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    • 11. 发明授权
    • Polishing apparatus with swinging structures
    • 具有摆动结构的抛光装置
    • US5653624A
    • 1997-08-05
    • US527422
    • 1995-09-13
    • Seiji IshikawaNorio KimuraKatsuyuki Aoki
    • Seiji IshikawaNorio KimuraKatsuyuki Aoki
    • B24B37/10B24B5/00B24B29/00
    • B24B37/105
    • A compact polishing apparatus requires less operating space than a conventional polishing apparatus generally used for polishing semiconductor wafers. The present apparatus has a swing shaft to provide a swing motion to a pressing device including a top ring member. There are three ranges of swing motion, i.e. a polishing range which is a small motion range used for polishing a wafer within the confined area of a turntable, a receiving range which is a medium motion range used for loading/unloading of a wafer in an area beyond the turntable, and a standby range which is a large motion range used for moving the top ring member to a standby or rinsing position in an area beyond the turntable. Because of the swing-based arrangement of the components in the present apparatus, isolation of critical components is easily achieved, thus resulting in low maintenance costs and long service life of the present apparatus. These advantages offer significant cost savings in the management of polishing operations.
    • 紧凑的抛光装置比通常用于抛光半导体晶片的常规抛光装置需要较少的操作空间。 本装置具有摆动轴,以向包括顶环构件的按压装置提供摆动运动。 有三个摆动运动范围,即抛光范围,该抛光范围是用于在转台的受限区域内抛光晶片的小运动范围,作为用于将晶片加载/卸载的介质运动范围的接收范围 以及用于将顶环构件移动到转台之外的区域中的待机或冲洗位置的大的运动范围的待机范围。 由于本装置中的部件的基于摆动的布置,容易实现关键部件的隔离,因此导致本装置的维护成本低和使用寿命长。 这些优点为抛光操作的管理提供了显着的成本节约。