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11. 发明授权

US06338669B1 Polishing device 有权
标题翻译：抛光装置
公开(公告)号：US06338669B1
公开(公告)日：2002-01-15
申请号：US09509997
申请日：2000-06-15
申请人： Tetsuji Togawa , Kuniaki Yamaguchi
发明人： Tetsuji Togawa , Kuniaki Yamaguchi
IPC分类号： B24B100
CPC分类号： B24B57/02 , B24B37/04
摘要： This invention relates to a polishing machine for polishing an article such as a semiconductor wafer. A movable arm is located at a liquid supply position for supplying a liquid such as a polishing liquid onto a polishing surface of a turntable. The arm is also adapted to be moved to and held at a retracted position radially outside the polishing surface. At the liquid supply position, liquid supply nozzles supported on the arm are brought into a condition such that the nozzles are close to a position on the polishing surface where the liquid is to be supplied, whereby the liquid is accurately supplied onto the position. Holding the arm at the retracted position makes it easy to conduct a maintenance work for the polishing surface and so on.
摘要翻译：本发明涉及一种用于抛光诸如半导体晶片的物品的抛光机。可移动臂位于用于将诸如抛光液体的液体供应到转台的抛光表面上的液体供应位置。臂也适于被移动并保持在抛光表面的径向外侧的缩回位置。在液体供给位置，支撑在臂上的液体供给喷嘴处于这样的状态，使得喷嘴靠近要供应液体的抛光表面上的位置，从而将液体精确地供应到该位置。将臂保持在缩回位置使得易于进行抛光表面的维护工作等。

12. 发明授权

US06602119B1 Dressing apparatus 失效
标题翻译：敷料机
公开(公告)号：US06602119B1
公开(公告)日：2003-08-05
申请号：US09588537
申请日：2000-06-07
申请人： Tetsuji Togawa , Kuniaki Yamaguchi , Nobuyuki Takada , Satoshi Wakabayashi
发明人： Tetsuji Togawa , Kuniaki Yamaguchi , Nobuyuki Takada , Satoshi Wakabayashi
IPC分类号： B24B700
CPC分类号： B24B53/017
摘要： Disclosed is a dressing apparatus wherein a polishing surface can be regenerated stably over a long period without any danger of an object to be polished being scratched. A dressing surface 50a of a dresser 48 is caused to slide on a polishing surface 30a of a polishing table 22 while the dressing surface is urged against the polishing surface. The dressing surface is formed from a grindstone 50.
摘要翻译：公开了一种修整装置，其中可以长时间稳定地再生抛光表面，而不会有被抛光的物体被划伤的危险。使修整器48的修整面50a在研磨台22的研磨面30a上滑动，同时使修整面抵靠着研磨面。修整表面由磨石50形成。

13. 发明授权

US06227954B1 Polishing apparatus 失效
标题翻译：抛光设备
公开(公告)号：US06227954B1
公开(公告)日：2001-05-08
申请号：US08845423
申请日：1997-04-25
申请人： Tetsuji Togawa , Kuniaki Yamaguchi , Kunihiko Sakurai , Hiromi Yajima
发明人： Tetsuji Togawa , Kuniaki Yamaguchi , Kunihiko Sakurai , Hiromi Yajima
IPC分类号： B24B700
CPC分类号： B24B53/017
摘要： A polishing apparatus includes a top ring for holding a workpiece to be polished on a lower surface thereof, a turntable having a polishing surface for polishing a surface of the workpiece held by the top ring, and a dressing tool for dressing the polishing surface of the turntable. The top ring is movable to a first maintenance position therefor, and the dressing tool is movable to a second maintenance position therefor. The top ring, the turntable, and the dressing tool are housed in a single chamber having a plurality of side faces. The polishing surface, the first maintenance position, and the second maintenance position are positioned closely to one of the side faces of the chamber. Such one side face serves as a maintenance face for approaching the polishing surface, the first maintenance position, and the second maintenance position for maintenance of the polishing surface, the top ring and the dressing tool.
摘要翻译：抛光装置包括：用于在其下表面上保持要抛光的工件的顶环，具有用于抛光由顶环保持的工件的表面的抛光表面的转台和用于修整由所述顶环的抛光表面修整的修整工具转盘顶环可移动到其第一维护位置，并且修整工具可移动到第二维护位置。顶环，转盘和修整工具容纳在具有多个侧面的单个室中。抛光表面，第一维护位置和第二维护位置紧密地定位在腔室的一个侧面上。这样的一个侧面用作接近抛光表面，第一维护位置和第二维护位置的维护面，用于维护抛光表面，顶环和修整工具。

