)-4,9-dihydro-1H-naphtho[2,3-d]imidazol-3-ium or a pharmaceutically acceptable salt thereof to a clinical field.[Means for Solution] Related are a stable pharmaceutical composition of 1-(2-methoxyethyl)-2-methyl-4,9-dioxo-3-(pyrazin-2-ylmethyl)-4,9-dihydro-1H-naphtho[2,3-d]imidazol-3-ium or a pharmaceutically acceptable salt thereof, containing one kind or two or more kinds selected from the group consisting of carbazochrome sodium sulfonate and derivatives thereof, vitamin C's, butylhydroxylanisol, vitamin E's, Vitamin P's, gallic acid, propyl gallate, alpha-thioglycerine and cysteine hydrochloride, as well as a lyophilized product thereof and a stabilizing method thereof.
摘要翻译： [问题]为了提供1-（2-甲氧基乙基）-2-甲基-4,9-二甲酸的液体形式的药物组合物，其中防止了随时间的分解及其稳定方法的稳定的液体形式的药物组合物，二氧代-3-（吡嗪-2-基甲基）-4,9-二氢-1H-萘并[2,3-d]咪唑-3-鎓或其药学上可接受的盐。 [解决方案]相关的是1-（2-甲氧基乙基）-2-甲基-4,9-二氧代-3-（吡嗪-2-基甲基）-4,9-二氢-1H-萘并[ 2,3-d]咪唑-3-鎓或其药学上可接受的盐，其包含选自咔唑类磺酸钠及其衍生物，维生素C，丁基羟基苯甲醚，维生素E，维生素P的一种或两种以上，没食子酸，没食子酸丙酯，α-硫代甘油和半胱氨酸盐酸盐，以及其冻干产物及其稳定方法。

17. 发明授权

US07759583B2 Circuit board 失效
标题翻译：电路板
公开(公告)号：US07759583B2
公开(公告)日：2010-07-20
申请号：US11528683
申请日：2006-09-28
申请人： Makoto Murai , Ryosuke Usui
发明人： Makoto Murai , Ryosuke Usui
IPC分类号： H05K1/11
CPC分类号： H05K3/421 , H05K1/0373 , H05K3/0055 , H05K3/4626 , H05K2201/0209 , H05K2201/09509 , Y10T428/24917 , Y10T428/24926
摘要： A circuit board, having improved adhesion between its via conductor and insulating layer, is provided. The circuit board includes a first wiring layer, a second wiring layer, the insulating layer, a filler, and the via conductor. The first wiring layer and the second wiring layer are electrically insulated from each other by the insulating layer. The filler which has a favorable thermal conductivity is added into the insulating layer. The via conductor establishing electrical connection between the first wiring layer and the second wiring layer is formed in a predetermined position of the insulating layer. The via conductor is in direct contact with part of the filler added into the insulating layer.
摘要翻译：提供了一种电路板，其通孔导体和绝缘层之间具有改善的粘合性。电路板包括第一布线层，第二布线层，绝缘层，填料和通孔导体。第一布线层和第二布线层通过绝缘层彼此电绝缘。将具有良好导热性的填料加入到绝缘层中。在第一布线层和第二布线层之间建立电连接的通孔导体形成在绝缘层的预定位置。通孔导体与添加到绝缘层中的填料的一部分直接接触。

