专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

11. 发明授权

US07411306B2 Packaging structure and method of an image sensor module 失效
标题翻译：图像传感器模块的包装结构和方法
公开(公告)号：US07411306B2
公开(公告)日：2008-08-12
申请号：US11194669
申请日：2005-08-02
申请人： Fang-Jun Leu , Shou-Lung Chen , Ching-Wen Hsiao , Shan-Pu Yu , Jyh-Rong Lin , I-Hsuan Peng , Jian-Shu Wu , Hui-Mei Wu , Chien-Wei Chieh
发明人： Fang-Jun Leu , Shou-Lung Chen , Ching-Wen Hsiao , Shan-Pu Yu , Jyh-Rong Lin , I-Hsuan Peng , Jian-Shu Wu , Hui-Mei Wu , Chien-Wei Chieh
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L31/0203 , H01L27/14618 , H01L2224/16225 , H01L2224/24226 , H01L2924/00011 , H01L2924/00014 , H01L2924/07811 , H01L2924/15321 , H01L2924/19105 , H01L2924/00 , H01L2224/0401
摘要： This invention relates to a packaging structure and method of an image sensor module. The method comprises: providing a transparent substrate having a first patterned conductive layer; carrying an image sensor integrated circuit chip having a photosensitive active area and at least one passive chip on the transparent substrate, wherein the photosensitive active area faces the transparent substrate; forming an insulating build-up film over the transparent substrate; and forming a plurality of conductive vias in the insulating build-up film wherein the ends of the conductive vias are connected with the passive chip or the first patterned conductive layer of the transparent substrate while the other ends of the conductive vias are exposed on the surface of the insulating build-up film. The packaging method is capable of down-sizing the construction of the image sensor module and simplifying the processing steps.
摘要翻译：本发明涉及图像传感器模块的封装结构和方法。该方法包括：提供具有第一图案化导电层的透明基板; 在所述透明基板上承载具有感光有源区域的图像传感器集成电路芯片和至少一个无源芯片，其中所述光敏有源区域面向所述透明基板; 在透明基板上形成绝缘堆积膜; 并且在绝缘堆积膜中形成多个导电通孔，其中导电通孔的端部与透明基板的无源芯片或第一图案化导电层连接，而导电通孔的另一端暴露在表面上的绝缘堆积膜。包装方法能够缩小图像传感器模块的结构，简化了处理步骤。

12. 发明申请

US20060030070A1 Packaging structure and method of an image sensor module 失效
公开(公告)号：US20060030070A1
公开(公告)日：2006-02-09
申请号：US11194669
申请日：2005-08-02
申请人： Fang-Jun Leu , Shou-Lung Chen , Ching-Wen Hsiao , Shan-Pu Yu , Jyh-Rong Lin , I-Hsuan Peng , Jian-Shu Wu , Hui-Mei Wu , Chien-Wei Chieh
发明人： Fang-Jun Leu , Shou-Lung Chen , Ching-Wen Hsiao , Shan-Pu Yu , Jyh-Rong Lin , I-Hsuan Peng , Jian-Shu Wu , Hui-Mei Wu , Chien-Wei Chieh
IPC分类号： H01L21/50 , H01L21/48 , H01L21/44
CPC分类号： H01L31/0203 , H01L27/14618 , H01L2224/16225 , H01L2224/24226 , H01L2924/00011 , H01L2924/00014 , H01L2924/07811 , H01L2924/15321 , H01L2924/19105 , H01L2924/00 , H01L2224/0401
摘要： This invention relates to a packaging structure and method of an image sensor module. The method comprises: providing a transparent substrate having a first patterned conductive layer; carrying an image sensor integrated circuit chip having a photosensitive active area and at least one passive chip on the transparent substrate, wherein the photosensitive active area faces the transparent substrate; forming an insulating build-up film over the transparent substrate; and forming a plurality of conductive vias in the insulating build-up film wherein the ends of the conductive vias are connected with the passive chip or the first patterned conductive layer of the transparent substrate while the other ends of the conductive vias are exposed on the surface of the insulating build-up film. The packaging method is capable of down-sizing the construction of the image sensor module and simplifying the processing steps.