14. 发明授权

US06893719B1 Optical fiber cord 失效
标题翻译：光纤线
公开(公告)号：US06893719B1
公开(公告)日：2005-05-17
申请号：US09786100
申请日：2000-06-28
申请人： Fuminori Nakajima , Nobuhisa Ishii , Masao Tachikura , Shigenori Uruno , Hisashi Izumita , Hitoshi Ishimaru , Kuniaki Yamaguchi
发明人： Fuminori Nakajima , Nobuhisa Ishii , Masao Tachikura , Shigenori Uruno , Hisashi Izumita , Hitoshi Ishimaru , Kuniaki Yamaguchi
IPC分类号： G02B6/44 , D02G3/00 , C08K5/15 , C08L5/53
CPC分类号： G02B6/4402 , G02B6/4436 , Y10T428/2913 , Y10T428/2933 , Y10T428/2967
摘要： A single core optical fiber cord having an outer diameter of 1.2 mm or less, and having a structure in which an optical fiber core wire having a resin coating provided at the center, a tensile-strength-fiber layer around the periphery of the optical fiber core wire, and a coating layer around the outer periphery of the tensile-strength-fiber layer is provided. The coating layer can be composed of a non-halogen fire-retardant resin. The optical fiber cord has excellent fire retardant, mechanical and handling properties, although the outer diameter thereof is 1.2 mm or less.
摘要翻译：具有1.2mm以下的外径的单芯光纤线，具有设置在中心的具有树脂覆膜的光纤芯线，在光纤周围的抗拉强度纤维层的结构芯线，以及在拉伸强度纤维层的外周附近的涂层。涂层可以由非卤素阻燃树脂构成。虽然光纤线的外径为1.2mm以下，但光纤线具有优异的阻燃性，机械性和操作性。

15. 发明申请

US20050069273A1 Optical fiber cord 有权
标题翻译：光纤线
公开(公告)号：US20050069273A1
公开(公告)日：2005-03-31
申请号：US10990099
申请日：2004-11-15
申请人： Fuminori Nakajima , Nobuhisa Ishii , Masao Tachikura , Shigenori Uruno , Hisashi Izumita , Hitoshi Ishimaru , Kuniaki Yamaguchi
发明人： Fuminori Nakajima , Nobuhisa Ishii , Masao Tachikura , Shigenori Uruno , Hisashi Izumita , Hitoshi Ishimaru , Kuniaki Yamaguchi
IPC分类号： G02B6/44 , G02B6/22
CPC分类号： G02B6/4402 , G02B6/4436 , Y10T428/2913 , Y10T428/2933 , Y10T428/2967
摘要： An optical fiber cord which is a single core optical fiber cord having an outer diameter of 1.2 mm or less, and has a structure in which an optical fiber core wire having a resin coating is provided at the center, a tensile-strength-fiber layer is provided around the outer periphery of the optical fiber core wire, and a coating layer is further provided around the outer periphery of the tensile-strength-fiber layer, wherein the coating layer is composed of a non-halogen fire-retardant resin, is disclosed. This optical fiber cord has excellent fire retardant, mechanical and handling properties, although the outer diameter thereof is made smaller.
摘要翻译：作为外径为1.2mm以下的单芯光纤线的光纤线，具有在中央设置有具有树脂被膜的光纤芯线的结构，拉伸强度纤维层设置在所述光纤芯线的外周的周围，并且在所述拉伸强度纤维层的外周附近设置涂层，其中所述涂层由非卤素阻燃树脂构成，披露该光纤帘线具有优异的阻燃性，机械性和操作性，尽管其外径较小。

