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11. 发明申请

US20080142941A1 3D ELECTRONIC PACKAGING STRUCTURE WITH ENHANCED GROUNDING PERFORMANCE AND EMBEDDED ANTENNA 审中-公开
标题翻译：具有增强接地性能和嵌入式天线的3D电子包装结构
公开(公告)号：US20080142941A1
公开(公告)日：2008-06-19
申请号：US11612563
申请日：2006-12-19
申请人： Ming-Chih Yew , Chien-Chia Chiu , Kou-Ning Chiang , Wen-Kun Yang
发明人： Ming-Chih Yew , Chien-Chia Chiu , Kou-Ning Chiang , Wen-Kun Yang
IPC分类号： H01L23/02
CPC分类号： H01L25/105 , H01L23/3128 , H01L23/552 , H01L24/19 , H01L24/20 , H01L24/48 , H01L24/97 , H01L25/16 , H01L2223/6677 , H01L2224/04105 , H01L2224/12105 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2225/1005 , H01L2225/1035 , H01L2225/1058 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/1461 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/19015 , H01L2924/3025 , H01L2924/00015 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： The present invention proposes a 3D electronic packaging structure with enhanced grounding performance and embedded antenna, and the packaging unit can achieve multi-chip stacking through the signal contacts on the top and bottom surfaces of the unit. A single or multiple grounding layers are on the back of the substrate in the packaging unit to facilitate the grounding for the semiconductor element; further, the packaging unit is applicable to a wafer level packaging process, so the manufacturing cost of each individual packaging unit is reduced. The above grounding layers are also the signal transmission paths of the electronic elements in the packaging structure of the invention, and a single or multiple via holes around the electronic element layers allow electrical signal connection between the top and bottom surfaces of the packaging structure, and thus enable more functionality in the packaging unit. Moreover, the grounding layers may have circular signal channels to construct a 3D stacked packaging structure with embedded antenna.
摘要翻译：本发明提出了具有增强的接地性能的3D电子封装结构和嵌入式天线，并且封装单元可以通过单元的顶表面和底表面上的信号触点实现多芯片堆叠。单个或多个接地层位于封装单元中的衬底的背面，以便于半导体元件的接地; 此外，封装单元适用于晶片级封装工艺，因此减少了各个封装单元的制造成本。上述接地层也是本发明的包装结构中的电子元件的信号传输路径，并且电子元件层周围的单个或多个通孔允许包装结构的顶表面和底表面之间的电信号连接，以及从而在包装单元中实现更多功能。此外，接地层可以具有圆形信号通道，以构建具有嵌入式天线的3D堆叠封装结构。

12. 发明授权

US4129817A Stepped voltage power supply with equalized discharge of battery cells 失效
标题翻译：步进电压电源，均衡放电电池
公开(公告)号：US4129817A
公开(公告)日：1978-12-12
申请号：US826372
申请日：1977-08-22
申请人： Ming-Chih Yew , Trevor O. Jones
发明人： Ming-Chih Yew , Trevor O. Jones
IPC分类号： H01H19/28 , H01H19/56 , H02J7/00 , H02P7/00
CPC分类号： H01H19/28 , H01H19/56
摘要： The adjacent terminals of adjacent battery cells are grouped in regularly spaced pairs of contacts. A first commutating member has a plurality of regularly spaced contact members effective to connect the contacts of each pair but one and is movable sequentially through a plurality of positions to vary the unconnected contact pair. One of the contact members adjacent the unconnected contact pair provides a first output terminal. A second commutating member has a single contact member effective to connect the contacts of one of said pairs and provide a second output terminal and is movable sequentially through a plurality of positions to vary the connected contact pair. Actuator means are movable sequentially through a plurality of positions in a first direction and a second direction and are connected through a unidirectional clutch to the second commutating member to move it in one direction to increase the number of cells connected across the output terminals with movement of the actuator means in its first direction and through a unidirectional clutch to the first commutating member to move it in the same one direction to decrease the number of cells connected across the output terminals with movement of the actuator means in its second direction, thereby varying the output voltage in a stepped fashion and equalizing the discharge of the individual cells with such variation.
摘要翻译：相邻电池单元的相邻端子被组合成规则间隔的触点对。第一换向构件具有多个规则间隔的接触构件，其有效地连接每对的触点，但是可以顺序地移动通过多个位置以改变未连接的触点对。与未连接的触点对相邻的接触构件中的一个提供第一输出端子。第二换向构件具有有效地连接所述对之一的触点的单个接触构件，并提供第二输出端子，并且可以顺序移动通过多个位置以改变所连接的触点对。致动器装置可沿第一方向和第二方向顺序地移动通过多个位置，并且通过单向离合器连接到第二换向构件以沿一个方向移动，以增加跨过输出端子连接的单元的数量，致动器在其第一方向上并且通过单向离合器连接到第一换向构件，以沿着相同的一个方向移动它，以通过致动器装置在其第二方向上的运动来减小连接在输出端上的单元的数量，从而改变输出电压，并以这种变化均衡各个电池的放电。

