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11. 发明授权

US06548334B1 Capping layer 失效
标题翻译：封盖层
公开(公告)号：US06548334B1
公开(公告)日：2003-04-15
申请号：US10179061
申请日：2002-06-24
申请人： Tuan Duc Pham , Mark T. Ramsbey , Sameer S. Haddad , Angela T. Hui
发明人： Tuan Duc Pham , Mark T. Ramsbey , Sameer S. Haddad , Angela T. Hui
IPC分类号： H01L21337
CPC分类号： H01L27/11526 , H01L27/105 , H01L27/11543
摘要： A method of fabricating an improved flash memory device having core stacks and periphery stacks which are protected with an oxide layer, a protective layer and an insulating layer. A high energy dopant implant is used to pass the dopant through the insulating layer, the protective layer and oxide layer into the substrate to create source and drain regions, without using a self aligned etch. The flash memory device has an intermetallic dielectric layer placed over the core stacks and the periphery stacks. A tungsten plug is placed in the intermetallic dielectric layer to provide an electrical connection to the drain of the flash memory device. The use of a high energy dopant implant to pass through dopant through the insulating layer, the protective layer and the oxide layer into the substrate without the use of a self aligned source etch, reduces damage to the core stacks and periphery stacks caused by various etches during the production of the flash memory device and provides insulation to reduce unwanted current between the tungsten plug and the stacks.
摘要翻译：一种制造具有由氧化层，保护层和绝缘层保护的芯堆叠和外围堆叠的改进的闪存器件的方法。使用高能掺杂剂注入来使掺杂剂通过绝缘层，保护层和氧化物层进入衬底以产生源区和漏区，而不使用自对准蚀刻。闪存器件具有放置在芯堆叠和外围堆叠体上的金属间介电层。将钨塞放置在金属间介电层中以提供与闪存器件的漏极的电连接。使用高能掺杂剂注入物通过掺杂剂通过绝缘层，保护层和氧化物层进入衬底而不使用自对准源蚀刻，减少了由各种蚀刻引起的芯堆叠和外围堆叠的损坏在制造闪速存储器件期间提供绝缘以减少钨插头和堆叠之间的不必要的电流。

12. 发明授权

US06268624B1 Method for inhibiting tunnel oxide growth at the edges of a floating gate during semiconductor device processing 有权
标题翻译：在半导体器件处理期间抑制浮栅的边缘处的隧道氧化物生长的方法
公开(公告)号：US06268624B1
公开(公告)日：2001-07-31
申请号：US09364982
申请日：1999-07-31
申请人： Daniel Sobek , Timothy Thurgate , Carl R. Huster , Tuan Duc Pham , Mark T. Ramsbey , Sameer S. Haddad
发明人： Daniel Sobek , Timothy Thurgate , Carl R. Huster , Tuan Duc Pham , Mark T. Ramsbey , Sameer S. Haddad
IPC分类号： H01L218247
CPC分类号： H01L21/28273
摘要： A method for making a ULSI MOSFET chip includes forming a MOSFET gate stack on a substrate, with a tunnel oxide layer being sandwiched between the gate stack and substrate. To prevent thickening of the tunnel oxide layer into a “gate edge lifting” profile during subsequent oxidation-causing steps, at least one protective barrier film is deposited or grown over the gate stack and tunnel oxide layer immediately after gate stack formation. Then, subsequent steps, including forming source and drain regions for the gate stack, can be undertaken without causing thickening of the tunnel oxide layer.
摘要翻译：制造ULSI MOSFET芯片的方法包括在衬底上形成MOSFET栅极叠层，其中隧道氧化层夹在栅叠层和衬底之间。为了防止隧道氧化物层在随后的氧化引发步骤期间增厚到“栅极边缘提升”轮廓中，在栅极堆叠形成之后立即沉积或生长至少一个保护性阻挡膜在栅极堆叠和隧道氧化物层上。然后，可以进行包括形成栅极堆叠的源极和漏极区域的后续步骤，而不会导致隧道氧化物层的增厚。

13. 发明授权

US06589841B1 Charge gain/charge loss junction leakage prevention for flash technology by using double isolation/capping layer between lightly doped drain and gate 失效
公开(公告)号：US06589841B1
公开(公告)日：2003-07-08
申请号：US10180772
申请日：2002-06-25
申请人： Tuan Duc Pham , Mark T. Ramsbey , Sameer S. Haddad , Angela T. Hui
发明人： Tuan Duc Pham , Mark T. Ramsbey , Sameer S. Haddad , Angela T. Hui
IPC分类号： H01L29788
CPC分类号： H01L27/11526 , H01L27/105 , H01L27/11543
摘要： An improved flash memory device having core stacks and periphery stacks which are protected by first and second thin side walls, side spacers over the side walls, and an HTO layer over the stacks, and side spacer. The flash memory device has an intermetallic dielectric layer placed over the HTO layer. A tungsten plug is placed in the intermetallic dielectric layer to provide an electrical connection to the drain of the flash memory device. The additional first and second side walls reduce current leakage between core stacks and the tungsten plug and help to protect the stacks during fabrication.

