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11. 发明授权

US5982604A Power supply apparatus for electronic control unit in automotive vehicle 失效
标题翻译：汽车电子控制单元供电装置
公开(公告)号：US5982604A
公开(公告)日：1999-11-09
申请号：US44258
申请日：1998-03-19
申请人： Akio Kojima , Mitsuhiro Saitou , Kiyoshi Yamamoto
发明人： Akio Kojima , Mitsuhiro Saitou , Kiyoshi Yamamoto
IPC分类号： B60R16/03 , H02J1/00 , H02J7/00 , H02J7/14 , H02M3/155 , H02M3/156 , H01H47/00 , G05F1/44 , H02M3/335
CPC分类号： H02M3/1563 , H02J7/0065 , H02J7/1438 , H02M1/36
摘要： A power supply apparatus is provided for energizing an electronic control unit mounted on a vehicle having a battery and a starter switch. The apparatus includes a coil connected to the power supply line, and a switch which operates for selectively enabling a current to flow through the coil and cutting off the current through the coil. A control circuit operates for selectively changing the switch between an ON state and an OFF state when the starter switch assumes an ON position. The ON and OFF states alternate in accordance with predetermined delays.
摘要翻译：一种供电装置，用于对安装在具有电池和起动开关的车辆上的电子控制单元进行通电。该装置包括连接到电源线的线圈和用于选择性地使电流流过线圈并切断通过线圈的电流的开关。当起动开关处于ON位置时，控制电路用于选择性地改变ON状态和OFF状态之间的开关。 ON和OFF状态根据预定的延迟交替。

12. 发明授权

US5593722A Method of producing thick multi-layer substrates 失效
标题翻译：生产厚多层基板的方法
公开(公告)号：US5593722A
公开(公告)日：1997-01-14
申请号：US599112
申请日：1996-02-09
申请人： Yuji Otani , Takashi Nagasaka , Mitsuhiro Saitou
发明人： Yuji Otani , Takashi Nagasaka , Mitsuhiro Saitou
IPC分类号： H01C17/242 , H01C17/30 , H01L21/70 , H05K1/09 , H05K1/16 , H05K3/46 , B05D5/12
CPC分类号： H05K1/167 , H01C17/242 , H01C17/30 , H01L21/705 , H01L2224/16225 , H01L2924/19105 , H05K1/092 , H05K2201/0195 , H05K2203/171 , H05K3/4664
摘要： A method is provided for easily producing thick multi-layer substrates maintaining highly accurate resistances with little variation. A thick-film resistor 6 on a ceramic substrate 1 is fired at a temperature higher than the temperature of firing a glass insulating layer 2 that is formed thereon in contact therewith. This makes it possible to decrease the change in the resistance in a subsequent high-temperature step of firing the glass insulating layers 2 to 4. Moreover, after the glass insulating layer 2 is formed on the thick-film resistor 6 on the ceramic substrate 1, laser trimming is effected through a window or the glass insulating layer 2 and, thereafter, the glass insulating layers 3 and 4 are formed. This makes it possible to decrease the change in the resistance of the thick-film resistor 6 after laser trimming and to reduce the laser output.
摘要翻译：提供了一种容易地生产具有很小变化的保持高精度电阻的厚多层基板的方法。陶瓷基板1上的厚膜电阻6在比与其形成的玻璃绝缘层2的烧成温度高的温度下烧成。这使得可以减少烧结玻璃绝缘层2至4的后续高温步骤中的电阻变化。此外，在玻璃绝缘层2形成在陶瓷基板1上的厚膜电阻器6上之后通过窗口或玻璃绝缘层2进行激光修整，然后形成玻璃绝缘层3和4。这使得可以减少激光微调后厚膜电阻6的电阻变化并减少激光输出。

