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    • 20. 发明申请
    • Vacuum processing apparatus
    • 真空加工设备
    • US20070068628A1
    • 2007-03-29
    • US11362868
    • 2006-02-28
    • Takeo UchinoTsutomu NakamuraMichiaki Kobayashi
    • Takeo UchinoTsutomu NakamuraMichiaki Kobayashi
    • H01L21/306C23C16/00
    • H01L21/67769H01L21/67017H01L21/67389H01L21/67775
    • A vacuum processing apparatus having an improved wafer processing efficiency and an improved working efficiency is provided. The vacuum processing apparatus includes a vacuum container in which a specimen is processed with plasma generated from a processing gas supplied to the vacuum container; a transfer container through which the specimen processed in the vacuum container is transferred, the transfer container being coupled to the vacuum container under ambient pressure; a blower for generating an ambient gas flow in the transfer container and an outlet disposed on the transfer container; a storage container for storing the specimen processed in the vacuum container, the storage container being disposed in the ambient gas flow in the transfer container; and an exhauster for exhausting a gas in the storage container.
    • 提供了一种具有改进的晶片处理效率和提高的工作效率的真空处理设备。 真空处理装置包括:真空容器,其中用从供给到真空容器的处理气体产生的等离子体处理试样; 在真空容器中处理的试样被转移通过的转移容器,转印容器在环境压力下连接到真空容器; 用于在所述转移容器中产生环境气流的鼓风机和设置在所述转移容器上的出口; 储存容器,用于储存处理在真空容器中的试样,该储存容器设置在转移容器中的环境气流中; 以及用于排出储存容器中的气体的排气装置。