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    • 12. 发明申请
    • ABSORBENT PRODUCT
    • 吸收产品
    • US20130102982A1
    • 2013-04-25
    • US13807518
    • 2011-06-29
    • Yuki NakanoAsami Kobori
    • Yuki NakanoAsami Kobori
    • A61F13/49A61F13/515
    • A61F13/49017A61F13/49001A61F13/49019A61F13/515
    • Provided is an underpants-type disposable diaper that is improved in a fit to a part from the intergluteal cleft to the crotch of a wearer and less prone to give a wearer a puffy and discomfort feeling at a crotch portion during wearing.In order to solve the above problem, provided is an underpants-type disposable diaper, wherein the back body part B has at an intergluteal cleft facing portion a bending fit portion 40 which is bent so as to enter into the intergluteal cleft of a wearer, the outer sheet 20 has at each of the front and back body parts F, B a lifting elastic member 26 - - - , 28 - - - which exerts a contraction force of a vertical component to lift a crotch portion toward a waist side, and a tensile stress on the front body part F undergoing vertical elastic deformation is larger than a tensile stress on the back body part B undergoing vertical elastic deformation.
    • 本发明提供一种内裤型一次性尿布,其与从穿着者的臀沟到裆部的部位配合得到改善,并且在穿着期间不太容易使穿着者在裆部发生浮肿和不适感。 为了解决上述问题,提供了一种内裤型一次性尿布,其中后身部分B在臀间裂缝面对部分处具有弯曲配合部分40,弯曲配合部分40弯曲以进入穿戴者的臀间裂缝, 外片20具有在前身体部和后身部分F,B中的每一个上施加垂直部分的收缩力以将裆部部分向腰侧提升的提升弹性部件26 - - ,28 - 经历垂直弹性变形的前身部分F上的拉伸应力大于经受垂直弹性变形的后身部分B上的拉伸应力。
    • 15. 发明申请
    • SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
    • 半导体器件及制造半导体器件的方法
    • US20120049202A1
    • 2012-03-01
    • US13259344
    • 2010-04-05
    • Yuki Nakano
    • Yuki Nakano
    • H01L29/161H01L21/336
    • H01L29/7813H01L29/0623H01L29/0696H01L29/1608H01L29/42368H01L29/45H01L29/66068
    • The semiconductor device according to the present invention includes a semiconductor layer of a first conductivity type made of SiC, a body region of a second conductivity type formed on a surface layer portion of the semiconductor layer, a gate trench dug down from a surface of the semiconductor layer with a bottom surface formed on a portion of the semiconductor layer under the body region, source regions of the first conductivity type formed on a surface layer portion of the body region adjacently to side surfaces of the gate trench, a gate insulating film formed on the bottom surface and the side surfaces of the gate trench so that the thickness of a portion on the bottom surface is greater than the thickness of portions on the side surfaces, a gate electrode embedded in the gate trench through the gate insulating film, and an implantation layer formed on a portion of the semiconductor layer extending from the bottom surface of the gate trench to an intermediate portion of the semiconductor layer in the thickness direction by implantation of a second conductivity type impurity.
    • 根据本发明的半导体器件包括由SiC制成的第一导电类型的半导体层,形成在半导体层的表面层部分上的第二导电类型的体区,从 半导体层,其具有形成在所述体区域的所述半导体层的一部分上的底面,所述第一导电型的源极区域形成在所述主体区域的与所述栅极沟槽的侧面相邻的表面层部分上,形成栅极绝缘膜 在栅极沟槽的底表面和侧表面上,使得底表面上的部分的厚度大于侧表面上的部分的厚度,通过栅极绝缘膜嵌入栅极沟槽中的栅电极,以及 所述注入层形成在所述半导体层的从所述栅极沟槽的底表面延伸到所述半导体的中间部分的部分上 通过注入第二导电型杂质在厚度方向上的导体层。
    • 20. 发明申请
    • CONNECTOR
    • 连接器
    • US20090017645A1
    • 2009-01-15
    • US12168047
    • 2008-07-03
    • Masayuki SuzukiYuki Nakano
    • Masayuki SuzukiYuki Nakano
    • H01R12/28
    • H01R12/88H01R12/57H01R12/79H01R12/82
    • A first contact and a second contact are inserted into one and the same inserting hole of a housing so that contact portions of the first and second contacts are facing to each other. The first contacts each include the contact portion at one end and a connection portion at the other end. The second contacts each includes a first piece having the contact portion at one end and a pressure receiving portion at the other end, a second piece having connection portion at an outer end, and an elastic jointing-portion for jointing the first piece and the remaining end of the second piece. A pivoting member includes an actuating portion, pushing portions, and anchoring holes. The pushing portions are pivotally moved between the pressure receiving portions and the connection portions of the second contacts, during which pivotal movement, the axis of rotation of the pushing portions is moved with their pivotal movement to achieve their compact rotation. The second contacts are each provided on the second piece with a fixing portion in the proximity of the elastic jointing-portion. The connector constructed as above described prevents the contacts from being warped or deformed when the pivoting member is being pivotally moved, and achieves a stable electrical connection, a reduced overall height of the connector and a high density of the conductors.
    • 将第一接触件和第二接触件插入到壳体的同一插入孔中,使得第一和第二接触件的接触部分彼此面对。 第一触点各自包括一端的接触部分和另一端的连接部分。 第二触点分别包括一端具有接触部分的第一部分和另一端处的受压部分,在外端具有连接部分的第二部件和用于将第一部件与其余部件接合的弹性接合部分 第二件的结尾。 枢转构件包括致动部分,推动部分和锚定孔。 推动部分在压力接收部分和第二接触件的连接部分之间枢转运动,在此期间枢转运动中,推动部分的旋转轴线以其枢转运动而移动以实现其紧凑的旋转。 第二触点分别设置在第二部件上,在弹性接合部分附近具有固定部分。 如上所述构造的连接器防止了当枢转构件被枢转地移动时触头翘曲或变形,并且实现了稳定的电连接,连接器的整体高度降低以及导体的高密度。