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11. 发明授权

US07800222B2 Semiconductor module with switching components and driver electronics 有权
标题翻译：具有开关元件和驱动电路的半导体模块
公开(公告)号：US07800222B2
公开(公告)日：2010-09-21
申请号：US11947279
申请日：2007-11-29
申请人： Martin Schulz , Uwe Jansen
发明人： Martin Schulz , Uwe Jansen
IPC分类号： H01L23/34
CPC分类号： H01L25/162 , H01L23/041 , H01L23/552 , H01L24/29 , H01L24/32 , H01L24/48 , H01L25/0652 , H01L25/0655 , H01L25/071 , H01L25/072 , H01L2224/04026 , H01L2224/48091 , H01L2224/48137 , H01L2924/00014 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/10253 , H01L2924/16195 , H01L2924/181 , H01L2924/19042 , H01L2924/19043 , H01L2924/3025 , H05K1/0239 , H05K1/0298 , H05K1/144 , H05K1/165 , H05K2201/09481 , H05K2201/09518 , H05K2201/10689 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor module comprises at least one semiconductor chip having at least one semiconductor switch. The at least one semiconductor chip is arranged on a carrier substrate. At least one driver component drives the at least one semiconductor switch. The at least one driver component is arranged on a circuit board. The at least one driver component has at least one input for receiving a control signal. The circuit board has a galvanic isolation in a signal path between the at least one driver component and the at least one semiconductor chip.
摘要翻译：半导体模块包括具有至少一个半导体开关的至少一个半导体芯片。至少一个半导体芯片布置在载体基板上。至少一个驱动器部件驱动至少一个半导体开关。至少一个驱动器部件布置在电路板上。所述至少一个驱动器部件具有用于接收控制信号的至少一个输入。电路板在至少一个驱动器部件和至少一个半导体芯片之间的信号路径中具有电流隔离。

12. 发明申请

US20100164601A1 CONTROL CIRCUIT FOR A POWER SEMICONDUCTOR ASSEMBLY AND POWER SEMICONDUCTOR ASSEMBLY 有权
标题翻译：功率半导体组件和功率半导体组件的控制电路
公开(公告)号：US20100164601A1
公开(公告)日：2010-07-01
申请号：US12646112
申请日：2009-12-23
申请人： Uwe Jansen
发明人： Uwe Jansen
IPC分类号： H03K17/60
CPC分类号： H02M1/088 , H01L2224/32225 , H01L2224/48091 , H01L2224/48137 , H01L2224/48139 , H01L2224/48227 , H01L2224/73265 , H02M1/08 , H03K17/127 , H01L2924/00014 , H01L2924/00
摘要： Disclosed is a control circuit for controlling a controllable power semiconductor switch, and to a power semiconductor module. The control circuit comprises at least two circuit sets, each having a power driver. The power driver of each of the circuit sets is provided with power via impedance components having an impedance other than zero.
摘要翻译：公开了一种用于控制可控功率半导体开关和功率半导体模块的控制电路。控制电路包括至少两个电路组，每个电路组具有功率驱动器。每个电路组的功率驱动器通过具有除零之外的阻抗的阻抗分量提供电力。

13. 发明授权

US08638129B2 Power circuit 有权
标题翻译：电源电路
公开(公告)号：US08638129B2
公开(公告)日：2014-01-28
申请号：US12195157
申请日：2008-08-20
申请人： Peter Kanschat , Uwe Jansen , Gerald Deboy
发明人： Peter Kanschat , Uwe Jansen , Gerald Deboy
IPC分类号： H03B1/00
CPC分类号： H03K17/06
摘要： A power circuit. One embodiment provides a circuit for driving a power transistor having a control electrode and a load path. The circuit includes a driver circuit configured to change the power transistor to a completely on or off state with the aid of a control signal supplied to the control electrode. A series circuit includes a semiconductor switching element and a capacitor. The series circuit is connected in parallel with the load path and the capacitor provides a supply voltage for the driver circuit.
摘要翻译：电源电路。一个实施例提供了用于驱动具有控制电极和负载路径的功率晶体管的电路。电路包括驱动器电路，其配置为借助于提供给控制电极的控制信号将功率晶体管改变为完全导通或截止状态。串联电路包括半导体开关元件和电容器。串联电路与负载路径并联连接，电容为驱动电路提供电源电压。

14. 发明授权

US07708584B2 Semiconductor circuit arrangement 有权
标题翻译：半导体电路布置
公开(公告)号：US07708584B2
公开(公告)日：2010-05-04
申请号：US11756072
申请日：2007-05-31
申请人： Martin Hierholzer , Patrick Baginski , Michael Hornkamp , Uwe Jansen
发明人： Martin Hierholzer , Patrick Baginski , Michael Hornkamp , Uwe Jansen
IPC分类号： H01R13/00
CPC分类号： H05K3/325 , H01L23/051 , H01L23/4006 , H01L24/72 , H01L25/072 , H01L2023/4062 , H01L2023/4081 , H01L2924/01005 , H01L2924/01006 , H01L2924/0102 , H01L2924/01033 , H01L2924/01068 , H01L2924/01078 , H01L2924/01082 , H01L2924/1301 , H01L2924/13055 , H01L2924/13091 , H01L2924/14 , H01L2924/16195 , H01L2924/181 , H01L2924/3011 , H05K2201/10265 , H05K2201/10409 , H01L2924/00
摘要： A semiconductor circuit arrangement is disclosed. In one embodiment, a semiconductor module is attached to a board using a screw, with a mechanical and electrical contact being made between module contacts on the semiconductor module and associated board contacts on the board at the same time by attachment using the screw.
摘要翻译：公开了一种半导体电路装置。在一个实施例中，使用螺钉将半导体模块附接到板上，通过使用螺钉的附接，在半导体模块上的模块触点和板上的相关板触点之间同时进行机械和电接触。

