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11. 发明申请

US20070205773A1 FUNCTIONAL AND STRESS TESTING OF LGA DEVICES 失效
公开(公告)号：US20070205773A1
公开(公告)日：2007-09-06
申请号：US11747204
申请日：2007-05-10
申请人： John Corbin , Jose Garza , Dales Kent , Kenneth Larsen , Howard Mahaney , Hoa Phan , John Salazar
发明人： John Corbin , Jose Garza , Dales Kent , Kenneth Larsen , Howard Mahaney , Hoa Phan , John Salazar
IPC分类号： G01R31/00
CPC分类号： G01R31/2891
摘要： Improved methods, systems, and apparatuses are disclosed for testing LGA devices. One example embodiment include vertical routing of test nest assembly cooling lines in order to minimize the test nest footprint and increase available test sites on a single test card. Another example embodiment includes isolating and adjusting external loads and moments into the heatsink/cold plate, wherein these loads and moments involve controlling the centroid to restore more ideal thermal performance of the heatsink/chip interface. Still another example embodiment includes a nest architecture facilitating easy and low-cost replacement of LGA sockets. Finally, another example embodiment includes efficient condensation control of test nest assembly parts by using dry-air exhaust.

12. 发明申请

US20070205758A1 FUNCTIONAL AND STRESS TESTING OF LGA DEVICES 失效
公开(公告)号：US20070205758A1
公开(公告)日：2007-09-06
申请号：US11747216
申请日：2007-05-10
申请人： John Corbin , Jose Garza , Dales Kent , Kenneth Larsen , Howard Mahaney , Hoa Phan , John Salazar
发明人： John Corbin , Jose Garza , Dales Kent , Kenneth Larsen , Howard Mahaney , Hoa Phan , John Salazar
IPC分类号： G01R31/28
CPC分类号： G01R31/2891
摘要： Improved methods, systems, and apparatuses are disclosed for testing LGA devices. One example embodiment include vertical routing of test nest assembly cooling lines in order to minimize the test nest footprint and increase available test sites on a single test card. Another example embodiment includes isolating and adjusting external loads and moments into the heatsink/cold plate, wherein these loads and moments involve controlling the centroid to restore more ideal thermal performance of the heatsink/chip interface. Still another example embodiment includes a nest architecture facilitating easy and low-cost replacement of LGA sockets. Finally, another example embodiment includes efficient condensation control of test nest assembly parts by using dry-air exhaust.

13. 发明申请

US20050278706A1 System, method, and computer program product for logging diagnostic information 失效
标题翻译：用于记录诊断信息的系统，方法和计算机程序产品
公开(公告)号：US20050278706A1
公开(公告)日：2005-12-15
申请号：US11136160
申请日：2005-05-24
申请人： Jose Garza , Richard Johnson , Christopher Paice , Stephen Todd
发明人： Jose Garza , Richard Johnson , Christopher Paice , Stephen Todd
IPC分类号： G06F9/44
CPC分类号： G06F11/3636
摘要： System for logging diagnostic information, for use in a transactional environment having means for sending a transactional and re-sendable request to an application program. A counter is associated with the request, wherein a value associated with the counter is updated when an error occurs in the environment. The environment also comprises a counter threshold. The system comprises a comparator, responsive to sending the request, for comparing the value associated with the counter against the counter threshold; a tracing control component, responsive to the value associated with the counter meeting the counter threshold, for enabling a tracing program; and a logging component, responsive to re-sending the request, for logging diagnostic information generated by the tracing program.
摘要翻译：用于记录诊断信息的系统，用于具有用于向应用程序发送事务和可再发送请求的装置的事务环境中。计数器与请求相关联，其中当环境中发生错误时，更新与计数器相关联的值。环境还包括计数器阈值。该系统包括响应于发送请求的比较器，用于将与计数器相关联的值与计数器阈值进行比较; 跟踪控制组件，响应于与所述计数器相关联的值而满足所述计数器阈值，用于启用跟踪程序; 以及响应于重新发送请求的记录组件，用于记录跟踪程序生成的诊断信息。

14. 发明申请

US20070210819A1 FUNCTIONAL AND STRESS TESTING OF LGA DEVICES 失效
公开(公告)号：US20070210819A1
公开(公告)日：2007-09-13
申请号：US11747202
申请日：2007-05-10
申请人： John Corbin , Jose Garza , Dales Kent , Kenneth Larsen , Howard Mahaney , Hoa Phan , John Salazar
发明人： John Corbin , Jose Garza , Dales Kent , Kenneth Larsen , Howard Mahaney , Hoa Phan , John Salazar
IPC分类号： G01R31/28
CPC分类号： G01R31/2891
摘要： Improved methods, systems, and apparatuses are disclosed for testing LGA devices. One example embodiment include vertical routing of test nest assembly cooling lines in order to minimize the test nest footprint and increase available test sites on a single test card. Another example embodiment includes isolating and adjusting external loads and moments into the heatsink/cold plate, wherein these loads and moments involve controlling the centroid to restore more ideal thermal performance of the heatsink/chip interface. Still another example embodiment includes a nest architecture facilitating easy and low-cost replacement of LGA sockets. Finally, another example embodiment includes efficient condensation control of test nest assembly parts by using dry-air exhaust.

15. 发明申请

US20070205796A1 FUNCTIONAL AND STRESS TESTING OF LGA DEVICES 失效
公开(公告)号：US20070205796A1
公开(公告)日：2007-09-06
申请号：US11747197
申请日：2007-05-10
申请人： John Corbin , Jose Garza , Dales Kent , Kenneth Larsen , Howard Mahaney , Hoa Phan , John Salazar
发明人： John Corbin , Jose Garza , Dales Kent , Kenneth Larsen , Howard Mahaney , Hoa Phan , John Salazar
IPC分类号： G01R31/26
CPC分类号： G01R31/2891
摘要： Improved methods, systems, and apparatuses are disclosed for testing LGA devices. One example embodiment include vertical routing of test nest assembly cooling lines in order to minimize the test nest footprint and increase available test sites on a single test card. Another example embodiment includes isolating and adjusting external loads and moments into the heatsink/cold plate, wherein these loads and moments involve controlling the centroid to restore more ideal thermal performance of the heatsink/chip interface. Still another example embodiment includes a nest architecture facilitating easy and low-cost replacement of LGA sockets. Finally, another example embodiment includes efficient condensation control of test nest assembly parts by using dry-air exhaust.

16. 发明申请

US20050040838A1 Apparatus for functional and stress testing of exposed chip land grid array devices 失效
公开(公告)号：US20050040838A1
公开(公告)日：2005-02-24
申请号：US10645038
申请日：2003-08-21
申请人： Lonnie Cannon , John Corbin , David Gardell , Jose Garza , Jeffrey Kutner , Kenneth Larsen , Howard Mahaney , John Salazar
发明人： Lonnie Cannon , John Corbin , David Gardell , Jose Garza , Jeffrey Kutner , Kenneth Larsen , Howard Mahaney , John Salazar
IPC分类号： G01R31/26
CPC分类号： G01R31/2891
摘要： A chip testing system with improved thermal performance. In a preferred embodiment, a nest assembly of a chip testing apparatus includes tooling balls and a fitted frame for improving alignment of a coldplate and a chip surface. In preferred embodiments, the coldplate is of unibody design. Thermal performance is also improved by balancing the forces exerted on the coldplate using an adjustable hose mounting bracket. The bracket allows the forces exerted by the hoses on the coldplate to be adjusted so they balance and cancel other unwanted forces on the cold plate.

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