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    • 12. 发明申请
    • METHOD FOR MANUFACTURING LIGHT-EMITTING MATERIAL
    • 制造发光材料的方法
    • US20080157032A1
    • 2008-07-03
    • US11873041
    • 2007-10-16
    • Junichiro SAKATAYoshiaki YAMAMOTOYayoi TOYOSUMI
    • Junichiro SAKATAYoshiaki YAMAMOTOYayoi TOYOSUMI
    • C09K11/64
    • C09K11/641
    • There has been a problem in that kinds of conventional light-emitting materials are not sufficient; therefore, choices of materials and manufacturers of light emitting materials are limited, resulting in an expensive light-emitting device. The present invention provides a novel method for manufacturing a light-emitting material suitable for mass production that can be manufactured at a low cost, and a novel light-emitting material which can provide light emission with high intensity. A mixture in which CuAlS2 is added in a small amount into ZnS as a base material is put in a reaction container. Then, the reaction container is hermetically sealed and the mixture is baked. Note that the reaction container is preferably hermetically sealed in a state where a reduced pressure is held in the reaction container. Further, in a light-emitting element using a light-emitting material obtained, electroluminescence with high luminance can be obtained.
    • 存在这种常规发光材料种类不足的问题。 因此,发光材料的材料和制造商的选择受到限制,导致昂贵的发光装置。 本发明提供了可以低成本制造适合于批量生产的发光材料的新型制造方法,以及能够提供高强度发光的新颖的发光材料。 将CuAlS 2 O 3少量添加到作为基材的ZnS中的混合物放入反应容器中。 然后,将反应容器密封并将混合物烘烤。 注意,反应容器优选在反应容器中保持减压的状态下气密密封。 此外,在使用得到的发光材料的发光元件中,可以获得高亮度的电致发光。
    • 13. 发明申请
    • LIGHT-EMITTING MATERIAL, LIGHT-EMITTING DEVICE, AND ELECTRONIC APPLIANCE
    • 发光材料,发光装置和电子器具
    • US20070216293A1
    • 2007-09-20
    • US11679423
    • 2007-02-27
    • Kohei YOKOYAMAYoshiaki YAMAMOTOJunichiro SAKATATakahiro KAWAKAMI
    • Kohei YOKOYAMAYoshiaki YAMAMOTOJunichiro SAKATATakahiro KAWAKAMI
    • H05B33/14H05B33/00
    • C09K11/612H05B33/14
    • It is an object of the present invention to provide a light-emitting material with high light emission intensity. It is another object to provide a light-emitting element with high light emission efficiency. Moreover, it is another object to provide a light-emitting device and an electronic appliance with reduced power consumption. A light-emitting material contains at least a light-emitting substance, a base material, and an additive which is an element belonging to group 14 of the periodic table or a compound containing two or more kinds of elements belonging to group 14, or a compound containing at least two or more kinds of elements each belonging to a different group chosen from group 13, group 14, and group 15. Due to the light-emitting material, a light-emitting element and an electronic appliance which has high light emission efficiency and can be driven at a low voltage can be obtained.
    • 本发明的目的是提供具有高发光强度的发光材料。 另一个目的是提供一种具有高发光效率的发光元件。 此外,另一个目的是提供一种具有降低的功耗的发光装置和电子设备。 发光材料至少含有属于周期表第14族的元素的发光物质,基材和添加剂,或含有属于第14族的两种以上的元素的化合物,或 含有至少两种或更多种元素的化合物,各自属于选自第13族,第14族和第15族的不同基团。由于发光材料,发光元件和具有高发光性的电子器件 效率可以在低电压下驱动得到。
    • 17. 发明申请
    • METHOD FOR MANUFACTURING SOI SUBSTRATE AND SEMICONDUCTOR DEVICE
    • 制造SOI衬底和半导体器件的方法
    • US20090137101A1
    • 2009-05-28
    • US12247470
    • 2008-10-08
    • Shunpei YAMAZAKIHideto OHNUMAYoichi IIKUBOYoshiaki YAMAMOTOKenichiro MAKINO
    • Shunpei YAMAZAKIHideto OHNUMAYoichi IIKUBOYoshiaki YAMAMOTOKenichiro MAKINO
    • H01L21/71
    • H01L27/1266H01L21/76254H01L27/1214H01L29/66772
    • To provide a method for manufacturing an SOI substrate provided with a semiconductor layer which can be used practically even when a substrate having a low heat-resistant temperature, such as a glass substrate or the like is used. The semiconductor layer is transferred to a supporting substrate by the steps of irradiating a semiconductor wafer with ions from one surface to form a damaged layer; forming an insulating layer over one surface of the semiconductor wafer; attaching one surface of the supporting substrate to the insulating layer formed over the semiconductor wafer and performing heat treatment to bond the supporting substrate to the semiconductor wafer; and performing separation at the damaged layer into the semiconductor wafer and the supporting substrate. The damaged layer remaining partially over the semiconductor layer is removed by wet etching and a surface of the semiconductor layer is irradiated with a laser beam.
    • 为了提供一种制造具有半导体层的SOI衬底的方法,即使使用诸如玻璃衬底等的耐热温度低的衬底也可以实际使用。 通过以下步骤将半导体层转移到支撑衬底:从一个表面照射半导体晶片以形成损伤层; 在所述半导体晶片的一个表面上形成绝缘层; 将所述支撑基板的一个表面附接到形成在所述半导体晶片上的绝缘层,并进行热处理以将所述支撑基板接合到所述半导体晶片; 并且在所述损伤层处进行到所述半导体晶片和所述支撑基板的分离。 通过湿蚀刻除去半导体层上部分残留的损伤层,并用激光束照射半导体层的表面。
    • 19. 发明申请
    • LIGHT-EMITTING ELEMENT AND MANUFACTURING METHOD THEREOF
    • 发光元件及其制造方法
    • US20070215881A1
    • 2007-09-20
    • US11680354
    • 2007-02-28
    • Yoshiaki YAMAMOTOYoshiharu HIRAKATAJunichiro SAKATAHiroki OHARA
    • Yoshiaki YAMAMOTOYoshiharu HIRAKATAJunichiro SAKATAHiroki OHARA
    • H01L33/00
    • H01L27/156H01L33/30H01L33/62H01L2924/0002H01L2924/00
    • It is an object of the present invention to provide a new light-emitting element and manufacturing method thereof in which actively diffusing a material into a film formation layer is utilized where an interface state and interdiffusion between a compound semiconductor substrate and a film formation layer formed thereover are not considered to be problematic. According to one feature of the present invention, unevenness is formed over the surface of a compound semiconductor substrate through chemical treatment, a compound semiconductor layer is formed over the surface of the compound semiconductor substrate having unevenness, atoms of the compound semiconductor substrate are diffused into the compound semiconductor layer through heat treatment, a first conductive layer is formed over the compound semiconductor substrate, and a second conductive layer is formed over the compound semiconductor layer.
    • 本发明的一个目的是提供一种新的发光元件及其制造方法,其中在形成层间的化合物半导体衬底和成膜层之间的界面状态和相互扩散之间,使材料活性地扩散到成膜层中 这不是有问题的。 根据本发明的一个特征,通过化学处理在化合物半导体衬底的表面上形成凹凸,在具有凹凸的化合物半导体衬底的表面上形成化合物半导体层,化合物半导体衬底的原子扩散到 通过热处理的化合物半导体层,在化合物半导体衬底上形成第一导电层,并且在化合物半导体层上形成第二导电层。