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11. 发明授权

US07799852B2 Composition of biphenyl epoxy resin, phenolbiphenylaralkyl resin and filler 有权
标题翻译：联苯环氧树脂，苯酚二苯基烷基树脂和填料的组成
公开(公告)号：US07799852B2
公开(公告)日：2010-09-21
申请号：US11477524
申请日：2006-06-30
申请人： Yukihiro Kiuchi , Masatoshi Iji , Katsushi Terajima , Isao Katayama , Yasuo Matsui , Ken Oota
发明人： Yukihiro Kiuchi , Masatoshi Iji , Katsushi Terajima , Isao Katayama , Yasuo Matsui , Ken Oota
IPC分类号： C08K3/36 , C08L61/10 , C08L63/00
CPC分类号： C08L61/06 , C08L63/00 , H01L23/293 , H01L2924/0002 , C08L2666/22 , C08L2666/14 , H01L2924/00
摘要： An epoxy resin composition which can be used as a semiconductor encapsulating resin and in which the improvement of flame retardancy can be attained by suitably adapting a crosslinked structure itself of a cured article without using any flame retardant material and without particularly highly filling an inorganic filler. The epoxy resin composition includes an epoxy resin (A), a phenolic resin (B), an inorganic filler (C) and a curing accelerator (D), wherein a flexural modulus E (kgf/mm2) at 240±20% C of a cured article obtained by curing the composition is a value satisfying 0.015 W+4.1≦E≦0.27 W+21.8 in the case of 30≦W
摘要翻译：可以用作半导体封装树脂的环氧树脂组合物，其中通过适当地使固化制品的交联结构本身适当地适应而不使用任何阻燃材料，并且不特别高填充无机填料可以获得阻燃性的改善。环氧树脂组合物包含环氧树脂（A），酚醛树脂（B），无机填料（C）和固化促进剂（D），其中240±20％C的挠曲模量E（kgf / mm2）通过固化该组合物而得到的固化物是在30＆lt; NE; W <60的情况下满足0.015W + 4.1＆amp; NlE; E＆lt; NlE; 0.27W + 21.8的值，或满足0.30W-13＆NlE; E＆NlE; 3.7W-184 其中W（重量％）是固化物中无机填料（C）的含量，60＆lt; NlE; W＆nlE; 95。该组合物的固化物在热分解或点火时形成发泡层以发挥阻燃性。

12. 发明授权

US07032075B2 Instruction cache and microprocessor 失效
标题翻译：指令缓存和微处理器
公开(公告)号：US07032075B2
公开(公告)日：2006-04-18
申请号：US10372319
申请日：2003-02-25
申请人： Isao Katayama
发明人： Isao Katayama
IPC分类号： G06F12/00
CPC分类号： G06F9/3802 , G06F12/0875 , G06F12/0882 , G06F2212/1028 , Y02D10/13
摘要： In a central processing unit, caching is carried out for an instruction cache tag memory, so that, without making modifications to a conventional instruction cache controller, the number of times of access to the instruction cache tag memory, which consumes a large amount of electric power, is reduced, and low electric power consumption is attained.
摘要翻译：在中央处理单元中，对于指令高速缓存标签存储器进行高速缓存，使得在不改变常规指令高速缓存控制器的情况下，访问指令高速缓存标签存储器的次数，其消耗大量的电功率降低，电力消耗低。