13. 发明申请

US20060022290A1 Image sensor packaging structure and method of manufacturing the same 有权
公开(公告)号：US20060022290A1
公开(公告)日：2006-02-02
申请号：US11222173
申请日：2005-09-08
申请人： Shou-Lung Chen , Fang-Jun Leu , Shan-Pu Yu
发明人： Shou-Lung Chen , Fang-Jun Leu , Shan-Pu Yu
IPC分类号： H01L21/00 , H01L31/0232
CPC分类号： H01L31/0203 , H01L23/15 , H01L24/24 , H01L24/82 , H01L27/14618 , H01L27/14625 , H01L27/14636 , H01L27/14683 , H01L2224/0554 , H01L2224/05567 , H01L2224/05573 , H01L2224/16225 , H01L2224/2402 , H01L2224/24226 , H01L2224/32145 , H01L2224/48091 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01077 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/15311 , H01L2924/1532 , H01L2924/16195 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/19106 , H01L2924/30105 , H01L2924/30107 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： An image sensor module includes a first substrate, a second substrate provided over the first substrate, an image sensor device for receiving an image signal flip-chip bonded to the second substrate, and a semiconductor device for processing the image signal from the image sensor device embedded in the first substrate.

14. 发明授权

US08314482B2 Semiconductor package device 有权
标题翻译：半导体封装器件
公开(公告)号：US08314482B2
公开(公告)日：2012-11-20
申请号：US11905869
申请日：2007-10-05
申请人： Shou-Lung Chen , Ching-Wen Hsiao , Yu-Hua Chen , Jeng-Dar Ko , Chih-Ming Tzeng , Jyh-Rong Lin , Shan-Pu Yu
发明人： Shou-Lung Chen , Ching-Wen Hsiao , Yu-Hua Chen , Jeng-Dar Ko , Chih-Ming Tzeng , Jyh-Rong Lin , Shan-Pu Yu
IPC分类号： H01L23/02
CPC分类号： H01L23/5384 , H01L21/486 , H01L21/76898 , H01L23/147 , H01L23/3128 , H01L23/34 , H01L23/49827 , H01L23/5389 , H01L24/24 , H01L24/82 , H01L24/94 , H01L24/97 , H01L25/0657 , H01L25/105 , H01L25/50 , H01L29/0657 , H01L2224/24146 , H01L2224/24226 , H01L2224/32145 , H01L2224/73267 , H01L2224/82039 , H01L2224/94 , H01L2224/97 , H01L2225/06524 , H01L2225/06541 , H01L2225/06586 , H01L2225/1023 , H01L2225/1058 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01072 , H01L2924/01078 , H01L2924/014 , H01L2924/07802 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/15331 , H01L2924/351 , H01L2224/83 , H01L2924/00 , H01L2224/82
摘要： This invention relates to a wafer-leveled chip packaging method, comprising the steps of: providing a wafer; attaching at least one first chip to the wafer; forming a first insulating layer on the wafer; forming a plurality of first conductive vias penetrating the first insulating layer, wherein parts of the first conductive vias are electrically connected with the first chip; forming a conductive pattern layer on the surface of the first insulating layer wherein the conductive pattern layer is electrically connected with the first conductive vias; forming a plurality of through holes penetrating the wafer; filling a second insulating layer in the through holes; and forming a plurality of second conductive vias in the second insulating layer, wherein the second conductive vias are electrically connected with the first conductive vias.
摘要翻译：本发明涉及一种晶片级芯片封装方法，包括以下步骤：提供晶片; 将至少一个第一芯片附接到晶片; 在晶片上形成第一绝缘层; 形成穿过所述第一绝缘层的多个第一导电通孔，其中所述第一导电通孔的部分与所述第一芯片电连接; 在所述第一绝缘层的表面上形成导电图案层，其中所述导电图案层与所述第一导电通孔电连接; 形成穿过晶片的多个通孔; 在通孔中填充第二绝缘层; 以及在所述第二绝缘层中形成多个第二导电通孔，其中所述第二导电通孔与所述第一导电通孔电连接。

15. 发明授权

US07766533B2 Illumination module, and a display and general lighting apparatus using the same 有权
标题翻译：照明模块，以及使用其的显示器和通用照明装置
公开(公告)号：US07766533B2
公开(公告)日：2010-08-03
申请号：US12290340
申请日：2008-10-28
申请人： Ying Liu , Pak-Hong Ng , Shou-Lung Chen
发明人： Ying Liu , Pak-Hong Ng , Shou-Lung Chen
IPC分类号： F21V7/04
CPC分类号： G02F1/133604 , G02F1/133605 , G02F1/133611
摘要： The present invention provides an illumination module, and a display and a general lighting apparatus using the same. Said illumination module includes a plurality of light guiding strips arranged in juxtaposition with a predefined distance; a plurality of light sources, disposed on at least one end of said light guiding strips respectively for providing the light into said light guiding strips; and a plurality of light reflecting units, disposed between said light guiding strips for reflecting the light from said light guiding strips. The light reflecting units according to the present invention can guide the light from the sides of light guiding strips or other light not toward the right side of the illumination module back to the right side of the illumination module, and thus improving the light output efficiency and uniformity.
摘要翻译：本发明提供了一种照明模块，以及使用其的显示器和一般照明装置。所述照明模块包括以预定距离并列布置的多个导光条; 多个光源，分别设置在所述导光条的至少一端，用于将光提供到所述导光条中; 以及多个光反射单元，设置在所述导光条之间，用于反射来自所述导光条的光。根据本发明的光反射单元可以将来自导光条或其他光的侧面的光引导到照明模块的右侧，直到照明模块的右侧，从而提高光输出效率，均匀性

