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    • 19. 发明申请
    • OPEN FRAME ELECTRONIC CHASSIS FOR ENCLOSED MODULES
    • 封闭模块的开放式框架电子代码
    • US20120147560A1
    • 2012-06-14
    • US13156124
    • 2011-06-08
    • Guang ZengRoger MoorePhilip LevyYuri Luskind
    • Guang ZengRoger MoorePhilip LevyYuri Luskind
    • H05K7/20
    • H05K7/20545
    • An open frame chassis has a top opening and a bottom opening permitting ambient airflow. A plurality of modules, each enclosing electrical components in thermal contact with a heat sink area of their corresponding module, can each be inserted in the chassis. Ambient air may flow from the bottom opening across the heat sink area of each module to the top opening to passively cool the modules and electrical components. Key pins guide the modules into place and prevent incorrect insertion of a different type of electrical module not corresponding to the electrical connection of the chassis for that slot. Guide pins on corners of the modules mate with guide holes in the chassis to secure the module to the chassis and decrease vibration. Both sides of the chassis have side openings through which the fins of the modules in the end slots of the chassis may be exposed.
    • 开放框架底盘具有顶部开口和允许环境气流的底部开口。 每个封闭与其相应模块的散热器区域热接触的电气部件的多个模块可以各自插入到底盘中。 环境空气可以从底部开口流过每个模块的散热器区域到顶部开口,以被动地冷却模块和电气部件。 钥匙销将模块引导到位,并防止不正确插入不同于该插槽的机箱电气连接的不同类型的电气模块。 模块角上的导销与机箱中的导向孔配合,将模块固定在机箱上,减少振动。 底盘的两侧具有侧开口,底架的端部槽中的模块的翅片可以穿过该开口露出。
    • 20. 发明申请
    • Open Frame Electronic Chassis For Enclosed Modules
    • 封闭模块的开放式框架电子底盘
    • US20100290186A1
    • 2010-11-18
    • US12473558
    • 2009-05-28
    • Guang ZengRoger MoorePhil LevyYuri Luskind
    • Guang ZengRoger MoorePhil LevyYuri Luskind
    • H05K7/20
    • H05K7/20545
    • An open frame chassis has a top opening and a bottom opening permitting ambient air flow there through. A plurality of modules, each enclosing electrical components which are in thermal contact with a heat sink area of their corresponding module, and each of which can be inserted to an inserted position in the open frame chassis. When the modules are inserted into the open frame chassis, ambient air may flow from the bottom opening of the chassis across the heat sink area of each module to the top opening in order to passively cool the modules and the electrical components enclosed therein. The heat sink area has fins which are separated by a distance of 9 mm to 12 mm and have a height 10 mm to 20 mm. Key pins are associated with the electrical connectors of the chassis to guide the modules into place and prevent incorrect insertion of a different type of electrical module not corresponding to the electrical connection of the chassis for that slot. Guide pins are present on the corners of the modules to mate with guide holes in the chassis to secure the module to the open frame chassis and decrease vibration. Both sides of the chassis have side openings through which the fins of the modules inserted into the end slots of the chassis may be exposed. The power modules are inserted into the end slots. The chassis has an inverted connection at one end slot to accommodate identical power modules at both end slots such that the heat sink area always faces a side opening in the open frame chassis.
    • 开放式框架底盘具有顶部开口和底部开口,允许环境空气流过其中。 多个模块,每个模块包围与其相应模块的散热器区域热接触的电气部件,并且每个模块可以插入到开放框架底盘中的插入位置。 当模块插入开放框架机架中时,环境空气可能会从机箱的底部开口流过每个模块的散热器区域到顶部开口,以便被动地冷却模块和封闭在其中的电气部件。 散热器区域具有分开9mm至12mm的距离并具有10mm至20mm的高度的翅片。 键销与机箱的电连接器相关联,以将模块引导到位,并防止不正确插入不同于该插槽的机箱电气连接的不同类型的电气模块。 模块的拐角处有导向销,以配合机箱中的导向孔,将模块固定在开放框架底盘上,减少振动。 底盘的两侧具有侧开口,插入到底盘的端槽中的模块的翅片可以穿过该开口露出。 电源模块插入端槽。 底盘在一个端部槽处具有反向连接,以在两个端部槽处容纳相同的功率模块,使得散热片区域总是面向开放框架底盘中的侧面开口。