13. 发明授权

US07884464B2 3D electronic packaging structure having a conductive support substrate 有权
标题翻译：具有导电支撑基板的3D电子封装结构
公开(公告)号：US07884464B2
公开(公告)日：2011-02-08
申请号：US11475131
申请日：2006-06-27
申请人： Ming-Chih Yew , Chang-Ann Yuan , Chan-Yen Chou , Kou-Ning Chiang
发明人： Ming-Chih Yew , Chang-Ann Yuan , Chan-Yen Chou , Kou-Ning Chiang
IPC分类号： H01L23/04
CPC分类号： H01L23/5389 , H01L24/19 , H01L24/24 , H01L25/105 , H01L2224/0401 , H01L2224/04105 , H01L2224/12105 , H01L2224/16225 , H01L2224/20 , H01L2224/24227 , H01L2224/32225 , H01L2224/32245 , H01L2224/73267 , H01L2224/76155 , H01L2224/82102 , H01L2225/1005 , H01L2225/1035 , H01L2225/1058 , H01L2924/01004 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/01074 , H01L2924/01079 , H01L2924/07802 , H01L2924/10253 , H01L2924/15153 , H01L2924/1517 , H01L2924/00
摘要： The present invention provides a 3D electronic packaging unit having a conductive supporting substrate that can achieve multi-chip stacking through the signal contacts on the both sides of the unit. The packaging unit can be batched manufactured on wafers or substrates, and thus reduce the manufacturing cost of each individual packaging unit; moreover, the conductive supporting substrate can be utilized to provide signal transmission of the electronic elements, and the supporting substrate can be used as a ground terminal for the carried electronic elements to enhance electric performance of the electronic elements. The supporting substrate is also a good thermal conductor that can release effectively heat energy generated by the electronic elements and accumulated inside the package to the outside of the package along the substrate to enhance reliability of the packaging structure.
摘要翻译：本发明提供了一种3D电子封装单元，其具有能够通过该单元两侧的信号触点实现多芯片堆叠的导电支撑基板。包装单元可以在晶片或基板上批量生产，从而降低每个单独包装单元的制造成本; 此外，导电支撑基板可以用于提供电子元件的信号传输，并且支撑基板可以用作所携带的电子元件的接地端子，以增强电子元件的电性能。支撑基板也是良好的热导体，其可以有效地释放由电子元件产生的热能并且沿着衬底积聚在封装内部的热量，以增强封装结构的可靠性。

14. 发明申请

US20070296065A1 3D electronic packaging structure having a conductive support substrate 有权
标题翻译：具有导电支撑基板的3D电子封装结构
公开(公告)号：US20070296065A1
公开(公告)日：2007-12-27
申请号：US11475131
申请日：2006-06-27
申请人： Ming-Chih Yew , Chang-Ann Yuan , Chan-Yen Chou , Kou-Ning Chiang
发明人： Ming-Chih Yew , Chang-Ann Yuan , Chan-Yen Chou , Kou-Ning Chiang
IPC分类号： H01L23/552
CPC分类号： H01L23/5389 , H01L24/19 , H01L24/24 , H01L25/105 , H01L2224/0401 , H01L2224/04105 , H01L2224/12105 , H01L2224/16225 , H01L2224/20 , H01L2224/24227 , H01L2224/32225 , H01L2224/32245 , H01L2224/73267 , H01L2224/76155 , H01L2224/82102 , H01L2225/1005 , H01L2225/1035 , H01L2225/1058 , H01L2924/01004 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/01074 , H01L2924/01079 , H01L2924/07802 , H01L2924/10253 , H01L2924/15153 , H01L2924/1517 , H01L2924/00
摘要： The present invention provides a 3D electronic packaging unit having a conductive supporting substrate that can achieve multi-chip stacking through the signal contacts on the both sides of the unit. The packaging unit can be batched manufactured on wafers or substrates, and thus reduce the manufacturing cost of each individual packaging unit; moreover, the conductive supporting substrate can be utilized to provide signal transmission of the electronic elements, and the supporting substrate can be used as a ground terminal for the carried electronic elements to enhance electric performance of the electronic elements. The supporting substrate is also a good thermal conductor that can release effectively heat energy generated by the electronic elements and accumulated inside the package to the outside of the package along the substrate to enhance reliability of the packaging structure.
摘要翻译：本发明提供了一种3D电子封装单元，其具有能够通过该单元两侧的信号触点实现多芯片堆叠的导电支撑基板。包装单元可以在晶片或基板上批量生产，从而降低每个单独包装单元的制造成本; 此外，导电支撑基板可以用于提供电子元件的信号传输，并且支撑基板可以用作所携带的电子元件的接地端子，以增强电子元件的电性能。支撑基板也是良好的热导体，其可以有效地释放由电子元件产生的热能并且沿着衬底积聚在封装内部的热量，以增强封装结构的可靠性。

