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11. 发明授权

US07324855B2 Process-state management system, management server and control server adapted for the system, method for managing process-states, method for manufacturing a product, and computer program product for the management server 失效
标题翻译：适用于系统的过程状态管理系统，管理服务器和控制服务器，用于管理过程状态的方法，用于制造产品的方法以及用于管理服务器的计算机程序产品
公开(公告)号：US07324855B2
公开(公告)日：2008-01-29
申请号：US11217592
申请日：2005-09-02
申请人： Yukihiro Ushiku , Hidenori Kakinuma , Tsutomu Miki , Junji Sugamoto , Akira Ogawa , Yoshinori Ookawauchi , Giichi Inoue , Tomomi Ino
发明人： Yukihiro Ushiku , Hidenori Kakinuma , Tsutomu Miki , Junji Sugamoto , Akira Ogawa , Yoshinori Ookawauchi , Giichi Inoue , Tomomi Ino
IPC分类号： G06F19/00
CPC分类号： G05B19/41865 , G05B2219/31372 , G05B2219/31395 , G05B2219/31455 , G06Q30/0283 , Y02P90/12 , Y02P90/18 , Y02P90/20
摘要： A process-state management system encompasses: a plurality of production machines; a control server configured to collectively control at least part of the production machines; a management server including a data-linking module configured to link operation-management data of the production machines with corresponding management information transmitted from the control server, respectively, the management server analyze the operation-management data linked with the management information with a common analysis application; and a management database configured to store the operation-management data linked with the management information.
摘要翻译：过程状态管理系统包括：多个生产机器; 控制服务器，其被配置为共同控制所述生产机器的至少一部分; 管理服务器，其包括分别将生产机的运行管理数据与从控制服务器发送的相应的管理信息相连接的数据链接模块，所述管理服务器分析与所述管理信息相关联的运行管理数据，应用; 以及管理数据库，被配置为存储与管理信息相关联的操作管理数据。

12. 发明申请

US20060287754A1 Process control system, process control method, and method of manufacturing electronic apparatus 有权
公开(公告)号：US20060287754A1
公开(公告)日：2006-12-21
申请号：US11471675
申请日：2006-06-21
申请人： Junji Sugamoto , Yukihiro Ushiku , Kazutaka Akiyama , Shoichi Harakawa
发明人： Junji Sugamoto , Yukihiro Ushiku , Kazutaka Akiyama , Shoichi Harakawa
IPC分类号： G06F19/00
CPC分类号： G05B19/41875 , G05B2219/31477 , G05B2219/32057 , G05B2219/32097 , G05B2219/45031 , Y02P90/12 , Y02P90/20 , Y02P90/22
摘要： A process control system includes a client computer which prepares a correlation between a reference monitored value of apparatus information and a feature quantity, a manufacturing execution system which prepares a processing recipe describing, as a first setting value in an actual manufacturing process, a value of the control parameter, an apparatus information collection section which collects an objective monitored value of the apparatus information in operation of the actual manufacturing process with the first setting value, a feature quantity calculation section which calculates a value of a feature quantity corresponding to the objective monitored value based on the correlation, a parameter calculation section which calculates a second setting value in the actual manufacturing process on the basis of the value of the feature quantity, and an apparatus control unit which changes the processing recipe with the second setting value being as a setting value of the second step.

13. 发明申请

US20090276078A1 Process control system, process control method, and method of manufacturing electronic apparatus 有权
公开(公告)号：US20090276078A1
公开(公告)日：2009-11-05
申请号：US12458421
申请日：2009-07-10
申请人： Junji Sugamoto , Yukihiro Ushiku , Kazutaka Akiyama , Shoichi Harakawa
发明人： Junji Sugamoto , Yukihiro Ushiku , Kazutaka Akiyama , Shoichi Harakawa
IPC分类号： G06F19/00
CPC分类号： G05B19/41875 , G05B2219/31477 , G05B2219/32057 , G05B2219/32097 , G05B2219/45031 , Y02P90/12 , Y02P90/20 , Y02P90/22
摘要： A process control system includes a client computer which prepares a correlation between a reference monitored value of apparatus information and a feature quantity, a manufacturing execution system which prepares a processing recipe describing, as a first setting value in an actual manufacturing process, a value of the control parameter, an apparatus information collection section which collects an objective monitored value of the apparatus information in operation of the actual manufacturing process with the first setting value, a feature quantity calculation section which calculates a value of a feature quantity corresponding to the objective monitored value based on the correlation, a parameter calculation section which calculates a second setting value in the actual manufacturing process on the basis of the value of the feature quantity, and an apparatus control unit which changes the processing recipe with the second setting value being as a setting value of the second step.

