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11. 发明申请

US20070127865A1 OPTICAL DEVICES AND METHODS TO CONSTRUCT THE SAME 审中-公开
标题翻译：光学装置及其构造方法
公开(公告)号：US20070127865A1
公开(公告)日：2007-06-07
申请号：US11671775
申请日：2007-02-06
申请人： Daoqiang Lu , Gilroy Vandentop
发明人： Daoqiang Lu , Gilroy Vandentop
IPC分类号： G02B6/12
CPC分类号： G02B6/423 , G02B6/4232
摘要： Optical devices and methods for constructing the same are disclosed. An example optical device includes an optical transmitter, a photodetector and a waveguide optically coupling the optical transmitter and the photodetector. It also includes a substrate having a first cavity to receive the optical transmitter and a second cavity to receive the second transmitter. The first and second cavities are located and dimensioned to passively align the optical transmitter, the waveguide and the photodetector when the transmitter is inserted into the first cavity and the photodetector is inserted into the second cavity.
摘要翻译：公开了用于构造它们的光学器件和方法。一种示例性光学装置包括光发射器，光电检测器和光学耦合光发射器和光电检测器的波导。其还包括具有用于接收光发射器的第一腔体和用于接收第二发射器的第二腔体的衬底。第一和第二空腔的位置和尺寸被定位成当发射器被插入到第一空腔中并且光电检测器被插入到第二腔中时被动对准光发射器，波导和光电检测器。

12. 发明授权

US07038316B2 Bumpless die and heat spreader lid module bonded to bumped die carrier 失效
标题翻译：无铅模具和散热器盖模块接合到凸起的模具载体
公开(公告)号：US07038316B2
公开(公告)日：2006-05-02
申请号：US10811370
申请日：2004-03-25
申请人： Chuan Hu , Daoqiang Lu , Zhiyong Wang , Gilroy Vandentop
发明人： Chuan Hu , Daoqiang Lu , Zhiyong Wang , Gilroy Vandentop
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： B23K3/0623 , B23K2101/40 , H01L2224/05001 , H01L2224/05009 , H01L2224/05571 , H01L2224/05647 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2924/00014 , H01L2924/15311 , H01L2924/00 , H01L2224/05099
摘要： An IC package is assembled from a bumpless die, a die carrier having a plurality of solder bumps thereon, and a heat spreader lid. The bumpless die is bonded to the heat spreader lid to form a module and then the module is bonded to the bumped die carrier.
摘要翻译： IC封装由无冲击模具，其上具有多个焊料凸块的模具载体和散热器盖组装。将无凸起的模具结合到散热器盖上以形成模块，然后将模块结合到凸起的模具载体上。

13. 发明申请

US20050211749A1 Bumpless die and heat spreader lid module bonded to bumped die carrier 失效
标题翻译：无铅模具和散热器盖模块接合到凸起的模具载体
公开(公告)号：US20050211749A1
公开(公告)日：2005-09-29
申请号：US10811370
申请日：2004-03-25
申请人： Chuan Hu , Daoqiang Lu , Zhiyong Wang , Gilroy Vandentop
发明人： Chuan Hu , Daoqiang Lu , Zhiyong Wang , Gilroy Vandentop
IPC分类号： B23K3/06 , B23K31/02
CPC分类号： B23K3/0623 , B23K2101/40 , H01L2224/05001 , H01L2224/05009 , H01L2224/05571 , H01L2224/05647 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2924/00014 , H01L2924/15311 , H01L2924/00 , H01L2224/05099
摘要： An IC package is assembled from a bumpless die, a die carrier having a plurality of solder bumps thereon, and a heat spreader lid. The bumpless die is bonded to the heat spreader lid to form a module and then the module is bonded to the bumped die carrier.
摘要翻译： IC封装由无冲击模具，其上具有多个焊料凸块的模具载体和散热器盖组装。将无凸起的模具结合到散热器盖上以形成模块，然后将模块结合到凸起的模具载体上。

