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    • 14. 发明专利
    • Reflector and lighting apparatus using it
    • 使用它的反光镜和照明设备
    • JP2007048671A
    • 2007-02-22
    • JP2005233658
    • 2005-08-11
    • Toshiba Lighting & Technology Corp東芝ライテック株式会社
    • KUMAGAWA HIROKOTAMURA NOBUHIROIGARASHI KENJI
    • F21V7/22F21Y103/37G02B5/08
    • PROBLEM TO BE SOLVED: To improve reflectivity by forming a thickness of a metal film uniformly on the whole reflecting face even when a base material is odd-shaped or deep shaped.
      SOLUTION: The metal film 13 is formed in the base material 10 having an opening part 4 and an insertion hole 5A which is arranged on the upper side of this opening part 4 and into which a light source 6 is inserted, the reflecting face 3 is formed by installing a top coat 14 to protect this metal film 13, and the metal film 13 is formed by coating silver. In this case, thicknesses L1, L2 of the metal film 13 are uniform across the whole reflecting face 3, or the thickness L2a of the metal film 13 of the insertion hole 5A side of the reflecting face 3 is formed to be larger than the thickness L1 of the metal film 13 of the opening part 4 side of the reflecting face 3.
      COPYRIGHT: (C)2007,JPO&INPIT
    • 要解决的问题:即使当基材是奇数形状或深度形状时,通过在整个反射面上均匀地形成金属膜的厚度来提高反射率。 解决方案:金属膜13形成在具有开口部4的基材10和布置在该开口部4的上侧并插入有光源6的插入孔5A,反射 通过安装顶涂层14以保护该金属膜13而形成表面3,并且通过涂覆银形成金属膜13。 在这种情况下,金属膜13的厚度L1,L2在整个反射面3上是均匀的,或者反射面3的插入孔5A侧的金属膜13的厚度L2a大于厚度 反射面3的开口部4侧的金属膜13的L1。版权所有(C)2007,JPO&INPIT
    • 15. 发明专利
    • Manufacturing method of electrode for lamp
    • 电极电极的制造方法
    • JP2007042507A
    • 2007-02-15
    • JP2005226988
    • 2005-08-04
    • Toshiba Lighting & Technology Corp東芝ライテック株式会社
    • YAMADA TAICHITAMURA NOBUHIROTSUYUKI TAKAOIRISAWA KAZUO
    • H01J9/02H01J9/28
    • PROBLEM TO BE SOLVED: To provide a manufacturing method of an electrode for a lamp in which a strength deterioration of a welded part is controlled by optimizing a structure of a low melting metal layer provided between an outer end face of a bottom of a cup electrode and an end face of a sealing material.
      SOLUTION: A low melting metal layer 3a of an approximate circular plate fitted between an outer end face 1b of a bottom side 1a of a cylindrical bottomed cup electrode 1 made of a high melting metal and one end face 2a of a sealing rod material 2 are melted and the above cup electrode and the above sealing material 2 are welded. Since the low melting metal layer 3a fitted between the outer end face 1b of a bottom side 1b and one end face 2a of the above sealing material 2 is formed in an approximate circular shape, the whole of the low melting metal layer 3a is heated and melted uniformly and there will hardly be any remainder of an unmelted metal layer 3a. Since it is not necessary to raise a temperature to remove an unmelted metal, a recrystallization of the electrode 1 or the sealing material 2 hardly occurs and thus a deterioration of a welded part can be controlled.
      COPYRIGHT: (C)2007,JPO&INPIT
    • 解决的问题:提供一种用于灯的电极的制造方法,其中通过优化设置在底部的底部的外端面之间的低熔点金属层的结构来控制焊接部的强度劣化 杯状电极和密封材料的端面。 解决方案:装配在由高熔点金属制成的圆筒形底部杯形电极1的底侧1a的外端面1b和密封杆的一个端面2a之间的近似圆形板的低熔点金属层3a 材料2熔化,并且上述杯状电极和上述密封材料2被焊接。 由于安装在底侧1b的外端面1b和上述密封材料2的一个端面2a之间的低熔点金属层3a形成为大致圆形,所以整个低熔点金属层3a被加热, 熔融均匀,几乎不存在未熔化的金属层3a的剩余部分。 由于不需要提高温度来除去未熔化的金属,所以几乎不发生电极1或密封材料2的再结晶,从而可以控制焊接部件的劣化。 版权所有(C)2007,JPO&INPIT
    • 16. 发明专利
    • Electrode member, lead wire for sealing, and cold cathode fluorescent lamp
    • 电极会员,密封线和冷阴极荧光灯
    • JP2006140129A
    • 2006-06-01
    • JP2005177528
    • 2005-06-17
    • Toshiba Lighting & Technology Corp東芝ライテック株式会社
    • YAMADA TAICHITAMURA NOBUHIROTSUYUKI TAKAOIRISAWA KAZUO
    • H01J61/067H01J61/36
    • PROBLEM TO BE SOLVED: To provide an electrode member capable of fully ensuring bond strength between a cup electrode having a bottomed cylindrical shape of tungsten or molybdenum and a sealing material by resistance welding and a cold cathode fluorescent lamp having this member.