16. 发明申请

US20120276816A1 POLISHING METHOD 有权
标题翻译：抛光方法
公开(公告)号：US20120276816A1
公开(公告)日：2012-11-01
申请号：US13454146
申请日：2012-04-24
申请人： Katsutoshi Ono , Yu Ishii , Hisanori Matsuo , Kuniaki Yamaguchi
发明人： Katsutoshi Ono , Yu Ishii , Hisanori Matsuo , Kuniaki Yamaguchi
IPC分类号： B24B1/00 , B24B37/005
CPC分类号： B24B37/015 , B24B37/042 , B24B37/105 , B24B57/02
摘要： A polishing method for reducing an amount of polishing liquid used without lowering a polishing rate is provided. The polishing method comprises determining, in advance, the relationship between a supply flow rate of a polishing liquid and a polishing rate at the time the substrate is polished without controlling a surface temperature of the polishing pad, and the relationship between a supply flow rate of a polishing liquid and a polishing rate at the time the substrate is polished while controlling a surface temperature of the polishing pad at a predetermined level, and continuously supplying the polishing liquid to the surface of the polishing pad to achieve a higher polishing rate when the substrate is polished while controlling the surface temperature of the polishing pad at the predetermined level, than when the substrate is polished without controlling the surface temperature of the polishing pad.
摘要翻译：提供了一种用于在不降低抛光速率的情况下减少使用的抛光液量的抛光方法。抛光方法包括预先确定抛光液的供给流量与抛光衬底时的抛光速度之间的关系，而不控制抛光垫的表面温度，以及供给流量之间的关系抛光液体和抛光时的抛光速度，同时将抛光垫的表面温度控制在预定水平，并且将研磨液连续地供给到抛光垫的表面，以便当基板抛光，同时将抛光垫的表面温度控制在预定水平，而不是在不控制抛光垫的表面温度的情况下抛光衬底。

17. 发明授权

US07153570B2 Optical fiber cord 有权
标题翻译：光纤线
公开(公告)号：US07153570B2
公开(公告)日：2006-12-26
申请号：US10990099
申请日：2004-11-15
申请人： Fuminori Nakajima , Nobuhisa Ishii , Masao Tachikura , Shigenori Uruno , Hisashi Izumita , Hitoshi Ishimaru , Kuniaki Yamaguchi
发明人： Fuminori Nakajima , Nobuhisa Ishii , Masao Tachikura , Shigenori Uruno , Hisashi Izumita , Hitoshi Ishimaru , Kuniaki Yamaguchi
IPC分类号： G02B6/44
CPC分类号： G02B6/4402 , G02B6/4436 , Y10T428/2913 , Y10T428/2933 , Y10T428/2967
摘要： An optical fiber cord which is a single core optical fiber cord having an outer diameter of 1.2 mm or less, and has a structure in which an optical fiber core wire having a resin coating is provided at the center, a tensile-strength-fiber layer is provided around the outer periphery of the optical fiber core wire, and a coating layer is further provided around the outer periphery of the tensile-strength-fiber layer, wherein the coating layer is composed of a non-halogen fire-retardant resin, is disclosed. This optical fiber cord has excellent fire retardant, mechanical and handling properties, although the outer diameter thereof is made smaller.
摘要翻译：作为外径为1.2mm以下的单芯光纤线的光纤线，具有在中央设置有具有树脂被膜的光纤芯线的结构，拉伸强度纤维层设置在所述光纤芯线的外周的周围，并且在所述拉伸强度纤维层的外周附近设置涂层，其中所述涂层由非卤素阻燃树脂构成，披露该光纤帘线具有优异的阻燃性，机械性和操作性，尽管其外径较小。

18. 发明授权

US09067296B2 Polishing method 有权
标题翻译：抛光方法
公开(公告)号：US09067296B2
公开(公告)日：2015-06-30
申请号：US13454146
申请日：2012-04-24
申请人： Katsutoshi Ono , Yu Ishii , Hisanori Matsuo , Kuniaki Yamaguchi
发明人： Katsutoshi Ono , Yu Ishii , Hisanori Matsuo , Kuniaki Yamaguchi
IPC分类号： B24B37/015 , B24B37/04 , B24B37/10 , B24B57/02
CPC分类号： B24B37/015 , B24B37/042 , B24B37/105 , B24B57/02
摘要： A polishing method for reducing an amount of polishing liquid used without lowering a polishing rate is provided. The polishing method comprises determining, in advance, the relationship between a supply flow rate of a polishing liquid and a polishing rate at the time the substrate is polished without controlling a surface temperature of the polishing pad, and the relationship between a supply flow rate of a polishing liquid and a polishing rate at the time the substrate is polished while controlling a surface temperature of the polishing pad at a predetermined level, and continuously supplying the polishing liquid to the surface of the polishing pad to achieve a higher polishing rate when the substrate is polished while controlling the surface temperature of the polishing pad at the predetermined level, than when the substrate is polished without controlling the surface temperature of the polishing pad.
摘要翻译：提供了一种用于在不降低抛光速率的情况下减少使用的抛光液量的抛光方法。抛光方法包括事先确定抛光液的供给流量与抛光基板时的抛光速度之间的关系，而不控制抛光垫的表面温度，以及供给流量之间的关系抛光液体和抛光时的抛光速度，同时将抛光垫的表面温度控制在预定水平，并且将研磨液连续地供给到抛光垫的表面，以便当基板抛光，同时将抛光垫的表面温度控制在预定水平，而不是在不控制抛光垫的表面温度的情况下抛光衬底。