13. 发明授权

US5439732A Ceramic multi-layer wiring board 失效
标题翻译：陶瓷多层接线板
公开(公告)号：US5439732A
公开(公告)日：1995-08-08
申请号：US184104
申请日：1994-01-21
申请人： Takashi Nagasaka , Yuji Ontani , Mitsuhiro Saitou
发明人： Takashi Nagasaka , Yuji Ontani , Mitsuhiro Saitou
IPC分类号： H05K1/09 , H01L21/48 , H01L23/498 , H01L23/538 , H05K1/03 , H05K3/24 , H05K3/40 , H05K3/46 , B32B9/00
CPC分类号： H01L23/49883 , H01L21/4867 , H01L23/5383 , H05K3/4061 , H01L2224/16225 , H01L2924/19105 , H05K1/0306 , H05K1/092 , H05K2201/035 , H05K2201/0352 , H05K2201/096 , H05K3/248 , H05K3/4053 , H05K3/4611 , H05K3/4629 , H05K3/4667 , Y10S428/901 , Y10T428/12507 , Y10T428/12514 , Y10T428/1284 , Y10T428/12896 , Y10T428/24917 , Y10T428/24926
摘要： In a ceramic multi-layer wiring board, a surface conductor layer is made of a copper-based material and an inner conductor in the ceramic multilayer is a non-copper metal having a melting point higher than a temperature at which the ceramic multilayer is fired, typically Ag. Cu and Ag form eutectic crystals when firing the surface conductor layer of Cu. This can be prevented by connecting the surface conductor layer and the inner conductor with Ag-Pd or a metal which is different from the materials of the surface wiring layer and the inner conductor and which does not form eutectic crystals with the material of the surface wiring layer at the temperature at which the surface wiring layer is fired.
摘要翻译：在陶瓷多层布线板中，表面导体层由铜基材料制成，并且陶瓷多层中的内部导体是熔点高于陶瓷多层烧制温度的非铜金属，通常为Ag。 Cu和Ag在烧制Cu的表面导体层时形成共晶晶体。这可以通过用与表面布线层和内部导体的材料不同的Ag-Pd或金属连接表面导体层和内部导体，并且不与表面布线的材料形成共晶体在表面布线层被烧制的温度下。

14. 发明授权

US09320178B2 Electronic control unit and method of manufacturing the same 有权
标题翻译：电子控制单元及其制造方法
公开(公告)号：US09320178B2
公开(公告)日：2016-04-19
申请号：US13611203
申请日：2012-09-12
申请人： Shinsuke Oota , Mitsuhiro Saitou , Yutaka Oohashi
发明人： Shinsuke Oota , Mitsuhiro Saitou , Yutaka Oohashi
IPC分类号： H05K7/20 , B60R16/023 , H01L23/36 , H01L23/367 , H01L23/40 , H01L23/42 , H01L25/16 , H05K1/02 , H01L23/34 , H05K5/00 , H05K3/00 , H05K3/42
CPC分类号： H05K7/20854 , B60R16/0239 , H01L23/36 , H01L23/3677 , H01L23/4006 , H01L23/42 , H01L25/165 , H01L2924/0002 , H01L2924/19105 , H05K1/0206 , H05K3/0061 , H05K3/42 , H05K5/0082 , H05K2201/0187 , H05K2201/09054 , H05K2201/10166 , H05K2201/1056 , Y10T29/49117 , H01L2924/00
摘要： An electronic control unit is disclosed. The electronic control unit includes: a resin board; a power device that is surface-mounted on the resin board; a microcomputer that is configured to control the power device; first heat radiation means for radiating heat, the first heat radiation means being disposed on an opposite side of the resin board from the power device; and first heat conduction means for conducting the heat generated by the power device to the first heat radiation means.
摘要翻译：公开了一种电子控制单元。电子控制单元包括：树脂板; 表面安装在树脂板上的功率器件; 微型计算机，被配置为控制所述功率器件; 第一散热装置，用于散热，第一散热装置设置在树脂板与动力装置相反的一侧; 以及第一热传导装置，用于将由功率装置产生的热量传导到第一散热装置。

15. 发明申请

US20100254093A1 ELECTRONIC CONTROL UNIT AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：电子控制单元及其制造方法
公开(公告)号：US20100254093A1
公开(公告)日：2010-10-07
申请号：US12752534
申请日：2010-04-01
申请人： Shinsuke Oota , Mitsuhiro Saitou , Yutaka Oohashi
发明人： Shinsuke Oota , Mitsuhiro Saitou , Yutaka Oohashi
IPC分类号： H05K7/20 , H01R43/00
CPC分类号： H05K7/20854 , B60R16/0239 , H01L23/36 , H01L23/3677 , H01L23/4006 , H01L23/42 , H01L25/165 , H01L2924/0002 , H01L2924/19105 , H05K1/0206 , H05K3/0061 , H05K3/42 , H05K5/0082 , H05K2201/0187 , H05K2201/09054 , H05K2201/10166 , H05K2201/1056 , Y10T29/49117 , H01L2924/00
摘要： An electronic control unit is disclosed. The electronic control unit includes: a resin board; a power device that is surface-mounted on the resin board; a microcomputer that is configured to control the power device; first heat radiation means for radiating heat, the first heat radiation means being disposed on an opposite side of the resin board from the power device; and first heat conduction means for conducting the heat generated by the power device to the first heat radiation means.
摘要翻译：公开了一种电子控制单元。电子控制单元包括：树脂板; 表面安装在树脂板上的功率器件; 微型计算机，被配置为控制所述功率器件; 第一散热装置，用于散热，所述第一散热装置设置在所述树脂板与所述动力装置相反的一侧; 以及第一热传导装置，用于将由功率装置产生的热量传导到第一散热装置。

