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11. 发明授权

US06573671B2 Fan reliability 有权
标题翻译：风扇可靠性
公开(公告)号：US06573671B2
公开(公告)日：2003-06-03
申请号：US09905485
申请日：2001-07-13
申请人： Adolfo S. Montero , Hasnain Shabbir
发明人： Adolfo S. Montero , Hasnain Shabbir
IPC分类号： H02P546
CPC分类号： H05K7/20836 , F04D25/166 , F04D27/004 , G06F1/206 , G11B33/142 , G11B33/144 , H01H83/04 , H05K7/20727
摘要： A computer system or other electronic system includes a plurality of cooling fans configured to operate in parallel. The cooling fans are operated in a manner to decrease the operating time of a fan. The cooling fans can alternate in operation. Thus, operating time is more equally divided between the two cooling fans and the hours of operation and number of rotations of the fans is more nearly equal. In an embodiment to reduce noise, two fans run at a lower speed instead of one fan at a higher speed. In an embodiment, a fan operates with a reduced speed which maintains a desired operating temperature. In an embodiment a thermal table is stored in BIOS (basic/input output system).
摘要翻译：计算机系统或其他电子系统包括被配置为并行操作的多个冷却风扇。冷却风扇以减少风扇的运行时间的方式操作。冷却风扇可以交替运行。因此，在两个冷却风扇之间的操作时间更加均等，并且操作时间和风扇的转数更接近于相等。在减少噪声的实施例中，两个风扇以较高的速度运行而不是一个风扇。在一个实施例中，风扇以降低的速度运行，其保持期望的操作温度。在一个实施例中，热表被存储在BIOS（基本/输入输出系统）中。

12. 发明申请

US20160274629A1 Systems And Methods Of Adaptive Thermal Control For Information Handling Systems 有权
标题翻译：信息处理系统的自适应热控制系统与方法
公开(公告)号：US20160274629A1
公开(公告)日：2016-09-22
申请号：US14664317
申请日：2015-03-20
申请人： Dominick Adam Lovicott , Hasnain Shabbir , Eric Tunks
发明人： Dominick Adam Lovicott , Hasnain Shabbir , Eric Tunks
IPC分类号： G06F1/20 , G01K15/00
CPC分类号： G06F1/206 , G06F1/324 , Y02D10/126 , Y02D10/16
摘要： Systems and methods of adaptive thermal control are provided for information handling system platforms that may be implemented to automate and scale fan control settings by making the fan control settings relative to a reported component thermal control parameter value from a component of an information handling system platform, such as a CPU or other heat generating component. In one example, bounds for system use of vendor or component manufacturer-reported thermal control parameter values may be set for system cooling so as to confine use of these values within information handling system platform limits characterized by a manufacturer of an information handling system platform.
摘要翻译：提供了自适应热控制的系统和方法，用于信息处理系统平台，其可以通过相对于来自信息处理系统平台的组件的所报告的组件热控制参数值使风扇控制设置来自动化和调整风扇控制设置来实现，例如CPU或其他发热组件。在一个示例中，系统使用供应商或组件制造商报告的热控制参数值的界限可以被设置用于系统冷却，以便将这些值的限制在由信息处理系统平台的制造商表征的信息处理系统平台限制内。

13. 发明申请

US20140032011A1 THERMAL CONTROL SYSTEMS AND METHODS FOR INFORMATION HANDLING SYSTEMS 有权
标题翻译：用于信息处理系统的热控制系统和方法
公开(公告)号：US20140032011A1
公开(公告)日：2014-01-30
申请号：US13559031
申请日：2012-07-26
申请人： Paul Artman , Hasnain Shabbir
发明人： Paul Artman , Hasnain Shabbir
IPC分类号： G05D23/00
CPC分类号： G06F1/206 , G05D23/1928 , G05D23/1931 , G05D23/1932 , G05D23/1934 , G06F1/3206 , G06F9/44505 , H05K7/20136 , Y02D10/16
摘要： Systems and methods are provided for information handling system thermal control that employ configuration-based temperature feedback, e.g., by using configuration-based fan speed control based on real time individual measured component temperatures. In one example, the disclosed systems and methods may be implemented to allow inputs from one or more hardware temperature sensors to set cooling fan speeds and/or power capping levels in a closed loop fashion, rather than relying solely (or at all) on system inlet ambient temperature.
摘要翻译：提供了用于信息处理系统热控制的系统和方法，其采用基于配置的温度反馈，例如通过使用基于实时单独测量的部件温度的基于配置的风扇速度控制。在一个示例中，可以实现所公开的系统和方法，以允许来自一个或多个硬件温度传感器的输入以闭环方式设置冷却风扇速度和/或功率上限电平，而不是仅依赖于系统（或全部）依赖于系统入口环境温度。