14. 发明授权

US07507604B2 Breakable interconnects and structures formed thereby 有权
标题翻译：可破坏的互连和由此形成的结构
公开(公告)号：US07507604B2
公开(公告)日：2009-03-24
申请号：US12044239
申请日：2008-03-07
申请人： Daoqiang Lu , Henning Braunisch
发明人： Daoqiang Lu , Henning Braunisch
IPC分类号： H01L21/50 , H01L21/48 , H01L23/52 , H01L23/48
CPC分类号： H01L23/49827 , H01L21/485 , H01L23/5382 , H01L24/28 , H01L24/83 , H01L2224/2919 , H01L2224/838 , H01L2924/01013 , H01L2924/01029 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/14 , H05K3/323 , H05K3/365 , H05K2201/0221 , H05K2201/0233 , H05K2201/0314 , H01L2924/00
摘要： Methods of forming a microelectronic structure are described. Embodiments of those methods include placing an anisotropic conductive layer comprising at least one compliant conductive sphere on at least one interconnect structure disposed on a first substrate, applying pressure to contact the compliant conductive spheres to the at least one interconnect structure, removing a portion of the anisotropic conductive layer to expose at least one of the compliant conductive spheres; and then attaching a second substrate to the anisotropic conductive layer.
摘要翻译：描述形成微电子结构的方法。这些方法的实施例包括将包括至少一个顺应性导电球的各向异性导电层放置在设置在第一衬底上的至少一个互连结构上，施加压力以使柔性导电球接触至少一个互连结构，各向异性导电层以暴露柔性导电球体中的至少一个; 然后将第二基板附着到各向异性导电层。

15. 发明授权

US07720337B2 Wafer based optical interconnect 有权
标题翻译：基于晶圆的光互连
公开(公告)号：US07720337B2
公开(公告)日：2010-05-18
申请号：US12004541
申请日：2007-12-20
申请人： Daoqiang Lu , Henning Braunisch
发明人： Daoqiang Lu , Henning Braunisch
IPC分类号： G02B6/36
CPC分类号： G02B6/4231
摘要： In general, in one aspect, a method includes forming conductive layers on a wafer. A through cavity is formed in alignment with the conductive layers. The through cavity is to permit an optical signal from an optical waveguide within an optical connector to pass therethrough. Alignment holes are formed on each side of the through cavity to receive alignment pins. The wafer having the conductive layers, the through cavity in alignment with the conductive layers, and the alignment holes on each side of the through cavity forms an optical-electrical (O/E) interface. An O/E converter is mounted to the metal layers in alignment with the through cavity. The alignment pins and the alignment holes are used to passively align the optical waveguide and the O/E converter.
摘要翻译：通常，一方面，一种方法包括在晶片上形成导电层。形成与导电层对准的通孔。通孔是允许光连接器内的光波导的光信号通过。对准孔形成在通孔的每一侧以接收对准销。具有导电层的晶片，与导电层对准的通孔和通孔的每一侧上的对准孔形成光电（O / E）界面。 O / E转换器安装到与通孔对准的金属层上。对准引脚和对准孔用于被动对准光波导和O / E转换器。

16. 发明申请

US20080153207A1 BREAKABLE INTERCONNECTS AND STRUCTURES FORMED THEREBY 有权
标题翻译：断开的互连和结构形成
公开(公告)号：US20080153207A1
公开(公告)日：2008-06-26
申请号：US12044239
申请日：2008-03-07
申请人： Daoqiang Lu , Henning Braunisch
发明人： Daoqiang Lu , Henning Braunisch
IPC分类号： H01L21/00
CPC分类号： H01L23/49827 , H01L21/485 , H01L23/5382 , H01L24/28 , H01L24/83 , H01L2224/2919 , H01L2224/838 , H01L2924/01013 , H01L2924/01029 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/14 , H05K3/323 , H05K3/365 , H05K2201/0221 , H05K2201/0233 , H05K2201/0314 , H01L2924/00
摘要： Methods of forming a microelectronic structure are described. Embodiments of those methods include placing an anisotropic conductive layer comprising at least one compliant conductive sphere on at least one interconnect structure disposed on a first substrate, applying pressure to contact the compliant conductive spheres to the at least one interconnect structure, removing a portion of the anisotropic conductive layer to expose at least one of the compliant conductive spheres; and then attaching a second substrate to the anisotropic conductive layer.
摘要翻译：描述形成微电子结构的方法。这些方法的实施例包括将包括至少一个顺应性导电球的各向异性导电层放置在设置在第一衬底上的至少一个互连结构上，施加压力以使柔性导电球接触至少一个互连结构，各向异性导电层以暴露柔性导电球体中的至少一个; 然后将第二基板附着到各向异性导电层。

17. 发明授权

US07344318B2 Optical interconnect with passive optical alignment 有权
标题翻译：具有无源光学对准的光学互连
公开(公告)号：US07344318B2
公开(公告)日：2008-03-18
申请号：US11386149
申请日：2006-03-22
申请人： Daoqiang Lu , Henning Braunisch , Bram Leader , Mark B. Trobough
发明人： Daoqiang Lu , Henning Braunisch , Bram Leader , Mark B. Trobough
IPC分类号： G02B6/30 , G02B6/26
CPC分类号： G02B6/4292 , G02B6/3885 , G02B6/423 , H01L2224/16225
摘要： A coupler is passively aligned over a substrate, wherein the coupler is laterally aligned to an optoelectronic (OE) device coupled to the substrate. The coupler is placed on the substrate, wherein the coupler is vertically aligned to the OE device. The coupler is fixed to the substrate.
摘要翻译：耦合器在衬底上被动对准，其中耦合器横向对准耦合到衬底的光电子（OE）器件。耦合器被放置在基板上，其中耦合器垂直对准OE设备。耦合器固定在基板上。

