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11. 发明授权

US09270254B2 Cross-sectional dilation mode resonators and resonator-based ladder filters 有权
标题翻译：横截面扩张模式谐振器和基于谐振器的梯形滤波器
公开(公告)号：US09270254B2
公开(公告)日：2016-02-23
申请号：US13295978
申请日：2011-11-14
申请人： Chengjie Zuo , Changhan Yun , Chi Shun Lo , Wesley Nathaniel Allen , Mario Francisco Velez , Jonghae Kim , Sanghoon Joo
发明人： Chengjie Zuo , Changhan Yun , Chi Shun Lo , Wesley Nathaniel Allen , Mario Francisco Velez , Jonghae Kim , Sanghoon Joo
IPC分类号： H03H9/15 , H03H9/46 , H03H9/24 , H03H9/54 , H03H9/02
CPC分类号： H03H9/462 , H03H9/02228 , H03H9/2405 , H03H9/2426 , H03H2009/02503 , H03H2009/241
摘要： Electromechanical systems dilation mode resonator (DMR) structures are disclosed. The DMR includes a first electrode layer, a second electrode layer, and a piezoelectric layer formed of a piezoelectric material. The piezoelectric layer has dimensions including a lateral distance (D), in a plane of an X axis and a Y axis perpendicular to the X axis, and a thickness (T), along a Z axis perpendicular to the X axis and the Y axis. A numerical ratio of the thickness and the lateral distance, T/D, is configured to provide a mode of vibration of the piezoelectric layer with displacement along the Z axis and along the plane of the X axis and the Y axis responsive to a signal provided to one or more of the electrodes. Ladder filter circuits can be constructed with DMRs as series and/or shunt elements, and the resonators can have spiral configurations.
摘要翻译：公开了机电系统扩张模式谐振器（DMR）结构。 DMR包括第一电极层，第二电极层和由压电材料形成的压电层。压电体层具有在与X轴正交的X轴和Y轴的平面内的横向距离（D）和与X轴正交的Z轴的厚度（T）。厚度和横向距离T / D的数值比被配置为提供压电层的振动模式，其具有沿Z轴的位移并且沿着X轴和Y轴的平面响应所提供的信号到一个或多个电极。梯形滤波器电路可以用DMR构造为串联和/或分流元件，并且谐振器可以具有螺旋配置。

12. 发明授权

US09083300B2 Electromechanical systems piezoelectric contour mode differential resonators and filters 有权
标题翻译：机电系统压电轮廓模式差动谐振器和滤波器
公开(公告)号：US09083300B2
公开(公告)日：2015-07-14
申请号：US13094707
申请日：2011-04-26
申请人： Chi Shun Lo , Jonghae Kim , Sang-June Park , Sanghoon Joo , Chengjie Zuo , Changhan Yun
发明人： Chi Shun Lo , Jonghae Kim , Sang-June Park , Sanghoon Joo , Chengjie Zuo , Changhan Yun
IPC分类号： H03H9/70 , H03H9/00 , H01P1/213 , H03H9/02 , H03H9/24 , H03H9/56 , G09G3/34 , H03H3/02
CPC分类号： H03H9/0095 , G09G3/3493 , G09G2310/0267 , G09G2310/027 , H01P1/2135 , H03H9/0014 , H03H9/02228 , H03H9/2431 , H03H9/2436 , H03H9/2463 , H03H9/564 , H03H2003/027 , H03H2009/02496 , H03H2009/02527 , H03H2009/241
摘要： This disclosure provides implementations of electromechanical systems resonator structures, devices, apparatus, systems, and related processes. In one aspect, a contour mode resonator device includes a first conductive layer with a plurality of first layer electrodes including a first electrode at which a first input signal can be provided and a second electrode at which a first output signal can be provided. A second conductive layer includes a plurality of second layer electrodes including a first electrode proximate the first electrode of the first conductive layer and a second electrode proximate the second electrode of the first conductive layer. A second signal can be provided at the first electrode or the second electrode of the second conductive layer to cooperate with the first input signal or the first output signal to define a differential signal. A piezoelectric layer is disposed between the first conductive layer and the second conductive layer. The piezoelectric layer includes a piezoelectric material. The piezoelectric layer is substantially oriented in a plane and capable of movement in the plane responsive to an electric field between the first electrodes or the second electrodes.
摘要翻译：本公开提供了机电系统谐振器结构，设备，装置，系统和相关过程的实现。一方面，轮廓模式谐振器装置包括具有多个第一层电极的第一导电层，所述第一导电层包括能够提供第一输入信号的第一电极和可以提供第一输出信号的第二电极。第二导电层包括多个第二层电极，其包括靠近第一导电层的第一电极的第一电极和靠近第一导电层的第二电极的第二电极。可以在第二导电层的第一电极或第二电极处提供第二信号，以与第一输入信号或第一输出信号配合以限定差分信号。压电层设置在第一导电层和第二导电层之间。压电层包括压电材料。压电层基本上定向在平面中并且能够响应于第一电极或第二电极之间的电场在平面中移动。