15. 发明授权

US4568096A Automatic vehicle level control 失效
标题翻译：自动车辆液位控制
公开(公告)号：US4568096A
公开(公告)日：1986-02-04
申请号：US601858
申请日：1984-04-19
申请人： Ming-Chih Yew , Bernard J. Finn , Herbert A. Libkie , Kenneth R. Meloche , James G. McLeish
发明人： Ming-Chih Yew , Bernard J. Finn , Herbert A. Libkie , Kenneth R. Meloche , James G. McLeish
IPC分类号： B60G23/00 , B60G17/015 , B60G17/018 , F16F9/50 , B60G17/00
CPC分类号： B60G17/018 , B60G2400/252 , B60G2400/30 , B60G2400/60 , B60G2400/90 , B60G2400/952 , B60G2401/14 , B60G2600/02 , B60G2600/07 , B60G2600/08 , B60G2600/12 , B60G2600/66 , B60G2800/18 , B60G2800/22 , Y10S280/01
摘要： A level control system for a motor vehicle with an unsprung mass including a wheel, a sprung mass, and a shock absorber connecting the sprung and unsprung masses comprises fluid power apparatus activatable to level the sprung mass with respect to the unsprung mass, a sensor effective to generate a signal indicating the level of the sprung mass relative to the unsprung mass and apparatus responsive to the sensor to compute the difference between the total times, within a predetermined time period, spent by the level above and below a predetermined trim band and apparatus effective to compare the difference of the times with a reference comprising a predetermined percentage of the predetermined time period and activate the fluid power apparatus if the difference exceeds the reference in magnitude, whereby the system can maintain a narrow trim band while the vehicle is not moving while avoiding unnecessary corrections and cycling due to excursions above and below the trim band during vehicle movement over rough surfaces.
摘要翻译：用于具有簧下质量的机动车辆的液位控制系统，包括车轮，弹簧质量和连接簧上和非簧载质量的减震器，包括可激活以使簧上质量相对于非簧载质量平坦化的流体动力装置，有效的传感器以产生指示相对于簧下质量的簧上质量的水平的信号和响应于传感器的装置，以计算在预定时间段内在预定的装饰带上方和下方消耗的总时间之间的差异和装置有效地将时间的差异与包括预定时间段的预定百分比的参考值进行比较，并且如果差值超过参考值则激活流体动力装置，由此当车辆不移动时系统可以保持窄的装饰带同时避免由于在车辆内的装饰带上方和下方的偏移而导致的不必要的校正和骑行在粗糙的表面上运动。

16. 发明申请

US20120306070A1 Electrical Connection for Chip Scale Packaging 有权
标题翻译：电子连接用于芯片级封装
公开(公告)号：US20120306070A1
公开(公告)日：2012-12-06
申请号：US13152734
申请日：2011-06-03
申请人： Ming-Chih Yew , Fu-Jen Li , Po-Yao Lin , Chia-Jen Cheng , Hsiu-Mei Yu
发明人： Ming-Chih Yew , Fu-Jen Li , Po-Yao Lin , Chia-Jen Cheng , Hsiu-Mei Yu
IPC分类号： H01L23/485
CPC分类号： H01L24/13 , H01L21/76885 , H01L23/3192 , H01L24/03 , H01L24/05 , H01L24/82 , H01L2224/02235 , H01L2224/02255 , H01L2224/0235 , H01L2224/02375 , H01L2224/0401 , H01L2224/05005 , H01L2224/05008 , H01L2224/05022 , H01L2224/05541 , H01L2224/05569 , H01L2224/05572 , H01L2224/10155 , H01L2224/13005 , H01L2224/13006 , H01L2224/13007 , H01L2224/13024 , H01L2224/13111 , H01L2224/13139 , H01L2224/13147 , H01L2924/00014 , H01L2924/01029 , H01L2924/351 , H01L2924/35121 , H01L2924/207 , H01L2924/2076 , H01L2224/05552
摘要： A system and method for providing a post-passivation and underbump metallization is provided. An embodiment comprises a post-passivation layer that is larger than an overlying underbump metallization. The post-passivation layer extending beyond the underbump metallization shields the underlying layers from stresses generated from mismatches of the materials' coefficient of thermal expansion.
摘要翻译：提供了一种用于提供后钝化和欠掺杂金属化的系统和方法。一个实施例包括大于上覆下凸点金属化的后钝化层。延伸超过下凸块金属化的后钝化层屏蔽下层不受材料的热膨胀系数的不匹配产生的应力。

