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    • 15. 发明申请
    • Management device for excess cabling
    • 多余电缆管理设备
    • US20050274842A1
    • 2005-12-15
    • US10867024
    • 2004-06-14
    • Brandon Rubenstein
    • Brandon Rubenstein
    • B65H23/32G02B6/44H02G11/00H05K7/00
    • H02G11/00G02B6/4439
    • A cable management device includes a housing having a forward end, a rearward end, a base, opposing sidewalls, and a pair of vertically-spaced cross-members extending laterally within the housing between the sidewalls. A cable interconnecting electronic devices is routed forward and upwardly around the lower cross-member, rearwardly between the cross-members, rearward and upwardly around the upper cross-member and forwardly out of the housing forward end. The segment of cable extended out of the housing forward end may be pushed longitudinally along the segment back into the cable management device for stowage and subsequently extended back out of the device when needed.
    • 电缆管理装置包括具有前端,后端,底座,相对侧壁和在侧壁之间在壳体内横向延伸的一对垂直间隔的横向构件的壳体。 互连电子设备的电缆沿着下横向构件向前和向上布置,在横向构件之间向后和向上并围绕上横向构件向上并向前延伸出外壳前端。 延伸出壳体前端的电缆段可以沿着分段纵向推回到电缆管理装置中用于存储,并且随后在需要时延伸回设备。
    • 17. 发明授权
    • Quick release mechanism for sliding rail
    • 滑轨快速释放机构
    • US06456501B1
    • 2002-09-24
    • US09918765
    • 2001-07-30
    • Brandon RubensteinEugene A. Miksch
    • Brandon RubensteinEugene A. Miksch
    • H05K712
    • G11B33/128H05K7/1405
    • A drive unit quick release apparatus is provided on one guide rail of a pair of guide rails mounted to the drive unit for engaging and releasing a drive unit from a chassis. The apparatus includes a resilient cantilevered arm mounted to the drive unit, an engaging structure positioned on the arm to selectively maintain the drive unit in the chassis, and a lever connected to the resilient arm to facilitate disengaging the engagement structure and removing the drive unit from the chassis. The lever is positioned generally perpendicular to the resilient arm and to the axis of travel of the drive unit out of a bay in the chassis. In this configuration, a force applied to the lever causes the resilient arm to flex inwardly and disengage the engaging structure from a retaining slot in the chassis. Additionally, the continued application of the force to the lever moves the attached drive unit out of the chassis.
    • 驱动单元快速释放装置设置在安装到驱动单元的一对导轨的一个导轨上,用于从机架接合和释放驱动单元。 该装置包括安装到驱动单元的弹性悬臂,位于臂上的接合结构,以选择性地将驱动单元保持在底盘中,以及连接到弹性臂的杆,以便于使接合结构脱离接合结构, 底盘。 杠杆通常垂直于弹性臂定位并且与驱动单元的行进轴线定位在机箱中的托架之间。 在该构造中,施加到杆的力使得弹性臂向内弯曲并且使接合结构与底盘中的保持槽脱离。 此外,持续将力施加到杠杆将附接的驱动单元移出机箱。
    • 19. 发明授权
    • Cooling apparatus for an IC
    • IC冷却装置
    • US08542488B2
    • 2013-09-24
    • US13146884
    • 2009-01-29
    • Eric C. PetersonBrandon Rubenstein
    • Eric C. PetersonBrandon Rubenstein
    • G06F1/20H05K13/00H05K7/20
    • G06F1/20G06F2200/201H01L23/4006H01L23/473H01L2924/0002Y10T29/49002H01L2924/00
    • A cooling apparatus is disclosed. The cooling apparatus comprising a printed circuit (PC) board with an integrated circuit (IC) socket mounted onto the top side of the PC board. A mounting frame generally in the shape of a plate, with a first opening passing through the center of the plate, is mounted on the top side of the PC board with the IC socket located inside the first opening. A cold plate is attached to the mounting frame, the cold plate has an opening that passes through the cold plate. The opening in the cold plate is sized to allow an IC to be inserted into the IC socket through the opening. A fluid passageway is formed inside the cold plate. A fluid inlet port and a fluid outlet port are mounted on the cold plate and coupled to a first end and a second end of the fluid passageway, respectively. A heat spreader is removably attached to the top side of the cold plate wherein the bottom side of the heat spreader is configured to contact the top side of an IC when the IC is mounted in the IC socket.
    • 公开了一种冷却装置。 该冷却装置包括印刷电路板(PC),其具有安装在PC板的顶侧上的集成电路(IC)插座。 大体上为板状的安装框架,其中穿过板的中心的第一开口安装在PC板的顶侧,IC插座位于第一开口的内部。 冷板连接到安装框架上,冷板具有穿过冷板的开口。 冷板中的开口尺寸设计成允许IC通过开口插入到IC插座中。 在冷板内形成流体通道。 流体入口和流体出口分别安装在冷板上并分别连接到流体通道的第一端和第二端。 散热器可移除地附接到冷板的顶侧,其中当IC安装在IC插座中时,散热器的底侧被配置为接触IC的顶侧。