14. 发明授权

US06867097B1 Method of making a memory cell with polished insulator layer 有权
标题翻译：制造具有抛光绝缘体层的存储单元的方法
公开(公告)号：US06867097B1
公开(公告)日：2005-03-15
申请号：US09430366
申请日：1999-10-28
申请人： Mark T. Ramsbey , Robert B. Ogle , Tommy C. Hsiao , Angela T. Hui , Tuan Duc Pham , Marina V. Plat , Lewis Shen
发明人： Mark T. Ramsbey , Robert B. Ogle , Tommy C. Hsiao , Angela T. Hui , Tuan Duc Pham , Marina V. Plat , Lewis Shen
IPC分类号： H01L21/28 , H01L21/3105 , H01L21/314 , H01L21/316 , H01L21/336
CPC分类号： H01L29/66825 , H01L21/28273 , H01L21/31053 , H01L21/3144 , H01L21/31612
摘要： An improved method of making a flash memory cell including a substrate having a floating gate of a first thickness includes depositing an insulator on the substrate and over the floating gate. The insulator is preferably a high quality oxide. A portion of the insulator not covering the floating gate has a second thickness which is greater than the first thickness of the floating gate. The method further includes polishing the insulator until the second thickness is substantially equal to the first thickness. Polishing results in a planar floating gate and insulator layer. The method further includes sequentially depositing a dielectric layer and a control gate layer on the planar floating gate and insulator layer and then etching these layers to complete the stacked gate structure of the memory cell.
摘要翻译：制造包括具有第一厚度的浮动栅极的衬底的闪存单元的改进方法包括在衬底上并在浮动栅极上沉积绝缘体。绝缘体优选是高质量的氧化物。不覆盖浮动栅极的绝缘体的一部分具有大于浮栅的第一厚度的第二厚度。该方法还包括抛光绝缘体，直到第二厚度基本上等于第一厚度。抛光导致平面浮栅和绝缘体层。该方法还包括在平面浮置栅极和绝缘体层上依次沉积介电层和控制栅极层，然后蚀刻这些层以完成存储单元的堆叠栅极结构。

15. 发明授权

US06465835B1 Charge gain/charge loss junction leakage prevention for flash technology by using double isolation/capping layer between lightly doped drain and gate 有权
标题翻译：通过在轻掺杂漏极和栅极之间使用双重隔离/覆盖层，对闪存技术进行充电增益/电荷损耗结漏电防护
公开(公告)号：US06465835B1
公开(公告)日：2002-10-15
申请号：US09487964
申请日：2000-01-18
申请人： Tuan Duc Pham , Mark T. Ramsbey , Sameer S. Haddad , Angela T. Hui
发明人： Tuan Duc Pham , Mark T. Ramsbey , Sameer S. Haddad , Angela T. Hui
IPC分类号： H01L29788
CPC分类号： H01L27/11526 , H01L27/105 , H01L27/11543
摘要： An improved flash memory device having core stacks and periphery stacks which are protected by first and second thin side walls, side spacers over the side walls, and an HTO layer over the stacks, and side spacer. The flash memory device has an intermetallic dielectric layer placed over the HTO layer. A tungsten plug is placed in the intermetallic dielectric layer to provide an electrical connection to the drain of the flash memory device. The additional first and second side walls reduce current leakage between core stacks and the tungsten plug and help to protect the stacks during fabrication.
摘要翻译：具有由第一和第二薄侧壁，侧壁上的侧隔离物以及叠层上的HTO层和侧隔板保护的芯堆叠和外围堆叠的改进的闪存器件。闪存器件具有置于HTO层上的金属间介电层。将钨塞放置在金属间介电层中以提供与闪存器件的漏极的电连接。附加的第一和第二侧壁减小了芯堆叠和钨插头之间的电流泄漏，并有助于在制造期间保护堆叠。

