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    • 11. 发明授权
    • Laser repair process for printed wiring boards
    • 印刷线路板激光修复工艺
    • US06222156B1
    • 2001-04-24
    • US09453809
    • 1999-12-03
    • Saswati Datta
    • Saswati Datta
    • B23K2600
    • H05K3/225B23K26/351H01L21/485H05K3/027
    • A method of repairing wiring shorts on a surface of an organic layer. The organic layer, which is preferably a SLC/ASM layer, may be a surface layer of a Printed Circuit (PC) board. The absorption spectrum of the organic layer is examined. Based on that absorption spectrum, a laser is selected with a wavelength such that the surface layer slightly absorbs, 1-10%, laser energy striking it. Thus, the laser removes metal on the surface, while slightly etching the surface layer and without effect on any metal buried in or beneath the surface layer. Preferably, the laser is an Nd:YAG laser having a wavelength in a range where the ASM layer absorption is between 2-5%, and the copper ablation rate is high.
    • 修复有机层表面上的布线短路的方法。 优选为SLC / ASM层的有机层可以是印刷电路板(PC)的表面层。 检查有机层的吸收光谱。 基于该吸收光谱,选择具有波长的激光,使得表面层稍微吸收激光能量的1-10%。 因此,激光去除表面上的金属,同时轻微蚀刻表面层,而不影响埋在表面层或其下的任何金属。 优选地,激光器是具有波长在ASM层吸收在2-5%之间的波长并且铜烧蚀速率高的Nd:YAG激光器。