13. 发明授权

US08987976B2 Piezoelectric resonator having combined thickness and width vibrational modes 有权
标题翻译：具有组合厚度和宽度振动模式的压电谐振器
公开(公告)号：US08987976B2
公开(公告)日：2015-03-24
申请号：US13241356
申请日：2011-09-23
申请人： Chengjie Zuo , Chi Shun Lo , Sanghoon Joo , Changhan Yun , Jonghae Kim
发明人： Chengjie Zuo , Chi Shun Lo , Sanghoon Joo , Changhan Yun , Jonghae Kim
IPC分类号： H01L41/047 , H03H9/02 , H03H9/56
CPC分类号： H03H9/02157 , H03H9/02062 , H03H9/56
摘要： A method and apparatus for a piezoelectric resonator having combined thickness and width vibrational modes are disclosed. A piezoelectric resonator may include a piezoelectric substrate and a first electrode coupled to a first surface of the piezoelectric substrate. The piezoelectric resonator may further include a second electrode coupled to a second surface of the piezoelectric substrate, where the first surface and the second surface are substantially parallel and define a thickness dimension of the piezoelectric substrate. Furthermore, the thickness dimension and the width dimension of the piezoelectric substrate are configured to produce a resonance from a coherent combination of a thickness vibrational mode and a width vibrational mode when an excitation signal is applied to the electrodes.
摘要翻译：公开了一种具有组合的厚度和宽度振动模式的压电谐振器的方法和装置。压电谐振器可以包括压电衬底和耦合到压电衬底的第一表面的第一电极。压电谐振器还可以包括耦合到压电基板的第二表面的第二电极，其中第一表面和第二表面基本平行并且限定压电基板的厚度尺寸。此外，压电基板的厚度尺寸和宽度尺寸被构造成当激励信号施加到电极时，从厚度振动模式和宽度振动模式的相干组合产生谐振。

14. 发明授权

US08816567B2 Piezoelectric laterally vibrating resonator structure geometries for spurious frequency suppression 有权
标题翻译：压电横向振动谐振器结构几何形状用于杂散频率抑制
公开(公告)号：US08816567B2
公开(公告)日：2014-08-26
申请号：US13186281
申请日：2011-07-19
申请人： Chengjie Zuo , Changhan Yun , Chi Shun Lo , Jonghae Kim
发明人： Chengjie Zuo , Changhan Yun , Chi Shun Lo , Jonghae Kim
IPC分类号： H01L41/04 , H03H3/02 , H03H9/02 , H03H9/17
CPC分类号： H03H9/02228 , H03H3/02 , H03H9/02055 , H03H9/173 , H03H2003/021 , Y10T29/42
摘要： This disclosure provides implementations of electromechanical systems resonator structures, devices, apparatus, systems, and related processes. In one aspect, a resonator structure includes a first conductive layer of electrodes and a second conductive layer of electrodes. A piezoelectric layer including a piezoelectric material is disposed between the first conductive layer and the second conductive layer. One or more trenches can be formed in the piezoelectric layer on one or both sides in space regions between the electrodes. In some implementations, a process for forming the resonator structure includes removing an exposed portion of the piezoelectric layer to define a trench, for instance, by partial etching or performing an isotropic release etch using a XeF2 gas or SF6 plasma. In some other implementations, a portion of a sacrificial layer is removed to define a trench in the piezoelectric layer.
摘要翻译：本公开提供了机电系统谐振器结构，设备，装置，系统和相关过程的实现。一方面，谐振器结构包括电极的第一导电层和电极的第二导电层。包括压电材料的压电层设置在第一导电层和第二导电层之间。一个或多个沟槽可以在电极之间的空间区域的一侧或两侧的压电层中形成。在一些实施方案中，用于形成谐振器结构的工艺包括去除压电层的暴露部分以限定沟槽，例如通过部分蚀刻或使用XeF 2气体或SF 6等离子体进行各向同性释放蚀刻。在一些其他实施方案中，去除牺牲层的一部分以在压电层中限定沟槽。