13. 发明申请

US20050216708A1 Processor for performing context switching, a method for performing context switching, a computer program for perform context switching 审中-公开
标题翻译：用于执行上下文切换的处理器，用于执行上下文切换的方法，用于执行上下文切换的计算机程序
公开(公告)号：US20050216708A1
公开(公告)日：2005-09-29
申请号：US10972341
申请日：2004-10-26
申请人： Isao Katayama
发明人： Isao Katayama
IPC分类号： G06F9/46 , G06F9/00 , G06F9/48
CPC分类号： G06F9/462
摘要： A processor for performing context switching, including: (a) a register unit configured to include a primary register used in program execution by the processor and a secondary register having a same structure as the primary register; (b) a data storage unit configured to be used as a data storage area in the program execution; (c) a transfer unit configured to include a transfer register used in data transfer between the secondary register and the data storage unit; and (d) an arithmetic unit configured to perform the copy between the primary and secondary registers in a cycle and performs the data transfer between the data storage unit and the secondary register in parallel to instruction execution by the processor when the instruction execution by the processor does not involve memory access to the data storage unit.
摘要翻译：一种用于执行上下文切换的处理器，包括：（a）寄存器单元，被配置为包括由处理器在程序执行中使用的主寄存器和具有与主寄存器相同结构的辅助寄存器; （b）数据存储单元，被配置为在程序执行中用作数据存储区域; （c）传送单元，被配置为包括在二次寄存器和数据存储单元之间的数据传送中使用的传送寄存器; 以及（d）算术单元，被配置为在一个周期中执行所述主寄存器和次寄存器之间的复制，并且当所述处理器的指令执行时由所述处理器执行指令执行并且执行所述数据存储单元与所述辅助寄存器之间的数据传送不涉及对数据存储单元的存储器访问。

14. 发明授权

US5880429A Composite laser and punch processing device 失效
标题翻译：复合激光和冲孔加工装置
公开(公告)号：US5880429A
公开(公告)日：1999-03-09
申请号：US940973
申请日：1997-09-30
申请人： Isao Katayama , Hiroshi Kawai
发明人： Isao Katayama , Hiroshi Kawai
IPC分类号： B23Q41/06 , B21D28/12 , B21D28/36 , B23K26/08 , B23P23/00 , B23P23/02 , B23P23/04 , B30B1/26 , G05B19/418 , B23K26/00
CPC分类号： B23K26/0093 , B21D28/12 , B23K26/0853 , B23P23/02 , B30B1/266 , B30B15/08
摘要： The processing device is capable of high efficiency processing with a laser and a punch press while neutralizing the effects on the laser by vibrations caused by punch processing. The punch press device has a servo-motor and a crank system that converts the rotation of the servo-motor to a reciprocal movement of the ram. A NC device controls the processing device. The NC device has determination standards which assign either the punch press part or the laser processing part by predetermined values obtained by the mutual relationship of the work thickness, material and circumferential length with respect to hole processing.
摘要翻译：处理装置能够通过激光和冲压机进行高效率处理，同时通过冲压加工产生的振动中和激光的影响。冲压装置具有伺服电机和将伺服电动机的旋转转换成冲头的往复运动的曲柄系统。 NC设备控制处理设备。 NC装置具有确定标准，其通过工作厚度，材料和周长的相互关系相对于孔加工而获得的预定值来分配冲压部或激光加工部。

15. 发明授权

US4833292A Compound machining apparatus 失效
标题翻译：复合加工设备
公开(公告)号：US4833292A
公开(公告)日：1989-05-23
申请号：US239218
申请日：1988-08-31
申请人： Isao Katayama
发明人： Isao Katayama
IPC分类号： B23K26/08
CPC分类号： B23K26/0853 , B23K26/0093
摘要： A compound machining apparatus in which a punch press and a movable table device are provided on separate frames, respectively, and a laser oscillator, a laser beam machining head and a tube for guiding a laser beam from the laser oscillator to the laser beam machining head are collectively placed on the same frame as the frame of the movable table device.
摘要翻译：一种复合加工装置，其中冲压机和可移动工作台装置分别设置在分离的框架上，激光振荡器，激光束加工头和用于将来自激光振荡器的激光束引导到激光加工头集体地放置在与可移动台装置的框架相同的框架上。