18. 发明申请

US20070252249A1 Circuit Apparatus and Method of Fabricating the Apparatus 有权
标题翻译：电路装置及其制造方法
公开(公告)号：US20070252249A1
公开(公告)日：2007-11-01
申请号：US11740669
申请日：2007-04-26
申请人： Makoto Murai , Yasuhiro Kohara , Ryosuke Usui
发明人： Makoto Murai , Yasuhiro Kohara , Ryosuke Usui
IPC分类号： H01L23/495
CPC分类号： H05K3/243 , H01L23/3128 , H01L23/3142 , H01L23/50 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/81 , H01L24/85 , H01L2224/05553 , H01L2224/16225 , H01L2224/16237 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/48464 , H01L2224/48465 , H01L2224/48599 , H01L2224/48644 , H01L2224/49171 , H01L2224/81801 , H01L2224/85444 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01018 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01076 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/01088 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/15747 , H01L2924/181 , H01L2924/18301 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/351 , H05K3/284 , H05K3/3452 , H05K3/382 , H05K2201/0989 , H05K2203/049 , Y10T29/49117 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49156 , Y10T29/49222 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： The likelihood of exfoliation of a sealing resin layer at a pad electrode part is reduced so that the reliability of a circuit apparatus is improved. A circuit apparatus includes a wiring layer, a gold plating layer, an insulating resin layer, a circuit element, a conductive member and sealing resin layer. The gold plating layer is formed in an wiring layer area for the pad electrode. The surface outside the area is roughened. The insulating resin layer is formed so as to cover the wiring layer and to have an opening in an area in which the pad electrode is formed. The circuit element is mounted on a predetermined area on the insulating resin layer. The sealing resin layer is formed on the insulating resin layer so as to entirely cover the circuit element and the opening for the pad electrode. The sealing resin layer, in the area for the pad electrode, is in contact with the gold plating layer and the wiring layer.
摘要翻译：密封树脂层在焊盘电极部分的剥离的可能性降低，从而提高了电路设备的可靠性。电路装置包括布线层，镀金层，绝缘树脂层，电路元件，导电构件和密封树脂层。金电镀层形成在焊盘电极的布线层区域中。该地区外面的表面粗糙。绝缘树脂层形成为覆盖布线层，并且在形成焊盘电极的区域中具有开口。电路元件安装在绝缘树脂层上的预定区域上。密封树脂层形成在绝缘树脂层上，以完全覆盖电路元件和焊盘电极的开口。用于焊盘电极的区域中的密封树脂层与镀金层和布线层接触。

19. 发明申请

US20070082183A1 Circuit board 失效
标题翻译：电路板
公开(公告)号：US20070082183A1
公开(公告)日：2007-04-12
申请号：US11528683
申请日：2006-09-28
申请人： Makoto Murai , Ryosuke Usui
发明人： Makoto Murai , Ryosuke Usui
IPC分类号： B32B3/00 , H05K1/00
CPC分类号： H05K3/421 , H05K1/0373 , H05K3/0055 , H05K3/4626 , H05K2201/0209 , H05K2201/09509 , Y10T428/24917 , Y10T428/24926
摘要： A circuit board, having improved adhesion between its via conductor and insulating layer, is provided. The circuit board includes a first wiring layer, a second wiring layer, the insulating layer, a filler, and the via conductor. The first wiring layer and the second wiring layer are electrically insulated from each other by the insulating layer. The filler which has a favorable thermal conductivity is added into the insulating layer. The via conductor establishing electrical connection between the first wiring layer and the second wiring layer is formed in a predetermined position of the insulating layer. The via conductor is in direct contact with part of the filler added into the insulating layer.
摘要翻译：提供了一种电路板，其通孔导体和绝缘层之间具有改善的粘合性。电路板包括第一布线层，第二布线层，绝缘层，填料和通孔导体。第一布线层和第二布线层通过绝缘层彼此电绝缘。将具有良好导热性的填料加入到绝缘层中。在第一布线层和第二布线层之间建立电连接的通孔导体形成在绝缘层的预定位置。通孔导体与添加到绝缘层中的填料的一部分直接接触。

20. 发明申请

US20060204733A1 Circuit device 失效
公开(公告)号：US20060204733A1
公开(公告)日：2006-09-14
申请号：US11362516
申请日：2006-02-27
申请人： Makoto Murai , Ryosuke Usui
发明人： Makoto Murai , Ryosuke Usui
IPC分类号： B32B3/00
CPC分类号： C23C28/00 , C23C28/322 , C23C28/345 , H01L23/3121 , H01L23/3733 , H01L23/3735 , H01L23/3737 , H01L23/49822 , H01L23/49894 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2224/32225 , H01L2224/451 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/73265 , H01L2924/01019 , H01L2924/01078 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H05K1/0206 , H05K1/056 , H05K3/284 , H05K3/4652 , H05K2201/0209 , H05K2201/0266 , H05K2201/0269 , H05K2201/068 , H05K2201/09563 , H05K2201/096 , H05K2203/0315 , Y10T428/24331 , Y10T428/24917 , H01L2924/00012 , H01L2924/00014 , H01L2924/00 , H01L2924/00015
摘要： The present invention provides a circuit device capable of controlling deformation of a circuit device while preventing an insulating layer from peeling from a substrate. The circuit device includes a substrate, an insulating layer formed on the substrate, a filler filled into the insulating layer, a conductive layer formed on the insulating layer, and a circuit element formed on the conductive layer, wherein an average particle diameter of the filler filled into the insulating layer is controlled so that a Young's modulus of a part of the insulating layer on a substrate side can be smaller than a Young's modulus of a part of the insulating layer on an opposite side relative to the substrate side.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式