14. 发明授权

US07596421B2 Process control system, process control method, and method of manufacturing electronic apparatus 有权
标题翻译：过程控制系统，过程控制方法和制造电子设备的方法
公开(公告)号：US07596421B2
公开(公告)日：2009-09-29
申请号：US11471675
申请日：2006-06-21
申请人： Junji Sugamoto , Yukihiro Ushiku , Kazutaka Akiyama , Shoichi Harakawa
发明人： Junji Sugamoto , Yukihiro Ushiku , Kazutaka Akiyama , Shoichi Harakawa
IPC分类号： G06F19/00
CPC分类号： G05B19/41875 , G05B2219/31477 , G05B2219/32057 , G05B2219/32097 , G05B2219/45031 , Y02P90/12 , Y02P90/20 , Y02P90/22
摘要： A process control system includes a client computer which prepares a correlation between a reference monitored value of apparatus information and a feature quantity, a manufacturing execution system which prepares a processing recipe describing, as a first setting value in an actual manufacturing process, a value of the control parameter, an apparatus information collection section which collects an objective monitored value of the apparatus information in operation of the actual manufacturing process with the first setting value, a feature quantity calculation section which calculates a value of a feature quantity corresponding to the objective monitored value based on the correlation, a parameter calculation section which calculates a second setting value in the actual manufacturing process on the basis of the value of the feature quantity, and an apparatus control unit which changes the processing recipe with the second setting value being as a setting value of the second step.
摘要翻译：过程控制系统包括：准备设备信息的参考监视值和特征量之间的相关性的客户端计算机;准备描述作为实际制造过程中的第一设定值的处理配方的制造执行系统，所述控制参数，设备信息收集部分，其在具有所述第一设定值的实际制造过程的操作中收集所述设备信息的客观监视值;特征量计算部，其计算与所监视的目标对应的特征量的值基于相关性的值，参数计算部，其基于特征量的值计算实际制造过程中的第二设定值;以及装置控制单元，其将处理配方改变为第二设定值为设定第二步的值。

15. 发明授权

US07831330B2 Process control system, process control method, and method of manufacturing electronic apparatus 有权
标题翻译：过程控制系统，过程控制方法和制造电子设备的方法
公开(公告)号：US07831330B2
公开(公告)日：2010-11-09
申请号：US12458421
申请日：2009-07-10
申请人： Junji Sugamoto , Yukihiro Ushiku , Kazutaka Akiyama , Shoichi Harakawa
发明人： Junji Sugamoto , Yukihiro Ushiku , Kazutaka Akiyama , Shoichi Harakawa
IPC分类号： G06F19/00
CPC分类号： G05B19/41875 , G05B2219/31477 , G05B2219/32057 , G05B2219/32097 , G05B2219/45031 , Y02P90/12 , Y02P90/20 , Y02P90/22
摘要： A process control system includes a client computer which prepares a correlation between a reference monitored value of apparatus information and a feature quantity, a manufacturing execution system which prepares a processing recipe describing, as a first setting value in an actual manufacturing process, a value of the control parameter, an apparatus information collection section which collects an objective monitored value of the apparatus information in operation of the actual manufacturing process with the first setting value, a feature quantity calculation section which calculates a value of a feature quantity corresponding to the objective monitored value based on the correlation, a parameter calculation section which calculates a second setting value in the actual manufacturing process on the basis of the value of the feature quantity, and an apparatus control unit which changes the processing recipe with the second setting value being as a setting value of the second step.
摘要翻译：过程控制系统包括：准备设备信息的参考监视值和特征量之间的相关性的客户端计算机;准备描述作为实际制造过程中的第一设定值的处理配方的制造执行系统，所述控制参数，设备信息收集部分，其在具有所述第一设定值的实际制造过程的操作中收集所述设备信息的客观监视值;特征量计算部，其计算与所监视的目标对应的特征量的值基于相关性的值，参数计算部，其基于特征量的值计算实际制造过程中的第二设定值;以及装置控制单元，其将处理配方改变为第二设定值为设定第二步的值。