15. 发明申请

US20090140399A1 Semiconductor Module with Switching Components and Driver Electronics 有权
标题翻译：具有开关元件和驱动器电子的半导体模块
公开(公告)号：US20090140399A1
公开(公告)日：2009-06-04
申请号：US11947279
申请日：2007-11-29
申请人： Martin Schulz , Uwe Jansen
发明人： Martin Schulz , Uwe Jansen
IPC分类号： H01L23/552 , H01L23/02 , H01L21/00
CPC分类号： H01L25/162 , H01L23/041 , H01L23/552 , H01L24/29 , H01L24/32 , H01L24/48 , H01L25/0652 , H01L25/0655 , H01L25/071 , H01L25/072 , H01L2224/04026 , H01L2224/48091 , H01L2224/48137 , H01L2924/00014 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/10253 , H01L2924/16195 , H01L2924/181 , H01L2924/19042 , H01L2924/19043 , H01L2924/3025 , H05K1/0239 , H05K1/0298 , H05K1/144 , H05K1/165 , H05K2201/09481 , H05K2201/09518 , H05K2201/10689 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor module comprises at least one semiconductor chip having at least one semiconductor switch. The at least one semiconductor chip is arranged on a carrier substrate. At least one driver component drives the at least one semiconductor switch. The at least one driver component is arranged on a circuit board. The at least one driver component has at least one input for receiving a control signal. The circuit board has a galvanic isolation in a signal path between the at least one driver component and the at least one semiconductor chip.
摘要翻译：半导体模块包括具有至少一个半导体开关的至少一个半导体芯片。至少一个半导体芯片布置在载体基板上。至少一个驱动器部件驱动至少一个半导体开关。至少一个驱动器部件布置在电路板上。所述至少一个驱动器部件具有用于接收控制信号的至少一个输入。电路板在至少一个驱动器部件和至少一个半导体芯片之间的信号路径中具有电流隔离。

16. 发明申请

US20090079529A1 INTEGRATED CIRCUIT INCLUDING INDUCTIVE DEVICE AND FERROMAGNETIC MATERIAL 有权
标题翻译：集成电路，包括电感器件和非线性材料
公开(公告)号：US20090079529A1
公开(公告)日：2009-03-26
申请号：US11860848
申请日：2007-09-25
申请人： Bernhard Knott , Josef Hoglauer , Uwe Jansen
发明人： Bernhard Knott , Josef Hoglauer , Uwe Jansen
IPC分类号： H01F27/30 , H01F37/00
CPC分类号： H01F17/0006 , H01F41/046 , H01F2017/0066 , H01L23/5227 , H01L2924/0002 , Y10T29/4902 , H01L2924/00
摘要： An integrated circuit includes a substrate and an inductive device on a first side of the substrate. The integrated circuit includes a first ferromagnetic material on a second side of the substrate opposite the first side.
摘要翻译：集成电路包括在基板的第一侧上的基板和感应装置。该集成电路包括在与第一侧相对的基板的第二侧上的第一铁磁材料。

17. 发明申请

US20070278669A1 SEMICONDUCTOR CIRCUIT ARRANGEMENT 有权
标题翻译：半导体电路布置
公开(公告)号：US20070278669A1
公开(公告)日：2007-12-06
申请号：US11756072
申请日：2007-05-31
申请人： Martin Hierholzer , Patrick Baginski , Michael Hornkamp , Uwe Jansen
发明人： Martin Hierholzer , Patrick Baginski , Michael Hornkamp , Uwe Jansen
IPC分类号： H01L23/34
CPC分类号： H05K3/325 , H01L23/051 , H01L23/4006 , H01L24/72 , H01L25/072 , H01L2023/4062 , H01L2023/4081 , H01L2924/01005 , H01L2924/01006 , H01L2924/0102 , H01L2924/01033 , H01L2924/01068 , H01L2924/01078 , H01L2924/01082 , H01L2924/1301 , H01L2924/13055 , H01L2924/13091 , H01L2924/14 , H01L2924/16195 , H01L2924/181 , H01L2924/3011 , H05K2201/10265 , H05K2201/10409 , H01L2924/00
摘要： A semiconductor circuit arrangement is disclosed. In one embodiment, a semiconductor module is attached to a board using a screw, with a mechanical and electrical contact being made between module contacts on the semiconductor module and associated board contacts on the board at the same time by attachment using the screw.
摘要翻译：公开了一种半导体电路装置。在一个实施例中，使用螺钉将半导体模块附接到板上，通过使用螺钉的附接，在半导体模块上的模块触点和板上的相关板触点之间同时进行机械和电接触。