16. 发明授权

US08561170B2 Processor and semiconductor device 失效
标题翻译：处理器和半导体器件
公开(公告)号：US08561170B2
公开(公告)日：2013-10-15
申请号：US13207606
申请日：2011-08-11
申请人： Isao Katayama
发明人： Isao Katayama
IPC分类号： H04L29/06
CPC分类号： G06F21/31 , H04L9/3226 , H04L2209/12
摘要： A CPU includes an address decoder that controls input of data from a JTAG I/F and output of data to the JTAG I/F, an authentication unit that performs predetermined authentication processing using an entered password and a predetermined key and, if the authentication is successful, output a predetermined authentication signal, and a selector that controls output of data to be outputted to JTAG I/F according to presence or absence of the predetermined authentication signal.
摘要翻译： CPU包括地址解码器，其控制来自JTAG I / F的数据输入并将数据输出到JTAG I / F，认证单元使用输入的密码和预定密钥进行预定认证处理，如果认证是成功输出预定认证信号，以及选择器，根据存在或不存在预定认证信号，控制输出到JTAG I / F的数据输出。

17. 发明申请

US20120144477A1 PROCESSOR AND SEMICONDUCTOR DEVICE 失效
标题翻译：处理器和半导体器件
公开(公告)号：US20120144477A1
公开(公告)日：2012-06-07
申请号：US13207606
申请日：2011-08-11
申请人： Isao Katayama
发明人： Isao Katayama
IPC分类号： H04L9/32 , G06F21/00
CPC分类号： G06F21/31 , H04L9/3226 , H04L2209/12
摘要： According to embodiments, a CPU includes an address decoder configured to control input of data from a JTAG I/F and output of data to the JTAG I/F, an authentication unit configured to perform predetermined authentication processing using an entered password and a predetermined key and, if the authentication is successful, output a predetermined authentication signal, and a selector configured to control output of data to be outputted to JTAG I/F according to presence or absence of the predetermined authentication signal.
摘要翻译：根据实施例，CPU包括：地址解码器，被配置为控制来自JTAG I / F的数据输入并将数据输出到JTAG I / F;认证单元，被配置为使用输入的密码和预定密钥执行预定认证处理并且如果认证成功，则输出预定认证信号，以及选择器，被配置为根据是否存在预定认证信号来控制要输出到JTAG I / F的数据的输出。

18. 发明申请

US20080099883A1 SEMICONDUCTOR STORAGE DEVICE, SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD THEREFOR 有权
标题翻译：半导体存储器件，半导体器件及其制造方法
公开(公告)号：US20080099883A1
公开(公告)日：2008-05-01
申请号：US11956358
申请日：2007-12-14
申请人： Kohji KANAMORI , Teiichirou Nishizaka , Noriaki Kodama , Isao Katayama , Yoshihiro Matsuura , Kaoru Ishihara , Yasushi Harada , Naruaki Minenaga , Chihiro Oshita
发明人： Kohji KANAMORI , Teiichirou Nishizaka , Noriaki Kodama , Isao Katayama , Yoshihiro Matsuura , Kaoru Ishihara , Yasushi Harada , Naruaki Minenaga , Chihiro Oshita
IPC分类号： H01L29/30
CPC分类号： H01L23/26 , H01L21/3221 , H01L23/3128 , H01L24/48 , H01L25/0657 , H01L2224/32145 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014 , H01L2924/12032 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： According to the present invention, a gettering layer is deposited both on the side surfaces and the bottom surface of a semiconductor chip. The semiconductor chip is then mounted on the board of a package so that a Schottky barrier is formed on the bottom surface. With this structure, metal ions that pass through the board of the package can be captured by the defect layer deposited on the side surfaces and/or the bottom surface of the semiconductor chip, and by the Schottky barrier.
摘要翻译：根据本发明，在半导体芯片的侧表面和底表面上沉积吸气层。然后将半导体芯片安装在封装的板上，使得在底表面上形成肖特基势垒。通过这种结构，可以通过沉积在半导体芯片的侧表面和/或底表面上的缺陷层和肖特基势垒捕获穿过封装板的金属离子。