15. 发明授权

US08471643B2 Electromechanical systems oscillator with piezoelectric contour mode resonator for multiple frequency generation 失效
标题翻译：具有压电轮廓模式谐振器的机电系统振荡器用于多频发生
公开(公告)号：US08471643B2
公开(公告)日：2013-06-25
申请号：US13107764
申请日：2011-05-13
申请人： Jonghae Kim , Je-Hsiung Lan , Changhan Yun , Chi Shun Lo , Matthew Nowak
发明人： Jonghae Kim , Je-Hsiung Lan , Changhan Yun , Chi Shun Lo , Matthew Nowak
IPC分类号： H03B5/30
CPC分类号： H03H9/2426 , H03H9/02228 , H03H9/2405 , H03H9/462 , H03H2009/241
摘要： Electromechanical systems resonator structures, devices, circuits, and systems are disclosed. In one aspect, an oscillator includes an active component and a passive component connected in a feedback configuration. The passive component includes one or more contour mode resonators (CMR). A CMR includes a piezoelectric layer disposed between a first conductive layer and a second conductive layer. The conductive layers include an input electrode and an output electrode. The passive component is configured to output a first resonant frequency and a second resonant frequency, which is an odd integer harmonic of the first resonant frequency. The active component is configured to output a signal including the first resonant frequency and the second resonant frequency. This output signal can be a substantially square wave signal, which can serve as a clock in various applications.
摘要翻译：公开了机电系统谐振器结构，器件，电路和系统。一方面，振荡器包括以反馈配置连接的有源部件和无源部件。无源部件包括一个或多个轮廓模式谐振器（CMR）。 CMR包括设置在第一导电层和第二导电层之间的压电层。导电层包括输入电极和输出电极。无源部件被配置为输出第一谐振频率和第二谐振频率，其是第一谐振频率的奇整数谐波。有源部件被配置为输出包括第一谐振频率和第二谐振频率的信号。该输出信号可以是基本上为方波信号，其可以用作各种应用中的时钟。

16. 发明申请

US20130120081A1 COMBINED RESONATORS AND PASSIVE CIRCUIT COMPONENTS FOR FILTER PASSBAND FLATTENING 审中-公开
标题翻译：组合式谐振器和无源电路组件，用于滤波器平滑
公开(公告)号：US20130120081A1
公开(公告)日：2013-05-16
申请号：US13295955
申请日：2011-11-14
申请人： Chengjie Zuo , Chi Shun Lo , Sanghoon Joo , Changhan Yun , Jonghae Kim
发明人： Chengjie Zuo , Chi Shun Lo , Sanghoon Joo , Changhan Yun , Jonghae Kim
IPC分类号： H03H9/54 , G06F3/038
CPC分类号： H03H9/542 , H03H9/02228 , H03H9/564
摘要： This disclosure provides implementations of electromechanical systems combined resonator and passive circuit components. In one aspect, passband flattened filter apparatus includes a resonator structure and input and output passband flattening components. The resonator structure has a first input, a second input coupled to a ground terminal, a first output, and a second output coupled to the ground terminal. The input passband flattening component includes a first inductor having an output coupled to the first input of the resonator structure, and a second inductor having an input coupled to the first input of the resonator structure and an output coupled to the ground terminal. The output passband flattening component includes a first inductor having an input coupled to the first output of the resonator structure, and a second inductor having an input coupled to the first output of the resonator structure and an output coupled to the ground terminal.
摘要翻译：本公开提供了机电系统组合谐振器和无源电路部件的实现。一方面，通带扁平滤波器装置包括谐振器结构以及输入和输出通带扁平部件。谐振器结构具有耦合到接地端子的第一输入端，第二输入端，第一输出端和耦合到接地端子的第二输出端。输入通带平坦化部件包括具有耦合到谐振器结构的第一输入的输出的第一电感器和具有耦合到谐振器结构的第一输入的输入端和耦合到接地端子的输出的第二电感器。输出通带平坦化部件包括具有耦合到谐振器结构的第一输出的输入的第一电感器和具有耦合到谐振器结构的第一输出的输入端和耦合到接地端子的输出的第二电感器。

17. 发明申请

US20120293520A1 PIEZOELECTRIC RESONATORS WITH CONFIGURATIONS HAVING NO GROUND CONNECTIONS TO ENHANCE ELECTROMECHANICAL COUPLING 审中-公开
标题翻译：具有无接地连接的配置的压电谐振器，以增强机电耦合
公开(公告)号：US20120293520A1
公开(公告)日：2012-11-22
申请号：US13111683
申请日：2011-05-19
申请人： Changhan Yun , Sang-June Park , Chi Shun Lo , Jonghae Kim , Je-Hsiung Lan , Sanghoon Joo
发明人： Changhan Yun , Sang-June Park , Chi Shun Lo , Jonghae Kim , Je-Hsiung Lan , Sanghoon Joo
IPC分类号： G06T1/00 , H03H9/17
CPC分类号： H03H9/173 , H03H9/02228
摘要： This disclosure provides implementations of electromechanical systems resonator structures, devices, apparatus, systems, and related processes. In one aspect, resonator apparatus includes a first conductive layer including a first electrode and a second electrode. The first electrode is coupled to receive a first input signal, and the second electrode is coupled to provide a first output signal. A piezoelectric layer includes a piezoelectric material. The piezoelectric layer has a first side and a second side opposite the first side. The first side is proximate the first conductive layer, and the second side is electrically isolated from ground. In some examples, the second side of the piezoelectric layer can be exposed and/or electrically de-coupled from one or more components.
摘要翻译：本公开提供了机电系统谐振器结构，设备，装置，系统和相关过程的实现。在一个方面，谐振器装置包括包括第一电极和第二电极的第一导电层。第一电极被耦合以接收第一输入信号，并且第二电极被耦合以提供第一输出信号。压电层包括压电材料。压电层具有与第一侧相对的第一侧和第二侧。第一侧靠近第一导电层，第二侧与地电隔离。在一些示例中，压电层的第二面可以暴露和/或从一个或多个部件电脱耦合。

