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    • 15. 发明授权
    • Air tunnel floating gate memory cell
    • 空中隧道浮动门存储单元
    • US08022489B2
    • 2011-09-20
    • US11134155
    • 2005-05-20
    • Hang-Ting LueErh-Kun LaiKuang Yeu Hsieh
    • Hang-Ting LueErh-Kun LaiKuang Yeu Hsieh
    • H01L29/788H01L27/108H01L27/11H01L27/112
    • H01L27/115G11C16/0408H01L21/28273H01L27/11521H01L29/42324H01L29/515
    • An air tunnel floating gate memory cell includes an air tunnel defined over a substrate. A first polysilicon layer (floating gate) is defined over the air tunnel. An oxide layer is disposed over the first polysilicon layer such that the oxide layer caps the first polysilicon layer and defines the sidewalls of the air tunnel. A second polysilicon layer, functioning as a word line, is defined over the oxide layer. A method for making an air tunnel floating gate memory cell is also disclosed. A sacrificial layer is formed over a substrate. A first polysilicon layer is formed over the sacrificial layer. An oxide layer is deposited over the first polysilicon layer such that the oxide layer caps the first polysilicon layer and defines the sidewalls of the sacrificial layer. A hot phosphoric acid (H3PO4) dip is used to etch away the sacrificial layer to form an air tunnel.
    • 空气隧道浮动栅极存储单元包括限定在衬底上的空气通道。 在空气隧道上定义第一多晶硅层(浮栅)。 氧化物层设置在第一多晶硅层上,使得氧化物层覆盖第一多晶硅层并限定空气通道的侧壁。 用作字线的第二多晶硅层被定义在氧化物层上。 还公开了一种制造空气通道浮动栅极存储单元的方法。 在衬底上形成牺牲层。 在牺牲层上形成第一多晶硅层。 在第一多晶硅层上沉积氧化物层,使得氧化物层覆盖第一多晶硅层并限定牺牲层的侧壁。 使用热磷酸(H 3 PO 4)浸渍来蚀刻掉牺牲层以形成空气通道。
    • 18. 发明申请
    • Air tunnel floating gate memory cell and method for making the same
    • 空气隧道浮栅存储单元及其制作方法
    • US20060261402A1
    • 2006-11-23
    • US11134155
    • 2005-05-20
    • Hang-Ting LueErh-Kun LaiKuang-Yeu Hsieh
    • Hang-Ting LueErh-Kun LaiKuang-Yeu Hsieh
    • H01L29/78H01L21/4763
    • H01L27/115G11C16/0408H01L21/28273H01L27/11521H01L29/42324H01L29/515
    • An air tunnel floating gate memory cell includes an air tunnel defined over a substrate. A first polysilicon layer (floating gate) is defined over the air tunnel. An oxide layer is disposed over the first polysilicon layer such that the oxide layer caps the first polysilicon layer and defines the sidewalls of the air tunnel. A second polysilicon layer, functioning as a word line, is defined over the oxide layer. A method for making an air tunnel floating gate memory cell is also disclosed. A sacrificial layer is formed over a substrate. A first polysilicon layer is formed over the sacrificial layer. An oxide layer is deposited over the first polysilicon layer such that the oxide layer caps the first polysilicon layer and defines the sidewalls of the sacrificial layer. A hot phosphoric acid (H3PO4) dip is used to etch away the sacrificial layer to form an air tunnel.
    • 空气隧道浮动栅极存储单元包括限定在衬底上的空气通道。 在空气隧道上定义第一多晶硅层(浮栅)。 氧化物层设置在第一多晶硅层上,使得氧化物层覆盖第一多晶硅层并限定空气通道的侧壁。 用作字线的第二多晶硅层被定义在氧化物层上。 还公开了一种制造空气通道浮动栅极存储单元的方法。 在衬底上形成牺牲层。 在牺牲层上形成第一多晶硅层。 在第一多晶硅层上沉积氧化物层,使得氧化物层覆盖第一多晶硅层并限定牺牲层的侧壁。 使用热磷酸(H 3 PO 4)浸渍以蚀刻掉牺牲层以形成空气通道。