16. 发明授权

US07212036B2 Driving apparatus of H bridge circuit and protection method of the same 有权
标题翻译： H桥电路的驱动装置及其保护方法相同
公开(公告)号：US07212036B2
公开(公告)日：2007-05-01
申请号：US11057786
申请日：2005-02-15
申请人： Hirokazu Kasuya , Koji Numazaki , Mitsuhiro Saitou , Yutaka Fukuda , Nobumasa Ueda
发明人： Hirokazu Kasuya , Koji Numazaki , Mitsuhiro Saitou , Yutaka Fukuda , Nobumasa Ueda
IPC分类号： H03K19/0175
CPC分类号： H03K17/14 , H02H7/0838 , H02P7/04 , H03K17/063 , H03K17/0822 , H03K17/102 , H03K17/6877
摘要： In order to protect semiconductor switching-devices employed in an H bridge circuit against an over-voltage without using a special protection circuit, a control circuit outputs a control signal to a driving circuit for driving the H bridge circuit in order to turn off FETs serving as the semiconductor switching-devices when an over-voltage detection circuit detects the over-voltage applied to the H bridge circuit.
摘要翻译：为了在不使用特殊保护电路的情况下保护H桥电路中使用的半导体开关器件免于过电压，控制电路将控制信号输出到用于驱动H桥电路的驱动电路，以便关断供电的FET 作为半导体开关器件，当过电压检测电路检测到施加到H桥电路的过电压时。

17. 发明授权

US6081040A Semiconductor device having alignment mark 失效
标题翻译：具有对准标记的半导体器件
公开(公告)号：US6081040A
公开(公告)日：2000-06-27
申请号：US39340
申请日：1998-03-16
申请人： Shoichi Okuda , Mitsuhiro Saitou , Hiroyuki Ban
发明人： Shoichi Okuda , Mitsuhiro Saitou , Hiroyuki Ban
IPC分类号： H01L27/04 , H01L21/822 , H01L23/544 , H01L21/465
CPC分类号： H01L23/544 , H01L2223/5442 , H01L2223/54453 , H01L2924/0002
摘要： An alignment mark for determining a position of a thin film resistor formed on a semiconductor chip. The alignment mark is disposed on a capacitor formation region of the semiconductor chip. Because aluminum wiring members of the semiconductor chip are not disposed adjacent to the alignment mark within the capacitor formation region, the alignment mark can be precisely recognized. As a result, the position of the thin film resistor can be also precisely determined.
摘要翻译：用于确定形成在半导体芯片上的薄膜电阻器的位置的对准标记。对准标记设置在半导体芯片的电容器形成区域上。由于半导体芯片的铝布线构件不与电容器形成区域内的对准标记相邻配置，因此可以精确地识别对准标记。结果，也可以精确地确定薄膜电阻器的位置。

18. 发明授权

US5977651A Drive circuit for vehicle occupant safety apparatus 失效
标题翻译：车辆乘员安全装置的驱动电路
公开(公告)号：US5977651A
公开(公告)日：1999-11-02
申请号：US962321
申请日：1997-10-31
申请人： Nobumasa Ueda , Nobuo Mayumi , Mitsuhiro Saitou , Shoichi Okuda
发明人： Nobumasa Ueda , Nobuo Mayumi , Mitsuhiro Saitou , Shoichi Okuda
IPC分类号： B60R21/16 , B60R21/01 , G05F3/26 , B60R21/32
CPC分类号： B60R21/017 , G05F3/265
摘要： A drive circuit for a vehicle occupant safety apparatus includes a device for activating the vehicle occupant safety apparatus. A first transistor is connected in series with the device. A constant-current circuit receives electric energy from a power supply, and feeds a constant current to the device when the first transistor falls into its on state. The constant-current circuit includes a second transistor connected in series with the device. The second transistor includes an N-channel field-effect transistor. A third transistor is connected to the second transistor. The second and third transistors form a current mirror circuit. The third transistor includes an N-channel field-effect transistor. A voltage between a gate and a source of the third transistor is regulated at a constant level. Gate voltages of the second and third transistors are controlled in response to source voltages of the second and third transistors to equalize the source voltages of the second and third transistors.
摘要翻译：用于车辆乘员安全装置的驱动电路包括用于启动车辆乘员安全装置的装置。第一晶体管与器件串联连接。恒流电路从电源接收电能，并且当第一晶体管处于其导通状态时，将恒定电流馈送到器件。恒流电路包括与该装置串联连接的第二晶体管。第二晶体管包括N沟道场效应晶体管。第三晶体管连接到第二晶体管。第二和第三晶体管形成电流镜电路。第三晶体管包括N沟道场效应晶体管。第三晶体管的栅极和源极之间的电压被调节在恒定水平。响应于第二和第三晶体管的源电压来控制第二和第三晶体管的栅极电压，以均衡第二和第三晶体管的源极电压。

