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    • 16. 发明申请
    • Insulating material
    • 绝缘材料
    • US20070123055A1
    • 2007-05-31
    • US11605512
    • 2006-11-28
    • Tomonori IshikawaAkio Sugiura
    • Tomonori IshikawaAkio Sugiura
    • H01L23/58H01L21/31
    • H01B3/40C08K5/17C08K5/19C08K9/04
    • Disclosed is an insulating material containing an epoxy resin, a curing agent and a nano-filling material having an aspect ratio of not more than 40 at a thickness of not more than 2 nm. The nano-filling material comprises an organized clay dispersed in the epoxy resin. The organized clay is produced from a clay mineral having a layered structure by organically treating the clay mineral with organic secondary, tertiary or quaternary ammonium ions having a nitrogen atom bonded with two, three or four organic modifying groups. The organic modifying group preferably has not more than 30 carbon atoms. At least one modifying group among the organic modifying groups has two or more carbon atoms. The insulating material can exhibit an excellent insulating property without causing substantial loss of the characteristics inherent to the resin.
    • 公开了一种绝缘材料,其包含厚度不大于2nm的长宽比不大于40的环氧树脂,固化剂和纳米填充材料。 纳米填充材料包括分散在环氧树脂中的有机粘土。 有机粘土由具有层状结构的粘土矿物制成,通过有机二氧化锆,有机二次,叔或季铵离子的有机处理,其中氮原子与两个,三个或四个有机改性基团结合。 有机修饰基团优选具有不超过30个碳原子。 有机修饰基中的至少一个修饰基团具有两个或更多个碳原子。 绝缘材料可以表现出优异的绝缘性能,而不会引起树脂固有的特性的显着损失。