17. 发明授权

US4377298A Vehicle wheel suspension 失效
标题翻译：车轮悬挂
公开(公告)号：US4377298A
公开(公告)日：1983-03-22
申请号：US272702
申请日：1981-06-11
申请人： Bernard J. Finn , Ming-Chih Yew
发明人： Bernard J. Finn , Ming-Chih Yew
IPC分类号： B60G3/28 , B60G3/26 , B60G15/06 , B60G11/56
CPC分类号： B60G15/062 , B60G3/265 , B60G2200/17 , B60G2204/128 , B60G2204/4108
摘要： In a vertical telescopic strut and transverse lower control arm type suspension, such elements are interconnected at a point substantially inboard between the ends of the control arm and the wheel support knuckle is substantially outboard of the strut axis at the distal outer end of the lower control arm. A second transversely extending control arm for the wheel knuckle is swingably mounted upon the lower telescopic portion of the strut above the lower control arm.
摘要翻译：在垂直伸缩支柱和横向下部控制臂型悬架中，这些元件在控制臂的端部之间的基本上内侧的位置处相互连接，并且轮支撑转向节在下部控制器的远端外端基本上在支柱轴线外侧臂。用于车轮转向节的第二横向延伸的控制臂可摆动地安装在下控制臂上方的支柱的下伸缩部分上。

18. 发明授权

US3995605A Jet ignition engine with singly actuated dual inlet valves 失效
标题翻译：喷气式点火式发动机，带单驱动双入口阀
公开(公告)号：US3995605A
公开(公告)日：1976-12-07
申请号：US563779
申请日：1975-03-31
申请人： Ming-Chih Yew
发明人： Ming-Chih Yew
IPC分类号： F02B19/10 , F02B19/00
CPC分类号： F02B19/1033 , Y02T10/125
摘要： An internal combustion engine having interconnected main and auxiliary combustion chambers, respectively, supplied with air-fuel mixtures through separate main and auxiliary intake passages is provided with an inlet valve having a single stem carrying two valve elements, one controlling each inlet port. At least one of the valve elements is resiliently positioned on the stem to permit relative movement between the elements and thus obtain positive seating of both valve elements on their respective valve seats. The arrangements permit actuation of the valve by conventional single valve actuating means.
摘要翻译：具有分别通过单独的主和辅助进气通道供应有空气 - 燃料混合物的主燃烧室和辅助燃烧室的内燃机设置有入口阀，其具有承载两个阀元件的单个阀杆，一个控制每个入口端口。阀元件中的至少一个弹性地定位在杆上以允许元件之间的相对运动，从而获得两个阀元件在它们各自的阀座上的正向安置。该布置允许通过传统的单阀致动装置致动阀。

19. 发明授权

US3987769A Jet ignition engine with valve-carried ignition chamber 失效
标题翻译：喷气式点火发动机带阀门加油点火室
公开(公告)号：US3987769A
公开(公告)日：1976-10-26
申请号：US563780
申请日：1975-03-31
申请人： Ming-Chih Yew
发明人： Ming-Chih Yew
IPC分类号： F02B19/10 , F02B19/16 , F02B75/02
CPC分类号： F02B19/1033 , F02B19/1042 , F02B19/16 , Y02T10/125 , Y10S123/04
摘要： A jet ignition internal combustion engine of the type provided with separate induction passages for lean and rich air-fuel mixtures wherein the main inlet valve mounts a cup like member forming an auxiliary ignition chamber within the main combustion chamber. The rich mixture is supplied to the auxiliary chamber through the hollow stem of the main inlet valve, flow being controlled by a small auxiliary valve within the main valve and actuated by the same valve gear. Openings in the wall of the valve-carried ignition chamber connect with spark ignition means and with the main combustion chamber to provide for spark ignition of the rich ignition chamber mixture and resultant jet ignition of the lean mixture in the main combustion chamber.

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