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    • 17. 发明授权
    • Positive-working photosensitive resin precursor composition
    • 正性感光性树脂前体组合物
    • US06723484B1
    • 2004-04-20
    • US09567106
    • 2000-05-08
    • Masao TomikawaNaoyo OkamotoSatoshi YoshidaRyoji Okuda
    • Masao TomikawaNaoyo OkamotoSatoshi YoshidaRyoji Okuda
    • G03F7023
    • G03F7/0233C08G73/1025C08L79/08
    • The present invention relates to a positive-working photosensitive resin precursor composition which is characterized in that it contains (a) polymer in which the chief component comprises structural units of the kind where the bonding between structural units is represented by general formula (1) and (b) photoacid generator, and it can form a pattern by light irradiation and subsequent developing, and the total carboxyl groups contained in said polymer is from 0.02 to 2.0 mmol/g, and it provides a photosensitive resin composition of high sensitivity which can be developed by alkali. (R1 is an organic group of valency from 3 to 8 having at least 2 carbon atoms, R2 is an organic group of valency from 2 to 6 having at least 2 carbon atoms, R3 is hydrogen or an organic group with from 1 to 10 carbons. n is an integer of value from 3 to 100,000, m is 1 or 2, p and q are integers of value from 0 to 4 and p+q>0).
    • 本发明涉及一种正性感光性树脂前体组合物,其特征在于,其含有(a)主要成分包含结构单元之间的结合由通式(1)表示的结构单元和 (b)光致酸发生剂,可以通过光照射和随后的显影形成图案,所述聚合物中所含的总羧基为0.02〜2.0mmol / g,提供高灵敏度的感光性树脂组合物,其可以是 (R 1是具有至少2个碳原子的3至8价的有机基团,R 2是具有至少2个碳原子的2至6价的有机基团,R 3 是氢或1〜10个碳的有机基团,n为3〜100,000的整数,m为1或2,p和q为0〜4的整数,p + q> 0)。
    • 20. 发明申请
    • RESIN COMPOSITION AND MANUFACTURING PROCESS THEREFOR
    • 树脂组合物及其制造方法
    • US20130184406A1
    • 2013-07-18
    • US13824223
    • 2011-09-08
    • Daichi MiyazakiKazuto MiyoshiMasao Tomikawa
    • Daichi MiyazakiKazuto MiyoshiMasao Tomikawa
    • C09D177/12
    • C09D177/12C08G73/1042C08G73/1067C08G73/1071C08G73/14C08L79/08
    • A polyamic acid resin composition includes (a) a polyamic acid having structures represented by general formula (1) in an amount of at least 80% of all the repeating units and (b) a solvent. In formula (1), A is a polyamic acid block represented by general formula (2); B is a polyamic acid block represented by general formula (3); and k is a positive integer. In formula (2), Ws are divalent organic groups having two or more carbon atoms, mainly composed of divalent organic groups represented by general formula (4); Xs are tetravalent organic groups having two or more carbon atoms. In formula (3), Ys are divalent organic groups having two or more carbon atoms, exclusive of the groups represented by formula (4); Zs are tetravalent organic groups each having two or more carbon atoms, and are mainly composed of tetravalent organic groups represented by general formula (5) or (6).
    • 聚酰胺酸树脂组合物包含(a)具有由通式(1)表示的结构的聚酰胺酸的量为全部重复单元的至少80%,(b)溶剂。 在式(1)中,A是由通式(2)表示的聚酰胺酸嵌段; B是由通式(3)表示的聚酰胺酸嵌段; k是正整数。 在式(2)中,W是具有两个或更多个碳原子的二价有机基团,主要由通式(4)表示的二价有机基团组成; X是具有两个或更多个碳原子的四价有机基团。 在式(3)中,Y是具有两个或更多个碳原子的二价有机基团,不包括由式(4)表示的基团; Z是四价有机基团,各自具有两个或更多个碳原子,并且主要由通式(5)或(6)表示的四价有机基团组成。