16. 发明申请

US20060064188A1 Process-state management system, management server and control server adapted for the system, method for managing process-states, method for manufacturing a product, and computer program product for the management server 失效
标题翻译：适用于系统的过程状态管理系统，管理服务器和控制服务器，用于管理过程状态的方法，用于制造产品的方法以及用于管理服务器的计算机程序产品
公开(公告)号：US20060064188A1
公开(公告)日：2006-03-23
申请号：US11217592
申请日：2005-09-02
申请人： Yukihiro Ushiku , Hidenori Kakinuma , Tsutomu Miki , Junji Sugamoto , Akira Ogawa , Yoshinori Ookawauchi , Giichi Inoue , Tomomi Ino
发明人： Yukihiro Ushiku , Hidenori Kakinuma , Tsutomu Miki , Junji Sugamoto , Akira Ogawa , Yoshinori Ookawauchi , Giichi Inoue , Tomomi Ino
IPC分类号： G06F19/00
CPC分类号： G05B19/41865 , G05B2219/31372 , G05B2219/31395 , G05B2219/31455 , G06Q30/0283 , Y02P90/12 , Y02P90/18 , Y02P90/20
摘要： A process-state management system encompasses: a plurality of production machines; a control server configured to collectively control at least part of the production machines; a management server including a data-linking module configured to link operation-management data of the production machines with corresponding management information transmitted from the control server, respectively, the management server analyze the operation-management data linked with the management information with a common analysis application; and a management database configured to store the operation-management data linked with the management information.
摘要翻译：过程状态管理系统包括：多个生产机器; 控制服务器，其被配置为共同控制所述生产机器的至少一部分; 管理服务器，其包括分别将生产机的运行管理数据与从控制服务器发送的相应的管理信息相连接的数据链接模块，所述管理服务器分析与所述管理信息相关联的运行管理数据，应用; 以及管理数据库，被配置为存储与管理信息相关联的操作管理数据。

17. 发明申请

US20050233601A1 System and method for controlling manufacturing processes, and method for manufacturing a semiconductor device 失效
标题翻译：用于控制制造工艺的系统和方法，以及制造半导体器件的方法
公开(公告)号：US20050233601A1
公开(公告)日：2005-10-20
申请号：US11086220
申请日：2005-03-23
申请人： Norihiko Tsuchiya , Yukihiro Ushiku
发明人： Norihiko Tsuchiya , Yukihiro Ushiku
IPC分类号： H01L27/108 , H01L21/00 , H01L21/02 , H01L21/66 , H01L21/8242 , H01L21/8244 , H01L21/8247 , H01L27/11 , H01L27/115 , H01L29/78
CPC分类号： H01L21/67253 , H01L22/20 , H01L29/78 , H01L2924/0002 , H01L2924/00
摘要： A control system for a manufacturing process includes an inspection tool inspecting a dislocation image in semiconductor substrate processed by manufacturing processes; an inspection information input module configured to acquire the inspected dislocation image; a process condition input module acquiring process conditions of the manufacturing processes; a structure information input module acquiring structure of the semiconductor substrate processed by target manufacturing process; a stress analysis module calculating stresses at nodes provided in the structure, based on target process condition and the structure; an origin setting module providing origins at positions where stress concentration having stress value not less than reference value is predicted; a dislocation dynamics analysis module calculating dislocation pattern in stress field for each position of the origins; and a dislocation pattern comparison module comparing the dislocation pattern with the inspected dislocation image so as to determine whether the target manufacturing process is critical manufacturing process.
摘要翻译：用于制造工艺的控制系统包括检查通过制造工艺处理的半导体衬底中的位错图像的检查工具; 检查信息输入模块，被配置为获取所检查的位错图像; 过程条件输入模块获取制造过程的处理条件; 通过目标制造工艺处理的半导体衬底的结构信息输入模块获取结构; 应力分析模块，根据目标过程条件和结构计算结构中提供的节点处的应力; 原点设定模块，其在具有应力值不小于参考值的应力集中的位置处提供起点; 位错动力学分析模块计算各个位置的应力场位错模式; 以及位错图案比较模块，将位错图案与被检查的位错图像进行比较，以确定目标制造过程是否是关键的制造过程。

18. 发明授权

US5739575A Dielectrically isolated substrate and method for manufacturing the same 失效
标题翻译：绝缘基板及其制造方法
公开(公告)号：US5739575A
公开(公告)日：1998-04-14
申请号：US705647
申请日：1996-08-30
申请人： Masanori Numano , Norihiko Tsuchiya , Hiroyasu Kubota , Yoshiaki Matsushita , Yoshiki Hayashi , Yukihiro Ushiku , Atsushi Yagishita , Satoshi Inaba , Yasunori Okayama , Minoru Takahashi
发明人： Masanori Numano , Norihiko Tsuchiya , Hiroyasu Kubota , Yoshiaki Matsushita , Yoshiki Hayashi , Yukihiro Ushiku , Atsushi Yagishita , Satoshi Inaba , Yasunori Okayama , Minoru Takahashi
IPC分类号： H01L21/302 , H01L21/3065 , H01L21/322 , H01L21/74 , H01L21/76 , H01L21/762 , H01L27/08 , H01L29/00
CPC分类号： H01L21/76237 , H01L21/74
摘要： Element isolation technique for LSIs having a fine pattern of sub-micron class or finer. A high strained region doped with impurities at a high concentration is formed under, and remote from, a buried insulating material (dielectrics) layer for element isolation. With this buried dielectrics element isolation (BDEI) structure, since the high strained layer exists just under the buried dielectrics layer, crystal defects generated near the buried dielectrics layer due to strain caused by a difference of thermal expansion coefficient between a semiconductor layer and the buried dielectrics layer, are moved toward the high strained layer. Accordingly, the crystal defects do not reach an active region where active elements are formed, so that leakage current in the p-n junction formed in the active layer can be advantageously reduced.
摘要翻译：具有亚微米级精细图案或精细图案的LSI的元件隔离技术。在埋设绝缘材料（电介质）层的下面，远离用于元件隔离的方式形成掺杂高浓度杂质的高应变区。由于这种埋置的电介质元件隔离（BDEI）结构，由于高应变层存在于掩埋电介质层的正下方，所以由于半导体层与埋入层之间的热膨胀系数的差异引起的应变引起的掩埋电介质层附近产生的晶体缺陷电介质层向高应变层移动。因此，晶体缺陷不会到达形成有源元件的有源区域，从而有利地减少了形成在有源层中的p-n结中的泄漏电流。

