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11. 发明授权

US08004843B2 Heat dissipation device 有权
标题翻译：散热装置
公开(公告)号：US08004843B2
公开(公告)日：2011-08-23
申请号：US12565712
申请日：2009-09-23
申请人： Chun-Chi Chen , Shi-Wen Zhou , Guo Chen
发明人： Chun-Chi Chen , Shi-Wen Zhou , Guo Chen
IPC分类号： H05K7/20
CPC分类号： H01L23/3672 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device is provided for dissipating heat generated by a plurality of electronic components mounted on a printed circuit board and having different heights. The heat dissipation device includes a connecting member and a first base mounted on the connecting member and located at above one of the electronic components. A number of joining members extend through the printed circuit board and engage with the first base to assemble the first base on the one of the electronic components on the printed circuit board. A distance between the first base and the one of the electronic components is adjustable by adjusting the joining members to make the first base intimately contact with the one of the electronic components.
摘要翻译：散热装置用于散发由安装在印刷电路板上并具有不同高度的多个电子部件产生的热量。散热装置包括连接构件和安装在连接构件上并位于上述一个电子部件上的第一基座。多个连接构件延伸穿过印刷电路板并与第一基座接合以在印刷电路板上的电子部件之一上组装第一基座。第一基座和电子部件之间的距离可通过调节连接部件来调节，以使第一基座与电子部件之一紧密接触。

12. 发明授权

US07898809B2 Heat sink and method of manufacturing the same 有权
标题翻译：散热器及其制造方法
公开(公告)号：US07898809B2
公开(公告)日：2011-03-01
申请号：US12252373
申请日：2008-10-16
申请人： Yi-Jiun Li , Peng Liu , Shi-Wen Zhou , Chun-Chi Chen
发明人： Yi-Jiun Li , Peng Liu , Shi-Wen Zhou , Chun-Chi Chen
IPC分类号： H05K7/20
CPC分类号： H01L23/3677 , H01L21/4882 , H01L2924/0002 , H01L2924/3011 , Y10T29/4935 , H01L2924/00
摘要： A heat sink includes a base plate and a plurality of cylindrical pins extending upwardly from the base plate. The cylindrical pins each include an upper dissipating portion, a lower mounting portion, and an engaging portion between the dissipating portion and the mounting portion. The mounting portion is interferentially fitted in a lower part of a corresponding aperture of the base plate. The engaging portion has a diameter smaller than that of the mounting portion. The engaging portion is cramped by an interior wall of the base plate defining an upper part of the corresponding aperture of the base plate by punching an upper surface of the base plate downwardly at a rim of the corresponding aperture.
摘要翻译：散热器包括基板和从基板向上延伸的多个圆柱形销。圆柱销每个包括上消散部分，下安装部分和消散部分和安装部分之间的接合部分。安装部分周向地装配在基板的相应孔的下部中。接合部的直径小于安装部的直径。接合部分被基板的内壁夹住，通过在对应的孔的边缘处向下冲压基板的上表面来限定基板的相应孔的上部。

13. 发明授权

US07609522B2 Heat sink assembly 失效
标题翻译：散热器组件
公开(公告)号：US07609522B2
公开(公告)日：2009-10-27
申请号：US11566020
申请日：2006-12-01
申请人： Zhao Jin , Jun Cao , Shi-wen Zhou , Chun-Chi Chen
发明人： Zhao Jin , Jun Cao , Shi-wen Zhou , Chun-Chi Chen
IPC分类号： H05K7/20 , F28F7/00 , H01L23/34
CPC分类号： H01L23/4006 , F28F3/02 , H01L2023/4081 , H01L2023/4087 , H01L2924/0002 , H01L2924/00
摘要： A heat sink assembly (10) compatible with an ATX motherboard (20) and a BTX motherboard (30), includes a heat sink and a plurality of fasteners (15) extending through the heat sink. The heat sink includes a base (12) defining a slot (1220) therein. The fastener is capable of sliding along the slot between a first position to a second position to make the heat sink assembly in accordance with the preferred embodiment of the present invention to be adapted for use with the ATX motherboard or the BTX motherboard.
摘要翻译：与ATX母板（20）和BTX母板（30）兼容的散热器组件（10）包括散热器和延伸穿过散热器的多个紧固件（15）。散热器包括在其中限定狭槽（1220）的基部（12）。紧固件能够在第一位置与第二位置之间沿狭槽滑动，以使得根据本发明的优选实施例的散热器组件适于与ATX主板或BTX主板一起使用。

