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    • 18. 发明授权
    • Method of fabricating a semiconductor device including complementary
MOSFET and power MOSFET
    • 制造包括互补MOSFET和功率MOSFET的半导体器件的方法
    • US6017797A
    • 2000-01-25
    • US75821
    • 1998-05-12
    • Akio Furukawa
    • Akio Furukawa
    • H01L21/8238H01L27/092H01L21/8234
    • H01L27/0922H01L21/8238Y10S148/126
    • There is provided a method of fabricating a semiconductor device including, a first conductivity type MOSFET, a second conductivity type MOSFET, and a power MOSFET having a high breakdown voltage, and having a drain offset region formed in the substrate between the drain region and a channel region located below the gate electrode, and containing first conductivity type impurities therein at such a concentration that carriers are depleted in an operation of the semiconductor device, the method including the steps, in sequence, of (a) forming gate electrodes on the substrate in first, second and third regions where the first conductivity type MOSFET, the second conductivity type MOSFET, and the power MOSFET are to be fabricated, respectively, (b) introducing first conductivity type impurities into the substrate at such a concentration that carriers are depleted in an operation of the semiconductor device, (c) introducing first conductivity type impurities into the substrate with both the second region and a region where the drain offset region is to be formed being masked with a photoresist film, and (d) introducing second conductivity type impurities into the substrate with both the first and third regions being masked with a photoresist film. The first conductivity type impurities in the step (b) is lower in concentration than the second conductivity type impurities and the first conductivity type impurities in the step (c). The method makes it possible to form CMOS and a power MOSFET on a common substrate without increasing the number of steps of forming a mask or a photoresist film in comparison with a conventional method of fabricating CMOS.
    • 提供一种制造半导体器件的方法,该半导体器件包括第一导电型MOSFET,第二导电型MOSFET和具有高击穿电压的功率MOSFET,并且在漏极区和漏极区之间形成在衬底中的漏极偏移区域 沟道区,位于栅电极下方,并且以使载流子在半导体器件的操作中耗尽的浓度含有第一导电型杂质,该方法包括以下步骤:(a)在衬底上形成栅极电极 在第一,第二和第三区域分别制造第一导电型MOSFET,第二导电型MOSFET和功率MOSFET,(b)以载流子耗尽的浓度将第一导电类型杂质引入衬底中 在半导体器件的操作中,(c)将第一导电类型的杂质引入到具有两者的衬底中 e第二区域和要形成漏极偏移区域的区域被光致抗蚀剂膜掩蔽,以及(d)将第二导电类型的杂质引入基板中,同时第一和第三区域被光致抗蚀剂膜掩蔽。 步骤(b)中的第一导电型杂质的浓度低于步骤(c)中的第二导电型杂质和第一导电型杂质。 与传统的制造CMOS方法相比,该方法可以在公共衬底上形成CMOS和功率MOSFET而不增加形成掩模或光致抗蚀剂膜的步骤数量。
    • 19. 发明授权
    • Flasher capable of varying a light distribution angle
    • 闪光器能够改变光分布角度
    • US5854949A
    • 1998-12-29
    • US732710
    • 1996-10-18
    • Akio FurukawaToshiaki Nakahira
    • Akio FurukawaToshiaki Nakahira
    • G03B15/05G03B15/06
    • G03B15/05G03B2215/0585
    • A stationary reflecting mirror (reflecting umbrella 2) is provided for reflecting light, emitted from a xenon discharge tube (3), to the side of an object to be photographed. An upper reflector plate (5) is provided above and in front of the stationary reflecting umbrella (2) and a lower reflector plate (6) is provided below and in front of the stationary reflecting umbrella (2). The upper and lower deflector plates (5, 6) are constructed so as to be pivoted in interlock with a change in the focal length of a photographic lens. With the upper and lower deflector plates (5, 6), part of light emitted from an opening (2A) is reflected and the direction of the reflected light that is emitted to the object is varied, and thereby the distribution angle of the light emitted to the object is varied. In this way, there is obtainable a flasher which is structurally simple and inexpensive without using high-performance lenses or an accurate moving mechanism.
    • 设置有固定反射镜(反射伞2),用于将从氙气放电管(3)发射的光反射到要拍摄的物体的一侧。 上反光板(5)设置在固定反射伞(2)的上方和前方,下反射板(6)设置在固定反射伞(2)的下方和前方。 上部和下部偏转板(5,6)被构造成与摄影镜片的焦距变化互锁地枢转。 通过上下偏转板(5,6),从开口(2A)发射的光的一部分被反射,并且发射到物体的反射光的方向变化,从而发射的光的分布角 对象是多样的。 以这种方式,可以获得一种在不使用高性能透镜或精确移动机构的情况下结构简单且便宜的闪光器。