16. 发明授权

US06337246B1 Method for inhibiting tunnel oxide growth at the edges of a floating gate during semiconductor device processing 有权
标题翻译：在半导体器件处理期间抑制浮栅的边缘处的隧道氧化物生长的方法
公开(公告)号：US06337246B1
公开(公告)日：2002-01-08
申请号：US09824841
申请日：2001-04-02
申请人： Daniel Sobek , Timothy Thurgate , Carl R. Huster , Tuan Duc Pham , Mark T. Ramsbey , Sameer S. Haddad
发明人： Daniel Sobek , Timothy Thurgate , Carl R. Huster , Tuan Duc Pham , Mark T. Ramsbey , Sameer S. Haddad
IPC分类号： H01L218247
CPC分类号： H01L21/28273
摘要： A method for making a ULSI MOSFET chip includes forming a MOSFET gate stack on a substrate, with a tunnel oxide layer being sandwiched between the gate stack and substrate. To prevent thickening of the tunnel oxide layer into a “gate edge lifting” profile during subsequent oxidation-causing steps, at least one protective barrier film is deposited or grown over the gate stack and tunnel oxide layer immediately after gate stack formation. Then, subsequent steps, including forming source and drain regions for the gate stack, can be undertaken without causing thickening of the tunnel oxide layer.
摘要翻译：制造ULSI MOSFET芯片的方法包括在衬底上形成MOSFET栅极叠层，其中隧道氧化层夹在栅叠层和衬底之间。为了防止隧道氧化物层在随后的氧化引发步骤期间增厚到“栅极边缘提升”轮廓中，在栅极堆叠形成之后立即沉积或生长至少一个保护性阻挡膜在栅极堆叠和隧道氧化物层上。然后，可以进行包括形成栅极堆叠的源极和漏极区域的后续步骤，而不会导致隧道氧化物层的增厚。

17. 发明授权

US06730564B1 Salicided gate for virtual ground arrays 有权
标题翻译：用于虚拟地面阵列的闸门
公开(公告)号：US06730564B1
公开(公告)日：2004-05-04
申请号：US10217821
申请日：2002-08-12
申请人： Mark T. Ramsbey , Yu Sun , Chi Chang , Hidehiko Shiraiwa
发明人： Mark T. Ramsbey , Yu Sun , Chi Chang , Hidehiko Shiraiwa
IPC分类号： H01L218247
CPC分类号： H01L27/11568 , H01L27/105 , H01L27/115 , H01L27/11526 , H01L27/11534 , Y10S438/954
摘要： The present invention provides a process for saliciding word lines in a virtual ground array flash memory device without causing shorting between bit lines. According to one aspect of the invention, saliciding takes place prior to patterning one or more layers of a memory cell stack. The unpatterned layers protect the substrate between word lines from becoming salicided. The invention provides virtual ground array flash memory devices with doped and salicided word lines, but no shorting between bit lines, even in virtual ground arrays where there are no oxide island isolation regions between word lines. Potential advantages of such structures include reduced size, reduced number of processing steps, and reduced exposure to high temperature cycling.
摘要翻译：本发明提供了一种在虚拟接地阵列闪存器件中对字线进行水印处理，而不引起位线之间的短路。根据本发明的一个方面，在对存储单元堆叠的一层或多层进行构图之前进行水化。未图案化的层保护字线之间的基板不会变成水银。本发明提供具有掺杂和含水字线的虚拟接地阵列闪存器件，但是即使在字线之间没有氧化物岛隔离区域的虚拟接地阵列中也不会在位线之间发生短路。这种结构的潜在优点包括减小的尺寸，减少的加工步骤数量以及降低暴露于高温循环。

18. 发明授权

US06455373B1 Semiconductor device having gate edges protected from charge gain/loss 有权
标题翻译：具有防止电荷增益/损耗的栅极边缘的半导体器件
公开(公告)号：US06455373B1
公开(公告)日：2002-09-24
申请号：US09834419
申请日：2001-04-12
申请人： Tuan D. Pham , Mark T. Ramsbey , Sameer S. Haddad , Angela T. Hui , Yu Sun , Chi Chang
发明人： Tuan D. Pham , Mark T. Ramsbey , Sameer S. Haddad , Angela T. Hui , Yu Sun , Chi Chang
IPC分类号： H01L21336
CPC分类号： H01L27/11526 , H01L21/823468 , H01L27/105 , H01L27/11536
摘要： A plurality of core gate stacks and periphery gates on the substrate, each core gate stack and periphery gate having at least one side and first and second protective shoulders formed on said plurality of core gate stacks and periphery gates, such that a dopant can be implanted sequentially into source and drain regions of a substrate supporting the stacks to establish transistors and such that charge migration into said at least one side of the gate stacks during interlayer dielectric (ILD) formation and device metallization is prevented, at least the second shoulder being frabricated from at least one material selected from a group consisting essentially of nitride and silicon oxynitride (SiON).
摘要翻译：在基板上的多个核心栅极叠层和周边栅极，每个芯栅极叠层和周边栅极具有形成在所述多个芯栅极叠层和外围栅极上的至少一个侧面和第一和第二保护肩部，使得掺杂剂可被植入顺序地进入支撑堆叠的衬底的源极和漏极区域以建立晶体管，并且防止在层间电介质（ILD）形成和器件金属化期间电荷迁移到栅极叠层的所述至少一个侧面，至少第二肩部被破坏选自由氮化物和氮氧化硅（SiON）组成的组中的至少一种材料。