14. 发明申请

US20130226364A1 IHS COMPONENT COOLING SYSTEM 有权
标题翻译： IHS组件冷却系统
公开(公告)号：US20130226364A1
公开(公告)日：2013-08-29
申请号：US13404761
申请日：2012-02-24
申请人： Paul T. Artman , Dominick Adam Lovicott , Hasnain Shabbir
发明人： Paul T. Artman , Dominick Adam Lovicott , Hasnain Shabbir
IPC分类号： G05D23/00
CPC分类号： G06F1/206 , G06F1/203 , Y02D10/16
摘要： An IHS includes an IHS chassis. A processor is located in the IHS chassis. At least one fan is located in the IHS chassis and in fluid communication with the processor. A temperature sensor is located in the IHS chassis. A fan controller is coupled to the processor, the at least one fan, the temperature sensor, and a storage device that includes a plurality of processor target temperatures that are each associated with a different ambient temperature. The fan controller is operable to receive a first ambient temperature from the temperature sensor, determine a first processor target temperature that is associated with the first ambient temperature, receive a temperature of the processor, and operate the at least one fan in order to reduce the temperature of the processor to the first processor target temperature.
摘要翻译： IHS包括IHS机箱。处理器位于IHS机箱中。至少有一个风扇位于IHS机箱中，与处理器流体连通。温度传感器位于IHS机箱中。风扇控制器耦合到处理器，至少一个风扇，温度传感器和包括多个处理器目标温度的存储设备，每个处理器目标温度各自与不同的环境温度相关联。风扇控制器可操作以从温度传感器接收第一环境温度，确定与第一环境温度相关联的第一处理器目标温度，接收处理器的温度，以及操作至少一个风扇，以便减少处理器的温度达到第一处理器目标温度。

15. 发明授权

US07876559B2 Universal blank for air flow management 有权
标题翻译：用于空气流量管理的通用空白
公开(公告)号：US07876559B2
公开(公告)日：2011-01-25
申请号：US12272237
申请日：2008-11-17
申请人： Hasnain Shabbir , Bernard D. Strmiska
发明人： Hasnain Shabbir , Bernard D. Strmiska
IPC分类号： H05K7/20
CPC分类号： H05K7/20727
摘要： A system for managing air flow through a body of an information handling system is disclosed. The disclosure provides a blank including a blank base plate and a blank ridge extending from the blank base plate. The blank base plate may be configured to match an architecture of both a processor socket and a bank of memory chip sockets. The blank may be configured to provide an impedance to air flow substantially similar to a total impedance provided by a processor and associated heat sink disposed in the processor socket and a bank of memory chips disposed in the bank of memory chip sockets.
摘要翻译：公开了一种用于管理通过信息处理系统的主体的空气流的系统。本公开提供了一种坯料，其包括从坯料基板延伸的坯料基板和坯料脊。空白基板可以被配置为匹配处理器插座和一组存储器芯片插座的架构。空白可以被配置为向空气流提供阻抗，其基本上类似于由设置在处理器插座中的处理器和相关联的散热器提供的总阻抗以及设置在存储器芯片插槽组中的一组存储器芯片。

16. 发明授权

US07275019B2 System and method for information handling system thermal diagnostics 有权
标题翻译：信息处理系统热诊断系统和方法
公开(公告)号：US07275019B2
公开(公告)日：2007-09-25
申请号：US11130504
申请日：2005-05-17
申请人： Drew Schulke , Barry Kahr , Vinod Makhija , Adolfo Montero , Hasnain Shabbir
发明人： Drew Schulke , Barry Kahr , Vinod Makhija , Adolfo Montero , Hasnain Shabbir
IPC分类号： G21C17/00
CPC分类号： G06F11/3093 , G06F11/24 , G06F11/3058
摘要： Thermal subsystems of manufactured information handling systems are tested for compliance with desired parameters by running a thermal diagnostics module in firmware during one or more manufacturing activities performed on the information handling system. The thermal diagnostics module monitors and stores one or more thermal parameters detected at the information handling system, such as the maximum temperature zone detected during a manufacturing activity. The stored thermal parameter is read after the manufacturing activity and compared with an expected value to determine the status of the thermal subsystem. For instance, an information handling system maximum operating temperature is detected by firmware running on an embedded controller during imaging of a hard disk drive and fails thermal testing if the detected maximum operating temperature exceeds a predetermined value, such as a value that would not be reached if the thermal subsystem functioning properly.
摘要翻译：通过在信息处理系统执行的一个或多个制造活动期间，通过在固件中运行热诊断模块来测试制造的信息处理系统的热子系统以符合所需参数。热诊断模块监视和存储在信息处理系统处检测到的一个或多个热参数，例如在制造活动期间检测到的最大温度区域。存储的热参数在制造活动后读取，并与预期值进行比较，以确定热子系统的状态。例如，通过在硬盘驱动器成像期间在嵌入式控制器上运行的固件来检测信息处理系统的最大工作温度，并且如果检测到的最大工作温度超过预定值（例如不能达到的值），则不能进行热测试如果散热子系统正常工作。

17. 发明申请

US20060271335A1 System and method for information handling system thermal diagnostics 有权
公开(公告)号：US20060271335A1
公开(公告)日：2006-11-30
申请号：US11130504
申请日：2005-05-17
申请人： Drew Schulke , Barry Kahr , Vinod Makhija , Adolfo Montero , Hasnain Shabbir
发明人： Drew Schulke , Barry Kahr , Vinod Makhija , Adolfo Montero , Hasnain Shabbir
IPC分类号： G21C17/00
CPC分类号： G06F11/3093 , G06F11/24 , G06F11/3058
摘要： Thermal subsystems of manufactured information handling systems are tested for compliance with desired parameters by running a thermal diagnostics module in firmware during one or more manufacturing activities performed on the information handling system. The thermal diagnostics module monitors and stores one or more thermal parameters detected at the information handling system, such as the maximum temperature zone detected during a manufacturing activity. The stored thermal parameter is read after the manufacturing activity and compared with an expected value to determine the status of the thermal subsystem. For instance, an information handling system maximum operating temperature is detected by firmware running on an embedded controller during imaging of a hard disk drive and fails thermal testing if the detected maximum operating temperature exceeds a predetermined value, such as a value that would not be reached if the thermal subsystem functioning properly.

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