19. 发明授权

US07188049B2 System and method for controlling manufacturing processes, and method for manufacturing a semiconductor device 失效
标题翻译：用于控制制造工艺的系统和方法，以及制造半导体器件的方法
公开(公告)号：US07188049B2
公开(公告)日：2007-03-06
申请号：US11086220
申请日：2005-03-23
申请人： Norihiko Tsuchiya , Yukihiro Ushiku
发明人： Norihiko Tsuchiya , Yukihiro Ushiku
IPC分类号： G06F15/00
CPC分类号： H01L21/67253 , H01L22/20 , H01L29/78 , H01L2924/0002 , H01L2924/00
摘要： A control system for a manufacturing process includes an inspection tool inspecting a dislocation image in semiconductor substrate processed by manufacturing processes; an inspection information input module configured to acquire the inspected dislocation image; a process condition input module acquiring process conditions of the manufacturing processes; a structure information input module acquiring structure of the semiconductor substrate processed by target manufacturing process; a stress analysis module calculating stresses at nodes provided in the structure, based on target process condition and the structure; an origin setting module providing origins at positions where stress concentration having stress value not less than reference value is predicted; a dislocation dynamics analysis module calculating dislocation pattern in stress field for each position of the origins; and a dislocation pattern comparison module comparing the dislocation pattern with the inspected dislocation image so as to determine whether the target manufacturing process is critical manufacturing process.
摘要翻译：用于制造工艺的控制系统包括检查通过制造工艺处理的半导体衬底中的位错图像的检查工具; 检查信息输入模块，被配置为获取所检查的位错图像; 过程条件输入模块获取制造过程的处理条件; 通过目标制造工艺处理的半导体衬底的结构信息输入模块获取结构; 应力分析模块，根据目标过程条件和结构计算结构中提供的节点处的应力; 原点设定模块，其在具有应力值不小于参考值的应力集中的位置处提供起点; 位错动力学分析模块计算各个位置的应力场位错模式; 以及位错图案比较模块，将位错图案与被检查的位错图像进行比较，以确定目标制造过程是否是关键的制造过程。

20. 发明授权

US5675176A Semiconductor device and a method for manufacturing the same 失效
标题翻译：半导体装置及其制造方法
公开(公告)号：US5675176A
公开(公告)日：1997-10-07
申请号：US530721
申请日：1995-09-15
申请人： Yukihiro Ushiku , Atsushi Yagishita , Satoshi Inaba , Minoru Takahashi , Masanori Numano , Yoshiki Hayashi , Yoshiaki Matsushita , Yasunori Okayama , Hiroyasu Kubota , Norihiko Tsuchiya
发明人： Yukihiro Ushiku , Atsushi Yagishita , Satoshi Inaba , Minoru Takahashi , Masanori Numano , Yoshiki Hayashi , Yoshiaki Matsushita , Yasunori Okayama , Hiroyasu Kubota , Norihiko Tsuchiya
IPC分类号： H01L27/092 , H01L27/108 , H01L29/10 , H01L29/30
CPC分类号： H01L27/0921 , H01L27/10808 , H01L29/1079
摘要： A semiconductor device has a semiconductor substrate having a groove, and a semiconductor element formed in a surface region of the semiconductor substrate. A substance having a thermal expansion coefficient different from the semiconductor substrate is embedded in at least a portion of the groove, a crystal defect is generated from the region near the bottom of the groove in the semiconductor substrate, thereby alleviating stress and strain in other regions of the semiconductor substrate, such that such regions cannot generate crystal defects in a region necessary for a circuit operation of the semiconductor element of the surface region.
摘要翻译：半导体器件具有具有凹槽的半导体衬底和形成在半导体衬底的表面区域中的半导体元件。具有与半导体基板不同的热膨胀系数的物质嵌入到槽的至少一部分中，从半导体衬底中的槽的底部附近的区域产生晶体缺陷，从而减轻其他区域中的应力和应变使得这些区域不会在表面区域的半导体元件的电路操作所需的区域中产生晶体缺陷。

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