14. 发明授权

US07391615B2 Clip for heat sink 失效
标题翻译：夹子为散热片
公开(公告)号：US07391615B2
公开(公告)日：2008-06-24
申请号：US11309839
申请日：2006-10-10
申请人： Meng Fu , Shi-Wen Zhou , Chun-Chi Chen
发明人： Meng Fu , Shi-Wen Zhou , Chun-Chi Chen
IPC分类号： H05K7/20
CPC分类号： H01L23/4093 , H01L2224/16 , Y10T24/44427 , Y10T24/4447
摘要： A clip includes a body with opposite first and second legs, a movable fastener, an actuating member and a sliding axle. The movable fastener has a retaining hole defined therein for engaging with a retention module and an elongated slot above the retaining hole. The actuating member includes a curving slot and is pivotally coupled to the movable fastener via a pivot. The sliding axle extends through the second leg of the body and the elongated slot of the movable fastener to couple them together, and the sliding axle has one portion inserted into the curving slot of the actuating member. When the actuating member is rotated about the pivot, the movable fastener is driven to move relative to the sliding axle between a relaxed position and a locked position.
摘要翻译：夹具包括具有相对的第一和第二腿部的主体，可移动紧固件，致动构件和滑动轴。可移动紧固件具有限定在其中的保持孔，用于与保持模块和保持孔上方的细长狭槽接合。致动构件包括弯曲槽，并且经由枢轴枢转地联接到可动紧固件。滑动轴延伸穿过主体的第二腿部和可移动紧固件的细长槽以将它们联接在一起，并且滑动轴具有插入致动构件的弯曲槽中的一个部分。当致动构件围绕枢轴旋转时，可移动紧固件被驱动以在松弛位置和锁定位置之间相对于滑动轴线移动。

15. 发明授权

US07331379B2 Heat dissipation device with heat pipe 失效
标题翻译：散热装置带热管
公开(公告)号：US07331379B2
公开(公告)日：2008-02-19
申请号：US11164458
申请日：2005-11-23
申请人： Chun-Chi Chen , Shi-Wen Zhou , Zhan Wu
发明人： Chun-Chi Chen , Shi-Wen Zhou , Zhan Wu
IPC分类号： F28D15/02
CPC分类号： H01L23/427 , F28D15/0266 , F28D15/0275 , F28F1/32 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a fin set, a sinuous heat pipe transferring heat to different parts of the fin set, and a base thermally contacting the heat pipe. The heat pipe has a middle U-shaped portion and two L-shaped portions at two sides of the U-shaped portion, respectively. The base is for contacting with a heat generating electronic device and transferring heat from the electronic device to the heat pipe and the fin set. The fin set defines a passageway in a middle of thereof. The U-shaped portion of the heat pipe is received in the passageway of the fin set and thermally engages with the fin set.
摘要翻译：散热装置包括翅片组，将热量传递到翅片组的不同部分的弯曲热管和与热管接触的基部。热管在U形部分的两侧分别具有中间的U形部分和两个L形部分。基座用于与发热电子装置接触并将热量从电子装置传递到热管和散热片组。翅片组定义在其中间的通道。热管的U形部分容纳在翅片组的通道中，并与翅片组热接合。

16. 发明授权

US07312994B2 Heat dissipation device with a heat pipe 失效
标题翻译：散热装置带热管
公开(公告)号：US07312994B2
公开(公告)日：2007-12-25
申请号：US11244688
申请日：2005-10-06
申请人： Hsieh-Kun Lee , Chun-Chi Chen , Shi-Wen Zhou , Zhan Wu , Bing-Wen Zhou , Hong-Wei Du
发明人： Hsieh-Kun Lee , Chun-Chi Chen , Shi-Wen Zhou , Zhan Wu , Bing-Wen Zhou , Hong-Wei Du
IPC分类号： H05K7/20 , F28D15/00
CPC分类号： H01L23/427 , F28D15/0266 , F28F2215/00 , H01L23/4006 , H01L23/467 , H01L2023/4081 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a heat conducting base, a heat sink on the base and two heat pipes thermally contacting with the heat sink and the base. The heat sink is made of metal extrusion and includes a heat conducting cylinder at a periphery of the heat sink and a plurality of fins extending from and surrounded by the cylinder. The cylinder includes four interconnected sides. The fins of the same side are parallel to each other. The two heat pipes thermally surround the cylinder of the heat sink and wholly contact the heat sink.
摘要翻译：散热装置包括导热基座，底座上的散热器和与散热器和基座热接触的两个热管。散热器由金属挤压制成，并且在散热器周围包括导热圆柱体，以及从圆筒延伸并被圆筒包围的多个翅片。气缸包括四个互连的侧面。同一侧的翅片彼此平行。两个热管热量围绕散热器的气缸并且完全接触散热器。

