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    • 16. 发明授权
    • System in-package test inspection apparatus and test inspection method
    • 系统包装试验检验装置及试验检验方法
    • US07414422B2
    • 2008-08-19
    • US11108861
    • 2005-04-19
    • Masahiro AoyagiHiroshi NakagawaKazuhiko TokoroKatsuya KikuchiYoshikuni OkadaHiroyuki FujitaKenichi Kobayashi
    • Masahiro AoyagiHiroshi NakagawaKazuhiko TokoroKatsuya KikuchiYoshikuni OkadaHiroyuki FujitaKenichi Kobayashi
    • G01R31/26
    • G01R31/2822H01L2224/05568H01L2224/05573H01L2224/16225H01L2224/48091H01L2224/48137H01L2224/48145H01L2224/48227H01L2924/00014H01L2924/15192H01L2924/15311H01L2224/05599H01L2924/00012
    • A system in-package test inspection apparatus for measuring and evaluating the high-speed/high frequency characteristic of a system in-package through an electrode pad in which I/O terminals are formed on one side of an LSI package containing metallic wiring internally and plural LSI chips are stacked in multiple layers on the other face while electric connection between the LSI chip and the LSI package and the electric connection between the LSI chips are implemented, the system in-package test inspection apparatus comprising: a printed wiring substrate to which the I/O terminals of the system in-package are connected to enable transmission of high speed and high frequency signals; LSI chip driving means for driving the LSI chip; a contact probe having a contact electrode and for transmitting a high frequency signal; evaluation signal generating means for supplying a high frequency evaluation signal to the contact probe; output signal detecting means for detecting an output signal of the system in-package through the printed wiring board; and analyzing means for analyzing a signal detected by the output signal detecting means, wherein by contacting the contact electrode of the contact probe with an electrode pad formed on the LSI chip, the evaluation signal is inputted to the LSI chip not through metallic wiring within the LSI package.
    • 一种用于测量和评估通过其内部形成有包含金属布线的LSI封装的一侧上的I / O端子的电极焊盘的系统的封装中的高速/高频特性的系统级封装测试检查装置, 在LSI芯片和LSI封装之间的电连接和LSI芯片之间的电连接被实现的同时,多个LSI芯片被堆叠在多个层中,该系统的封装测试检查装置包括:印刷布线基板, 连接系统内置的I / O端子,实现高速和高频信号的传输; 用于驱动LSI芯片的LSI芯片驱动装置; 具有接触电极并用于发送高频信号的接触探针; 评估信号发生装置,用于向接触探针提供高频评估信号; 输出信号检测装置,用于检测通过印刷电路板的封装中的系统的输出信号; 以及分析装置,用于分析由输出信号检测装置检测到的信号,其中通过使接触探针的接触电极与形成在LSI芯片上的电极焊盘接触,评估信号不通过金属布线输入到LSI芯片 LSI封装。
    • 19. 发明授权
    • Microconnector and manufacturing method of socket therefor
    • 微型连接器及其插座的制造方法
    • US07220147B2
    • 2007-05-22
    • US10541237
    • 2004-01-26
    • Hiroyuki FujitaHiroto Mochizuki
    • Hiroyuki FujitaHiroto Mochizuki
    • H01R24/00
    • H01R12/57
    • A microconnector in which elastic contact force is improved and a manufacturing method of a socket therefore, are provided.The microconnector includes: the socket 10 in which plural cantilever terminal blocks 14 having pressure receiving parts 16 are integrally formed on a board 11 made of single crystal silicon, and socket leads 15 are disposed on the terminal blocks 14; and a plug 20 in which plug leads 21 corresponding to the socket leads 15 are provided on a plug board 23. The manufacturing method of the socket 10 includes: a step of applying a resist to one surface of the board 11; a step of patterning the terminal blocks 14 by photolithography; a step of performing anisotropic etching to form the terminal blocks 14 to predetermined heights while a bottom is made to remain; a step of applying a resist to the other surface of the board 11; a step of patterning the pressure receiving parts 16 by photolithography; and a step of performing isotropic etching to remove the bottom.
    • 提供了弹性接触力提高的微型连接器及其插座的制造方法。 微型连接器包括:插座10,其中具有受压部分16的多个悬臂端子块14一体地形成在由单晶硅制成的板11上,并且插座引线15设置在端子块14上; 并且在插头板23上设置有与插座引线15对应的插头引线21的插头20。插座10的制造方法包括:将抗蚀剂涂布在基板11的一个面上的工序; 通过光刻对端子块14进行构图的步骤; 在保持底部的同时进行各向异性蚀刻以形成端子块14至预定高度的步骤; 将抗蚀剂施加到板11的另一个表面的步骤; 通过光刻对压力接收部16进行图案化的步骤; 以及进行各向同性蚀刻以去除底部的步骤。