16. 发明申请

US20090179347A1 Structure of embedded active components and manufacturing method thereof 有权
标题翻译：嵌入式有源元件的结构及其制造方法
公开(公告)号：US20090179347A1
公开(公告)日：2009-07-16
申请号：US12382526
申请日：2009-03-18
申请人： Shou-Lung Chen , Cheng-Ta Ko
发明人： Shou-Lung Chen , Cheng-Ta Ko
IPC分类号： H01L21/64
CPC分类号： H01L21/561 , H01L21/568 , H01L23/49816 , H01L23/5389 , H01L24/19 , H01L24/96 , H01L24/97 , H01L2221/68359 , H01L2224/0401 , H01L2224/04105 , H01L2224/12105 , H01L2224/20 , H01L2224/211 , H01L2224/8203 , H01L2224/97 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/14 , H01L2924/15311 , H01L2924/15788 , H01L2924/18162 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2224/82 , H01L2924/00
摘要： A structure of embedded active components and the manufacturing method thereof are provided. The manufacturing steps involve providing a molding plate, and setting several active components on the molding plate as first. A dielectric layer covers the molding plate to cap the active components. An electric circuit is formed on the dielectric layer, in contact with the active components. Finally, the structure with embedded active components is released from the molding plate.
摘要翻译：提供嵌入式有源元件的结构及其制造方法。制造步骤包括提供模制板，并且首先在模制板上设置若干活性组分。电介质层覆盖模制板以盖住活性组分。在电介质层上形成与有源元件接触的电路。最后，嵌入式有源元件的结构从成型板上释放出来。

17. 发明授权

US07511365B2 Thermal enhanced low profile package structure 有权
标题翻译：热增强薄型封装结构
公开(公告)号：US07511365B2
公开(公告)日：2009-03-31
申请号：US11301903
申请日：2005-12-13
申请人： Enboa Wu , Shou-Lung Chen
发明人： Enboa Wu , Shou-Lung Chen
IPC分类号： H01L23/495 , H01L23/48 , H01L23/52 , H01L29/40 , H05K1/16
CPC分类号： H01L24/97 , H01L21/56 , H01L21/561 , H01L23/3107 , H01L23/3128 , H01L23/4334 , H01L23/49568 , H01L24/19 , H01L24/20 , H01L2224/04105 , H01L2224/20 , H01L2224/32188 , H01L2224/32245 , H01L2224/73267 , H01L2224/82039 , H01L2224/92244 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01082 , H01L2924/14 , H01L2924/15311 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30105 , H01L2924/30107 , H01L2224/82 , H01L2224/83
摘要： A thermal enhanced low profile package structure and a method for fabricating the same are provided. The package structure typically includes a metallization layer with an electronic component thereon which is between two provided dielectric layers. The metallization layer as well as the electronic component is embedded and packaged while the substrates are laminated via a lamination process. The fabricated package structure performs not only a superior electric performance, but also an excellent enhancement in thermal dissipation.
摘要翻译：提供了一种热增强薄型封装结构及其制造方法。封装结构通常包括其上具有电子部件的金属化层，其位于两个提供的介电层之间。金属化层以及电子部件被嵌入和封装，同时通过层压工艺层压基板。制造的封装结构不仅具有优异的电性能，而且还具有优异的散热增强。