18. 发明申请

US20070126118A1 Mounting flexible circuits onto integrated circuit substrates 有权
标题翻译：将柔性电路安装到集成电路基板上
公开(公告)号：US20070126118A1
公开(公告)日：2007-06-07
申请号：US11292893
申请日：2005-12-02
申请人： Daoqiang Lu , Henning Braunisch
发明人： Daoqiang Lu , Henning Braunisch
IPC分类号： H01L23/12 , H01L21/48
CPC分类号： H05K3/301 , H01L23/49833 , H01L23/4985 , H01L24/16 , H01L24/73 , H01L2224/13 , H01L2224/131 , H01L2224/16225 , H01L2224/16227 , H01L2224/73204 , H01L2924/01079 , H01L2924/14 , H01L2924/15192 , H05K3/341 , H05K3/361 , H05K3/365 , H05K2201/10393 , H05K2203/048 , H01L2924/014
摘要： A substrate may receive an integrated circuit and a flex circuit on the same side in the same vertical direction. In addition, in some embodiments, a flex circuit adapter and the integrated circuit may be surface mounted in one operation.
摘要翻译：衬底可以在同一垂直方向上的同一侧上接收集成电路和柔性电路。此外，在一些实施例中，柔性电路适配器和集成电路可以在一个操作中被表面安装。

19. 发明授权

US08230589B2 Method of mounting an optical device 有权
标题翻译：安装光学装置的方法
公开(公告)号：US08230589B2
公开(公告)日：2012-07-31
申请号：US12054777
申请日：2008-03-25
申请人： Daoqiang Lu , Johanna Swan , Henning Braunisch
发明人： Daoqiang Lu , Johanna Swan , Henning Braunisch
IPC分类号： H05K3/34
CPC分类号： H01S5/0261 , H01L24/13 , H01L24/16 , H01L25/16 , H01L2224/16225 , H01L2224/16235 , H01L2224/32225 , H01L2224/73204 , H01L2224/92125 , H01L2924/01019 , H01L2924/01078 , H01L2924/10253 , Y10T29/49126 , Y10T29/4913 , Y10T29/49144 , Y10T29/49165 , H01L2924/00012 , H01L2924/00
摘要： A method for aligning at least two photonic components over an interposer, and an optical package that may align such components. The method may include providing an interposer; fabricating electrical conductors passing from one surface of the interposer to an opposite surface of the interposer at selected contact positions; soldering the photonic components over the selected contact positions on the first surface, while allowing solder self-alignment. Other embodiments are described and claimed.
摘要翻译：一种用于使插入器上的至少两个光子分量对准的方法，以及可以对准这些部件的光学封装。该方法可以包括提供插入器; 制造从所述插入件的一个表面到选定的接触位置处的所述插入件的相对表面的电导体; 将光子组件焊接在第一表面上所选择的接触位置上，同时允许焊料自对准。描述和要求保护其他实施例。

20. 发明授权

US07703991B2 Flip-chip mountable optical connector for chip-to-chip optical interconnectability 失效
标题翻译：用于芯片到芯片光学互连的倒装芯片安装光学连接器
公开(公告)号：US07703991B2
公开(公告)日：2010-04-27
申请号：US11124033
申请日：2005-05-06
申请人： Daoqiang Lu , Gilroy J. Vandentop , Henning Braunisch
发明人： Daoqiang Lu , Gilroy J. Vandentop , Henning Braunisch
IPC分类号： G02B6/36
CPC分类号： G02B6/4232 , G02B6/4214 , G02B6/4292 , G02B6/43 , H01L2224/16225 , H05K1/0274 , H05K3/3436
摘要： An optical connector comprises a housing having a cavity extending there through to accept a mating connector. The connector comprises no optical components. Dummy solder bonding pads positioned on the connector allow the connector to be automated flip-chip bonded over a substrate waveguide.
摘要翻译：光学连接器包括壳体，该壳体具有在其上延伸以容纳匹配连接器的空腔。连接器不包括光学部件。定位在连接器上的虚拟焊接焊盘允许连接器在衬底波导上自动倒装芯片结合。

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