19. 发明授权

US07197731B2 Virtual component having a detachable verification-supporting circuit, a method of verifying the same, and a method of manufacturing an integrated circuit 失效
标题翻译：具有可拆卸验证支持电路的虚拟部件，其验证方法以及集成电路的制造方法
公开(公告)号：US07197731B2
公开(公告)日：2007-03-27
申请号：US10105367
申请日：2002-03-26
申请人： Isao Katayama
发明人： Isao Katayama
IPC分类号： G06F17/50
CPC分类号： G06F17/5045 , G06F17/5022
摘要： A computer readable medium encoded with a hardware description language describing a virtual component for an integrated circuit design, the virtual component comprising a virtual component body having at least one circuit function and a verification-supporting circuit detachably connected to the virtual component body. The verification-supporting circuit may include a verification-output terminal described by the hardware description language. The verification-output terminal is configured to output a signal indicating an operation state inside of the virtual component body, and is detachably connected to the virtual component body so as not to affect the operation of the virtual component body even when the connection of the verification-output terminal with the virtual component body is cut.
摘要翻译：一种用描述用于集成电路设计的虚拟部件的硬件描述语言编码的计算机可读介质，所述虚拟部件包括具有至少一个电路功能的虚拟部件主体和可拆卸地连接到虚拟部件主体的验证支持电路。验证支持电路可以包括由硬件描述语言描述的验证输出终端。验证输出端子被配置为输出指示虚拟组件主体内部的操作状态的信号，并且可拆卸地连接到虚拟组件主体，以便即使在验证连接时也不影响虚拟组件主体的操作 - 虚拟组件主体的输出端被切断。

20. 发明授权

US07098276B1 Flame-retardant epoxy resin composition and semiconductor device made using the same 有权
标题翻译：阻燃环氧树脂组合物和使用其制备的半导体器件
公开(公告)号：US07098276B1
公开(公告)日：2006-08-29
申请号：US09830016
申请日：1999-10-20
申请人： Yukihiro Kiuchi , Masatoshi Iji , Katsushi Terajima , Isao Katayama , Yasuo Matsui , Ken Oota
发明人： Yukihiro Kiuchi , Masatoshi Iji , Katsushi Terajima , Isao Katayama , Yasuo Matsui , Ken Oota
IPC分类号： C08K3/36 , C08L61/10 , C08L63/00
CPC分类号： C08L61/06 , C08L63/00 , H01L23/293 , H01L2924/0002 , C08L2666/22 , C08L2666/14 , H01L2924/00
摘要： An epoxy resin composition which can be used as a semiconductor encapsulating resin and in which the improvement of flame retardancy can be attained by suitably adapting a crosslinked structure itself of a cured article without using any flame retardant material and without particularly highly filling an inorganic filler. The epoxy resin composition includes an epoxy resin (A), a phenolic resin (B), an inorganic filler (C) and a curing accelerator (D), wherein a flexural modulus E (kgf/mm2) at 240±20% C of a cured article obtained by curing the composition is a value satisfying 0.015 W+4.1≦E≦0.27 W+21.8 in the case of 30≦W
摘要翻译：可以用作半导体封装树脂的环氧树脂组合物，其中通过适当地使固化制品的交联结构本身适当地适应而不使用任何阻燃材料，并且不特别高填充无机填料可以获得阻燃性的改善。环氧树脂组合物包括环氧树脂（A），酚醛树脂（B），无机填料（C）和固化促进剂（D），其中挠曲模量E（kgf / mm 2））在固化组合物得到的固化制品的240±20％C下，在30 <= W <60的情况下为满足0.015W + 4.1 <= E <= 0.27W + 21.8的值，或满足0.30W 在60 <= W <= 95的情况下，-13 <= E <= 3.7W-184其中W（重量％）是固化物中无机填料（C）的含量。该组合物的固化物在热分解或点火时形成发泡层以发挥阻燃性。

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