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    • 14. 发明授权
    • Method of making released micromachined structures by directional etching
    • 通过定向蚀刻制造释放的微加工结构的方法
    • US6086774A
    • 2000-07-11
    • US993924
    • 1997-12-18
    • Francis HoYoshihisa Yamamoto
    • Francis HoYoshihisa Yamamoto
    • B81C1/00C25F3/02G01P15/08G01P15/09G01P15/12G01Q70/16B44C1/22C25F3/12G01P15/02
    • G01Q70/16B81C1/00531B82Y35/00G01P15/0802G01P15/0922G01P15/123B81B2201/0235B81B2203/0118B81C2201/0132B81C2201/0143G01P2015/0828
    • A method of making released structures by using at least two directional etching steps. Cantilevers, bridges and many other structures can be made with the present invention. In a preferred embodiment, two directional etching steps are performed at opposing angles nonnormal to the substrate surface such that the substrate is undercut and a structure is released. Alternatively, more than two directional etching steps may be performed at various angles. For example, the substrate may be rotated continuously during the directional etching process. A cantilever formed by the method of the present invention necessarily has a substantially triangular cross section. Directional etching processes that can be used include focused ion beam etching and ECR plasma etching. Some directional etching processes may require the use of a patterned etch resist layer. Other etching processes such as focused ion beam etching may use scanning techniques to select which regions are etched. A backside etch can be performed to remove remaining substrate material under the released micromachined structure. The method is particularly well suited for making released cantilevers.
    • 通过使用至少两个方向蚀刻步骤来制造释放结构的方法。 悬臂,桥梁和许多其他结构可以用本发明制成。 在优选实施例中,以相对于基板表面非正常的角度执行两个定向蚀刻步骤,使得基底被切削并且结构被释放。 或者,可以以各种角度执行多于两个的定向蚀刻步骤。 例如,可以在定向蚀刻工艺期间连续旋转衬底。 通过本发明的方法形成的悬臂必须具有基本上三角形的横截面。 可以使用的定向蚀刻工艺包括聚焦离子束蚀刻和ECR等离子体蚀刻。 一些定向蚀刻工艺可能需要使用图案化的抗蚀剂层。 诸如聚焦离子束蚀刻的其它蚀刻工艺可以使用扫描技术来选择蚀刻哪些区域。 可以执行背面蚀刻以在释放的微加工结构下去除剩余的基底材料。 该方法特别适用于制备释放的悬臂。