19. 发明授权

US06248627B1 Method for protecting gate edges from charge gain/loss in semiconductor device 有权
标题翻译：在半导体器件中保护栅极边缘免受电荷增益/损耗的方法
公开(公告)号：US06248627B1
公开(公告)日：2001-06-19
申请号：US09376658
申请日：1999-08-18
申请人： Tuan D. Pham , Mark T. Ramsbey , Sameer S. Haddad , Angela T. Hui , Yu Sun , Chi Chang
发明人： Tuan D. Pham , Mark T. Ramsbey , Sameer S. Haddad , Angela T. Hui , Yu Sun , Chi Chang
IPC分类号： H01L21336
CPC分类号： H01L27/11526 , H01L21/823468 , H01L27/105 , H01L27/11536
摘要： A method for making a ULSI MOSFET includes covering core gate stacks with a first protective layer, etching away the first layer such that intended source regions of the substrate are exposed, and implanting dopant into the source regions. A second protective layer is then deposited over the first layer and is etched back to conform to the first layer, covering only the sides of the gate stacks, and exposing intended drain regions of the substrate. Dopant is then implanted into the drain regions. During subsequent manufacturing steps including ILD formation and metallization, mobile ions and other process-induced charges are blocked from entering the floating gates of the gate stacks by the protective layers, thereby preventing unwanted charge gain/loss.
摘要翻译：制造ULSI MOSFET的方法包括用第一保护层覆盖芯栅极叠层，蚀刻掉第一层，使得衬底的预期源极区域暴露，并将掺杂剂注入到源极区域中。然后在第一层上沉积第二保护层，并将其回蚀刻以符合第一层，仅覆盖栅极堆叠的侧面，并暴露衬底的预期漏极区域。然后将掺杂剂注入漏区。在包括ILD形成和金属化的后续制造步骤期间，阻止移动离子和其它工艺感应电荷被保护层进入栅极堆叠的浮置栅极，从而防止不必要的电荷增益/损耗。

20. 发明授权

US6160317A Method of spacer formation and source protection after self-aligned source formed and a device provided by such a method 有权
标题翻译：自对准源形成后的间隔物形成和源保护方法以及通过这种方法提供的器件
公开(公告)号：US6160317A
公开(公告)日：2000-12-12
申请号：US336057
申请日：1999-06-18
申请人： Yu Sun , Chi Chang , Mark T. Ramsbey
发明人： Yu Sun , Chi Chang , Mark T. Ramsbey
IPC分类号： H01L21/8247 , H01L27/105 , H01L27/088
CPC分类号： H01L27/11526 , H01L27/105 , H01L27/11536
摘要： The present invention provides a semiconductor device and a method for providing such a semiconductor device which allows a field oxide etch while minimizing the damage to the silicon. This method is particularly useful for smaller semiconductor devices, for example, such as a semiconductor device utilizing core source spacing less than 0.4 microns. A method according to the present invention for providing a semiconductor device comprises the steps of depositing a first spacer oxide layer over a core area and a peripheral area of a semiconductor device; etching the first spacer oxide layer at the source side of core cell area; depositing a second spacer oxide layer over the core area and the peripheral area, and etching the first and second spacer oxide layers over the peripheral area only.
摘要翻译：本发明提供了一种用于提供这种半导体器件的半导体器件和方法，其允许场氧化物蚀刻同时最小化对硅的损害。该方法对于较小的半导体器件特别有用，例如，诸如利用芯源间距小于0.4微米的半导体器件。根据本发明的用于提供半导体器件的方法包括以下步骤：在半导体器件的芯区域和周边区域上沉积第一间隔氧化物层; 在核心区域的源极处蚀刻第一间隔氧化物层; 在芯区域和外围区域上沉积第二间隔氧化物层，并且仅在周边区域上蚀刻第一和第二间隔氧化物层。

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