18. 发明申请

US20100224994A1 Low Temperature Metal to Silicon Diffusion and Silicide Wafer Bonding 审中-公开
标题翻译：低温金属与硅的扩散和硅化物晶片接合
公开(公告)号：US20100224994A1
公开(公告)日：2010-09-09
申请号：US12398774
申请日：2009-03-05
申请人： Changhan Yun
发明人： Changhan Yun
IPC分类号： H01L23/06 , H01L21/30
CPC分类号： H01L23/10 , B81C1/00269 , B81C2203/019 , H01L23/053 , H01L23/49513 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/056 , H01L2224/16 , H01L2924/00014 , H01L2924/01079 , H01L2924/1461 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A method of bonding two members includes forming a metal pad on a first member and a silicon pad on the second member, and coupling the pads at a temperature and pressure that will not damage features of the members, such as integrated circuitry or MEMS devices, but is sufficient to form a silicide bond. In various embodiments, the metal may be nickel and the silicon may be polysilicon.
摘要翻译：接合两个部件的方法包括在第二部件上的第一部件和硅焊盘上形成金属焊盘，并且在不会损坏诸如集成电路或MEMS器件的部件的特征的温度和压力下连接焊盘，但足以形成硅化物键。在各种实施例中，金属可以是镍，并且硅可以是多晶硅。

19. 发明申请

US20060166480A1 Interconnection of through-wafer vias using bridge structures 有权
公开(公告)号：US20060166480A1
公开(公告)日：2006-07-27
申请号：US11043580
申请日：2005-01-26
申请人： Changhan Yun , Javier Villarreal
发明人： Changhan Yun , Javier Villarreal
IPC分类号： H01L21/4763
CPC分类号： B81C1/00301 , B81B2207/095 , B81C2203/0118 , H01L21/50 , H01L23/053 , H01L2924/0002 , H01L2924/09701 , H01L2924/00
摘要： Bridge structures provide a surface on which to form interconnections to components through through-hole vias. The bridge structures at least partially, and preferably fully, span the gap between two wafers, and, more specifically, between a through-hole via in one wafer and a corresponding component on the other wafer. Bridge structure may be formed on the wafer having the through-hole via and/or the wafer having the component.

20. 发明授权

US09496255B2 Stacked CMOS chipset having an insulating layer and a secondary layer and method of forming same 有权
标题翻译：具有绝缘层和二次层的叠层CMOS芯片组及其形成方法
公开(公告)号：US09496255B2
公开(公告)日：2016-11-15
申请号：US13356717
申请日：2012-01-24
申请人： Chengjie Zuo , Changhan Yun , Sang-June Park , Chi Shun Lo , Mario F. Velez , Jonghae Kim
发明人： Chengjie Zuo , Changhan Yun , Sang-June Park , Chi Shun Lo , Mario F. Velez , Jonghae Kim
IPC分类号： H01L21/00 , H01L27/06
CPC分类号： H01L27/0688 , H01L2224/18
摘要： A chipset includes a sheet of glass, quartz or sapphire and a first wafer having at least one first circuit layer on a first side of a first substrate layer. The first wafer is connected to the sheet such that the at least one first circuit layer is located between the first substrate layer and the sheet. A second wafer having at least one second circuit layer on a first side of a second substrate layer is connected to the first substrate layer such that the at least one second circuit layer is located between the second substrate layer and the first substrate layer. Also a method of forming a chipset.
摘要翻译：芯片组包括玻璃板，石英或蓝宝石片，以及在第一基底层的第一面上具有至少一个第一电路层的第一晶片。第一晶片连接到片材，使得至少一个第一电路层位于第一基片层和片之间。具有在第二衬底层的第一侧上的至少一个第二电路层的第二晶片连接到第一衬底层，使得至少一个第二电路层位于第二衬底层和第一衬底层之间。还有一种形成芯片组的方法。

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