17. 外观设计

USD555109S1 Fastener for a heat sink and fan assembly 有权
标题翻译：用于散热器和风扇组件的紧固件
公开(公告)号：USD555109S1
公开(公告)日：2007-11-13
申请号：US29236512
申请日：2005-08-17
申请人： Hsieh-Kun Lee , Chun-Chi Chen , Shi-Wen Zhou , Zhan Wu
设计人： Hsieh-Kun Lee , Chun-Chi Chen , Shi-Wen Zhou , Zhan Wu

18. 发明申请

US20070077880A1 Computer system airflow-guiding device 审中-公开
标题翻译：计算机系统导风装置
公开(公告)号：US20070077880A1
公开(公告)日：2007-04-05
申请号：US11241910
申请日：2005-10-03
申请人： Hsieh-Kun Lee , Chun-Chi Chen , Shi-Wen Zhou , Chi Liang
发明人： Hsieh-Kun Lee , Chun-Chi Chen , Shi-Wen Zhou , Chi Liang
IPC分类号： F24F13/06
CPC分类号： H05K7/20172 , G06F1/20
摘要： An airflow-guiding device for being mounted into a computer system to periodically change airflow passing therethrough, comprises a motor, a gearing driven by the motor and a plurality of airflow-guiding plates pivoted to a frame and linked to the gearing and driven thereby to turn back and forth periodically. The gearing comprises a cam driven by the motor and a sliding board slideably mounted on a supporting member. The sliding board has a lateral side always in contact with the cam so that when the cam rotates, the sliding plate slides on the supporting member. The airflow-guiding plates each have a linking rod linked to the sliding board. The airflow-guiding plates periodically turn within a given angle following the rotation of the cam so as to change direction of airflow passing through the airflow-guiding plates.
摘要翻译：一种用于安装到计算机系统中以周期性地改变通过其中的气流的气流引导装置，包括电动机，由电动机驱动的齿轮传动装置和多个气流引导板，其枢转到框架并连接到齿轮传动装置并被驱动，周期性地来回转。传动装置包括由马达驱动的凸轮和可滑动地安装在支撑构件上的滑动板。滑动板具有总是与凸轮接触的侧面，使得当凸轮旋转时，滑动板在支撑构件上滑动。气流引导板各自具有连接到滑动板的连接杆。气流引导板在凸轮旋转之后周期性地转动给定的角度，以改变通过气流引导板的气流的方向。

19. 发明申请

US20070012428A1 HEAT DISSIPATION DEVICE WITH HEAT PIPE 失效
标题翻译：热管散热装置
公开(公告)号：US20070012428A1
公开(公告)日：2007-01-18
申请号：US11164458
申请日：2005-11-23
申请人： Zhan Wu , Chun-Chi Chen , Shi-Wen Zhou
发明人： Zhan Wu , Chun-Chi Chen , Shi-Wen Zhou
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , F28D15/0266 , F28D15/0275 , F28F1/32 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a fin set, a sinuous heat pipe transferring heat to different parts of the fin set, and a base thermally contacting the heat pipe. The heat pipe has a middle U-shaped portion and two L-shaped portions at two sides of the U-shaped portion, respectively. The base is for contacting with a heat generating electronic device and transferring heat from the electronic device to the heat pipe and the fin set. The fin set defines a passageway in a middle of thereof. The U-shaped portion of the heat pipe is received in the passageway of the fin set and thermally engages with the fin set.
摘要翻译：散热装置包括翅片组，将热量传递到翅片组的不同部分的弯曲热管和与热管接触的基部。热管在U形部分的两侧分别具有中间的U形部分和两个L形部分。基座用于与发热电子装置接触并将热量从电子装置传递到热管和散热片组。翅片组定义在其中间的通道。热管的U形部分容纳在翅片组的通道中，并与翅片组热接合。

20. 发明申请

US20060054307A1 Heat sink 失效
标题翻译：散热器
公开(公告)号：US20060054307A1
公开(公告)日：2006-03-16
申请号：US11221285
申请日：2005-09-07
申请人： Hsieh-Kun Lee , Chun-Chi Chen , Shi-Wen Zhou , Meng Fu
发明人： Hsieh-Kun Lee , Chun-Chi Chen , Shi-Wen Zhou , Meng Fu
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , F28D15/0266 , F28D15/0275 , F28F1/32 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat sink for dissipating heat of an electronic device comprises a base, a first fin group comprising a plurality of fins stacked together, a second fin group comprising a plurality of fins and overlapping the first fin group, and a sinuous heat pipe attached to the base. The first and second fin groups are respectively engaged with the heat pipe twice at different locations of the first and second fin groups.
摘要翻译：一种用于散热电子装置的散热器包括：基座，包括堆叠在一起的多个翅片的第一翅片组，包括多个翅片并与第一翅片组重叠的第二翅片组，以及连接到第一翅片组的弯曲热管基础。第一和第二翅片组分别在第一和第二翅片组的不同位置与热管接合两次。

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