19. 发明授权

US5562973A Ceramic multi-layer wiring board 失效
标题翻译：陶瓷多层接线板
公开(公告)号：US5562973A
公开(公告)日：1996-10-08
申请号：US473773
申请日：1995-06-06
申请人： Takashi Nagasaka , Yuji Otani , Mitsuhiro Saitou
发明人： Takashi Nagasaka , Yuji Otani , Mitsuhiro Saitou
IPC分类号： H05K1/09 , H01L21/48 , H01L23/498 , H01L23/538 , H05K1/03 , H05K3/24 , H05K3/40 , H05K3/46 , B32B9/00
CPC分类号： H01L23/49883 , H01L21/4867 , H01L23/5383 , H05K3/4061 , H01L2224/16225 , H01L2924/19105 , H05K1/0306 , H05K1/092 , H05K2201/035 , H05K2201/0352 , H05K2201/096 , H05K3/248 , H05K3/4053 , H05K3/4611 , H05K3/4629 , H05K3/4667 , Y10S428/901 , Y10T428/12507 , Y10T428/12514 , Y10T428/1284 , Y10T428/12896 , Y10T428/24917 , Y10T428/24926
摘要： In a ceramic multi-layer wiring board, a surface conductor layer is made of a copper-based material and an inner conductor in the ceramic multi-layer is a non-copper metal having a melting point higher than a temperature at which the ceramic multi-layer is fired, typically Ag. Cu and Ag form eutectic crystals when firing the surface conductor layer of Cu. This can be prevented by connecting the surface conductor layer and the inner conductor with Ag--Pd or a metal which is different from the materials of the surface wiring layer and the inner conductor and which does not form eutectic crystals with the material of the surface wiring layer at the temperature at which the surface wiring layer is fired.
摘要翻译：在陶瓷多层布线基板中，表面导体层由铜基材料构成，陶瓷多层中的内导体是熔点高于陶瓷多层布线基板的温度的非铜金属通常Ag被烧毁。 Cu和Ag在烧制Cu的表面导体层时形成共晶晶体。这可以通过用与表面布线层和内部导体的材料不同的Ag-Pd或金属连接表面导体层和内部导体，并且不与表面布线的材料形成共晶体在表面布线层被烧制的温度下。

20. 发明授权

US07843700B2 Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：US07843700B2
公开(公告)日：2010-11-30
申请号：US11105548
申请日：2005-04-14
申请人： Yutaka Fukuda , Mitsuhiro Saitou , Toshihiro Nagaya , Kan Kinouchi , Sadahiro Akama , Koji Numazaki , Norihisa Imaizumi
发明人： Yutaka Fukuda , Mitsuhiro Saitou , Toshihiro Nagaya , Kan Kinouchi , Sadahiro Akama , Koji Numazaki , Norihisa Imaizumi
IPC分类号： H05K7/02 , H05K7/06 , H05K7/08 , H05K7/10
CPC分类号： H05K1/142 , H01L21/565 , H01L23/4334 , H01L23/4952 , H01L23/49562 , H01L23/49575 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/32225 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48095 , H01L2224/48227 , H01L2224/48247 , H01L2224/48472 , H01L2224/4903 , H01L2224/49051 , H01L2224/49111 , H01L2224/49171 , H01L2224/49175 , H01L2224/73265 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01068 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/014 , H01L2924/09701 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/19107 , H01L2924/20752 , H01L2924/20753 , H01L2924/2076 , H01L2924/3011 , H01L2924/351 , H05K1/0263 , H05K1/0306 , H05K3/0061 , H05K3/284 , H05K2201/10924 , H05K2203/049 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： An electric device includes: a first electric element; a second electric element capable of flowing large current therethrough so that heat is generated in the second electric element; a heat sink; and a first wiring board and a second wiring board, which are disposed on one side of the heat sink. The large current in the second electric element is larger than that in the first electric element. The first wiring board and the second wiring board are separated each other. The first electric element is disposed on the first wiring board, and the second electric element is disposed on the second wiring board.
摘要翻译：电气装置包括：第一电气元件; 第二电气元件，其能够流过大电流，使得在所述第二电气元件中产生热量; 散热器以及设置在散热器的一侧的第一布线板和第二布线板。第二电元件中的大电流大于第一电元件中的大电流。第一布线板和第二布线板彼此分离。第一电气元件设置在第一布线板上，第二电气元件设置在第二布线板上。

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