19. 发明授权

US08592313B2 Polishing method and polishing apparatus 有权
标题翻译：抛光方法和抛光装置
公开(公告)号：US08592313B2
公开(公告)日：2013-11-26
申请号：US13167952
申请日：2011-06-24
申请人： Kuniaki Yamaguchi , Tsuneo Torikoshi
发明人： Kuniaki Yamaguchi , Tsuneo Torikoshi
IPC分类号： H01L21/302 , H01L21/461
CPC分类号： B24B49/00 , B24B37/345
摘要： A polishing method that carries out a multi-step polishing process with improved polishing conditions (polishing recipe) while omitting measurement of the surface conditions of a substrate, as carried out between polishing steps thereby increasing the throughput. The polishing method for polishing workpieces by repeating the sequential operations of taking a workpiece out of a cassette in which a plurality of workpieces are stored, carrying out multi-step polishing of a surface of the workpiece and returning the workpiece to the cassette, includes carrying out one of the following two polishing processes for the workpiece taken out of the cassette: a first polishing process comprising carrying out the multi-step polishing under preset conditions and measurement of the surface of the workpiece before and after each polishing step; and a second polishing process comprising carrying out a predetermined step of the multi-step polishing under polishing conditions which have been modified based on the results of the measurement.
摘要翻译：抛光方法，其在抛光步骤之间执行，同时省略了在抛光步骤之间进行的基底的表面状态的测量，从而进行改进的抛光条件（抛光配方）的多步抛光工艺，从而提高了生产量。通过重复从存储多个工件的盒子中取出工件的顺序操作，对工件的表面进行多步抛光并将工件返回到盒子的抛光方法，包括承载对于从盒中取出的工件进行以下两个抛光工艺之一：第一抛光工艺，包括在预设条件下进行多步抛光并在每个抛光步骤之前和之后测量工件的表面; 以及第二抛光工艺，包括在基于测量结果进行了修改的抛光条件下执行多步抛光的预定步骤。

20. 发明授权

US08332064B2 Polishing method and polishing apparatus, and program for controlling polishing apparatus 有权
标题翻译：抛光方法和抛光装置，以及用于控制抛光装置的程序
公开(公告)号：US08332064B2
公开(公告)日：2012-12-11
申请号：US11991064
申请日：2006-09-12
申请人： Tsuneo Torikoshi , Kuniaki Yamaguchi
发明人： Tsuneo Torikoshi , Kuniaki Yamaguchi
IPC分类号： G06F19/00 , G05B13/02
CPC分类号： B24B37/042 , B24B37/345 , B24B49/00
摘要： A polishing method can bring a polishing surface to the optimum condition for polishing, without using a dummy wafer, before resuming polishing, thereby eliminating the cost of dummy wafer. The polishing method includes carrying out a stand-by operation during a polishing-resting time period, carrying out a preparatory process to polishing, after completion of the stand-by operation, by dressing a polishing surface while supplying a polishing liquid to the polishing surface, and starting polishing of a workpiece after completion of the preparatory process to polishing. A determination as to whether to carry out the preparatory process to polishing after completion of the stand-by operation may be made based on the total operating time of the stand-by operation or the total effective number of the stand-by operations.
摘要翻译：抛光方法可以在恢复抛光之前将抛光表面带到抛光的最佳状态，而不使用虚设晶片，从而消除了伪晶片的成本。抛光方法包括在抛光静止时间段内进行待机操作，在完成待机操作之后，通过修整抛光表面同时向抛光表面提供抛光液体进行抛光的准备过程并且在完成准备处理之后开始抛光工件以进行抛光。关于在完成备用操作后是否进行抛光的准备过程的决定可以基于待机操作的总操作时间或备用操作的总有效数量进行。

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