18. 发明申请

US20090073720A1 LIGHT GUIDING STRIP AND DOUBLE-SIDED PLANAR LIGHT APPARATUS 有权
标题翻译：轻指导条和双面平面光装置
公开(公告)号：US20090073720A1
公开(公告)日：2009-03-19
申请号：US12238020
申请日：2008-09-25
申请人： Yaojun Feng , Danding Huang , Kwan Wah Ng , Ying Liu , Shou-Lung Chen , Cheng Jung Tsai
发明人： Yaojun Feng , Danding Huang , Kwan Wah Ng , Ying Liu , Shou-Lung Chen , Cheng Jung Tsai
IPC分类号： F21V7/04
CPC分类号： G02B6/001
摘要： A light guiding strip and a double-sided planar light apparatus are provided. According to one embodiment of the present invention, the double-sided planar light apparatus includes a plurality of light guiding strips, wherein the plurality of light guiding strips are positioned in a planar arrangement, each of the plurality of light guiding strips including a first plurality of light emitting surfaces disposed toward a first direction and a second plurality of light emitting surfaces disposed toward a second direction, each of the plurality of light guiding strips further including a first end and a second end configured to receive light, wherein the plurality of light guiding strips emit light from the first and second plurality of light emitting surfaces. Reflectors and light diffusion patterns on the light guiding strips provide control and independence over the two sides of the planar light apparatus.
摘要翻译：提供导光条和双面平面光装置。根据本发明的一个实施例，双面平面光装置包括多个导光条，其中多个导光条位于平面布置中，多个导光条中的每一个包括第一多个导光条的朝向第一方向设置的发光表面和朝向第二方向设置的第二多个发光表面，所述多个导光条中的每一个还包括构造成接收光的第一端和第二端，其中所述多个光引导条从第一和第二多个发光表面发射光。导光条上的反射器和光扩散图案在平面光装置的两侧提供了控制和独立性。

19. 发明授权

US07417293B2 Image sensor packaging structure 有权
标题翻译：图像传感器封装结构
公开(公告)号：US07417293B2
公开(公告)日：2008-08-26
申请号：US11222173
申请日：2005-09-08
申请人： Shou-Lung Chen , Fang-Jun Leu , Shan-Pu Yu
发明人： Shou-Lung Chen , Fang-Jun Leu , Shan-Pu Yu
IPC分类号： H01L23/02
CPC分类号： H01L31/0203 , H01L23/15 , H01L24/24 , H01L24/82 , H01L27/14618 , H01L27/14625 , H01L27/14636 , H01L27/14683 , H01L2224/0554 , H01L2224/05567 , H01L2224/05573 , H01L2224/16225 , H01L2224/2402 , H01L2224/24226 , H01L2224/32145 , H01L2224/48091 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01077 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/15311 , H01L2924/1532 , H01L2924/16195 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/19106 , H01L2924/30105 , H01L2924/30107 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： An image sensor module includes a first substrate, a second substrate provided over the first substrate, an image sensor device for receiving an image signal flip-chip bonded to the second substrate, and a semiconductor device for processing the image signal from the image sensor device embedded in the first substrate.
摘要翻译：图像传感器模块包括第一基板，设置在第一基板上的第二基板，用于接收与第二基板接合的图像信号倒装芯片的图像传感器装置，以及用于处理来自图像传感器装置的图像信号的半导体器件嵌入第一衬底。

20. 发明申请

US20060237827A1 Thermal enhanced low profile package structure and method for fabricating the same 有权
标题翻译：热增强薄型封装结构及其制造方法
公开(公告)号：US20060237827A1
公开(公告)日：2006-10-26
申请号：US11301903
申请日：2005-12-13
申请人： Enboa Wu , Shou-Lung Chen
发明人： Enboa Wu , Shou-Lung Chen
IPC分类号： H01L21/50 , H01L23/495
CPC分类号： H01L24/97 , H01L21/56 , H01L21/561 , H01L23/3107 , H01L23/3128 , H01L23/4334 , H01L23/49568 , H01L24/19 , H01L24/20 , H01L2224/04105 , H01L2224/20 , H01L2224/32188 , H01L2224/32245 , H01L2224/73267 , H01L2224/82039 , H01L2224/92244 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01082 , H01L2924/14 , H01L2924/15311 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30105 , H01L2924/30107 , H01L2224/82 , H01L2224/83
摘要： A thermal enhanced low profile package structure and a method for fabricating the same are provided. The package structure typically includes a metallization layer with an electronic component thereon which is between two provided dielectric layers. The metallization layer as well as the electronic component is embedded and packaged while the substrates are laminated via a lamination process. The fabricated package structure performs not only a superior electric performance, but also an excellent enhancement in thermal dissipation.
摘要翻译：提供了一种热增强薄型封装结构及其制造方法。封装结构通常包括其上具有电子部件的金属化层，其位于两个提供的介电层之间。金属化层以及电子部件被嵌入和封装，同时通过层压工艺层压基板。制造的封装结构不仅具有优异的电性能，而且还具有优异的散热增强。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式