18. 发明授权

US08149080B2 Integrated circuit including inductive device and ferromagnetic material 有权
标题翻译：集成电路包括电感器件和铁磁材料
公开(公告)号：US08149080B2
公开(公告)日：2012-04-03
申请号：US11860848
申请日：2007-09-25
申请人： Bernhard Knott , Josef Höglauer , Uwe Jansen
发明人： Bernhard Knott , Josef Höglauer , Uwe Jansen
IPC分类号： H01F5/00 , H01F27/28 , H01L27/08
CPC分类号： H01F17/0006 , H01F41/046 , H01F2017/0066 , H01L23/5227 , H01L2924/0002 , Y10T29/4902 , H01L2924/00
摘要： An integrated circuit includes a substrate and an inductive device on a first side of the substrate. The integrated circuit includes a first ferromagnetic material on a second side of the substrate opposite the first side.
摘要翻译：集成电路包括在基板的第一侧上的基板和感应装置。该集成电路包括在与第一侧相对的基板的第二侧上的第一铁磁材料。

19. 发明授权

US07988354B2 Temperature detection for a semiconductor component 有权
标题翻译：半导体元件的温度检测
公开(公告)号：US07988354B2
公开(公告)日：2011-08-02
申请号：US11964116
申请日：2007-12-26
申请人： Uwe Jansen
发明人： Uwe Jansen
IPC分类号： G01K7/01 , G01K7/14 , H01L29/00
CPC分类号： G01K7/16 , G01K1/14 , G01K2217/00 , H01L2924/0002 , H03K17/08128 , H03K2017/0806 , H01L2924/00
摘要： Temperature detection for a semiconductor component is disclosed. One embodiment includes a circuit arrangement for measuring a junction temperature of a semiconductor component that has a gate electrode and a control terminal being connected to the gate electrode and receiving a control signal for charging and discharging the gate electrode, where the gate electrode is internally connected to the control terminal via an internal gate resistor. The circuit arrangement includes: a measuring bridge circuit including the internal gate resistor and providing a measuring voltage which is dependent on the temperature dependent resistance of the internal gate resistor; an evaluation circuit receiving the measuring voltage and providing an output signal dependent on the junction temperature; a pulse generator providing a pulse signal including pulses for partially charging or discharging the gate electrode via the internal gate resistor.
摘要翻译：公开了半导体部件的温度检测。一个实施例包括用于测量具有栅极电极和控制端子的半导体部件的结温的电路装置，所述控制端子连接到栅电极并且接收用于对栅电极进行充电和放电的控制信号，其中栅电极在内部连接通过内部栅极电阻连接到控制端子。所述电路装置包括：包括所述内部栅极电阻器并提供取决于所述内部栅极电阻器的与温度相关的电阻的测量电压的测量电路电路; 接收测量电压并提供取决于结温的输出信号的评估电路; 脉冲发生器提供脉冲信号，该脉冲信号包括用于经由内部栅极电阻器部分地充电或放电栅电极的脉冲。

20. 发明申请

US20110254018A1 Semiconductor Switching Arrangement Having a Normally on and a Normally off Transistor 有权
标题翻译：具有常开和常闭晶体管的半导体开关布置
公开(公告)号：US20110254018A1
公开(公告)日：2011-10-20
申请号：US13086639
申请日：2011-04-14
申请人： Daniel Domes , Uwe Jansen
发明人： Daniel Domes , Uwe Jansen
IPC分类号： H01L29/12 , H01L21/02
CPC分类号： H03K17/063 , H03K2017/066 , H03K2017/6875 , Y10T29/41
摘要： A semiconductor switching arrangement includes a normally on semiconductor component of a first conduction type and a normally off semiconductor component of a second conduction type which is the complement of the first conduction type. A load path of the normally off semiconductor component is connected in series with the load path of the normally on semiconductor component. A first actuation circuit connected between the control connection of the normally on semiconductor component and a load path connection of the normally on semiconductor component. The load path connection of the normally on semiconductor component is arranged between the normally on and normally off semiconductor components. A second actuation circuit is connected between the control connection of the normally off semiconductor component and a load path connection of the normally off semiconductor component. The load path connection of the normally off semiconductor component is arranged between the normally on and normally off semiconductor components.
摘要翻译：半导体开关装置包括作为第一导电类型的互补的第二导电类型的常开半导体元件和第二导电类型的常关半导体元件。常关半导体部件的负载路径与正常导通的半导体部件的负载路径串联连接。连接在正常导通半导体部件的控制连接和正常导通的半导体部件的负载路径连接之间的第一致动电路。正常导通的半导体部件的负载路径连接被布置在正常和常关的半导体部件之间。第二驱动电路连接在常关半导体部件的控制连接和常关半导体部件的负载路径连接之间。正常关闭半导体部件的负载路径连接被布置在正常关闭和常关的半导体部件之间。

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