      SOLUTION: The electrode member comprises a cup electrode 6 having a bottomed cylindrical shape of tungsten or molybdenum, a sealing material of tungsten or molybdenum connected to an outside end face on the bottom side of the cup electrode 6 by welding, and a metal layer 7, having low melting-point, that melts between the outside end face of the cup electrode 6 and the sealing material 4 during welding. Since the cup electrode 6 is welded to the sealing material 4 via the metal layer 7 having low melting point, welding can be performed at relatively low temperature, so that ample bonding strength is ensured by resistance welding.
      COPYRIGHT: (C)2006,JPO&NCIPI
    • 要解决的问题:提供一种能够完全确保具有钨或钼的有底圆筒形状的杯状电极与电阻焊接的密封材料之间的接合强度的电极部件和具有该部件的冷阴极荧光灯。 电极构件包括具有钨或钼的有底圆筒形状的杯状电极6,通过焊接连接到杯状电极6的底侧上的外侧端面的钨或钼的密封材料,以及 具有低熔点的金属层7在焊接期间在杯状电极6的外端面与密封材料4之间熔融。 由于杯状电极6通过熔点低的金属层7焊接到密封材料4上,所以可以在相对低的温度下进行焊接,从而通过电阻焊接确保充分的接合强度。 版权所有(C)2006,JPO&NCIPI
    • 20. 发明专利
    • Luminaire
    • LUMINAIRE
    • JP2008066691A
    • 2008-03-21
    • JP2007022280
    • 2007-01-31
    • Toshiba Lighting & Technology Corp東芝ライテック株式会社
    • SANPEI TOMOHIROKAWASHIMA KIYOKOSAITO AKIKOIZUMI MASAHIROTAMURA NOBUHIROIWAMOTO MASAMISHIOZAKI MITSURUNOGI SHINJI
    • H01L33/50H01L33/56H01L33/58H01L33/60
    • H01L2224/48091H01L2224/48463H01L2224/49107H01L2224/73265H01L2924/00014
    • PROBLEM TO BE SOLVED: To provide a luminaire which has a high white-light extraction efficiency and can mitigate coarseness of light source. SOLUTION: The luminaire 1 includes a plurality of semiconductor light-emitting devices 2, a translucent substrate 3, a translucent adhesion layer 4, a reflecting member 5, a translucent sealing member 6, and a fluorescent layer 7. The light-emitting devices 2 are formed by laminating a semiconductor light-emitting layer on the back face of a translucent device substrate and extract light emitted from the light-emitting layer from the device substrate. The translucent substrate 3 has a lead (conductive part) 21 connected with p-type and n-type electrodes of the light-emitting devices 2. The adhesion layer 4 adheres the front face of the device substrate of each light-emitting device 2 to the back face of the translucent substrate 3. The light-emitting devices 2 are sealed by providing the sealing member 6 on the back side of the translucent substrate 3. The reflecting member 5 covers the sealing member 6. The fluorescent layer 7 covers the surface 3a of the translucent substrate 3. The fluorescent layer 7 contains a fluorescent material which wavelength-converts primary light emitted from the semiconductor light-emitting layer and emits a secondary light having a different wavelength. COPYRIGHT: (C)2008,JPO&INPIT
    • 要解决的问题:提供具有高白光提取效率并可以减轻光源粗糙度的照明设备。 解决方案:照明器1包括多个半导体发光器件2,透光性基板3,透光性粘接层4,反射部件5,透光性密封部件6和荧光体层7。 通过在半透明器件基板的背面上层叠半导体发光层并从器件基板提取从发光层发射的光来形成发光器件2。 透光性基板3具有与发光装置2的p型和n型电极连接的引线(导电部)21。粘接层4将各发光元件2的器件基板的正面粘接到 透光性基板3的背面。通过在透光性基板3的背面设置密封部件6来密封发光装置2.反射部件5覆盖密封部件6.荧光体层7覆盖表面 荧光层7包含荧光材料,其对从半导体发光层发射的一次光进行波长转换并发射具有不同波长的二次光。 版权所有(C)2008,JPO&INPIT