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11. 发明申请

US20060087044A1 Electronic component, and system carrier and panel for producing an electronic component 有权
标题翻译：电子部件，以及用于生产电子部件的系统载体和面板
公开(公告)号：US20060087044A1
公开(公告)日：2006-04-27
申请号：US11267589
申请日：2005-11-07
申请人： Bernd Goller
发明人： Bernd Goller
IPC分类号： H01L23/48 , H01L23/28
CPC分类号： H01L25/50 , H01L21/568 , H01L23/5389 , H01L24/19 , H01L24/96 , H01L24/97 , H01L25/0657 , H01L2224/05001 , H01L2224/05571 , H01L2224/12105 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/97 , H01L2225/06524 , H01L2225/06541 , H01L2225/06586 , H01L2924/00014 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01052 , H01L2924/01057 , H01L2924/01058 , H01L2924/01068 , H01L2924/01082 , H01L2924/14 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H05K1/185 , H05K1/187 , H05K3/205 , H05K3/423 , H05K3/4647 , Y10T29/49121 , H01L2224/81 , H01L2224/82 , H01L2924/00 , H01L2224/05599 , H01L2224/05099
摘要： An electronic component has a first semiconductor chip and a second semiconductor chip that is arranged on a plastic compound in which the first semiconductor chip is embedded. The semiconductor chips are connected to one another by rewiring layers and vias which extend between the rewiring layers, the vias being widened at a transition to one of the rewiring layers.
摘要翻译：电子部件具有第一半导体芯片和布置在第一半导体芯片被嵌入的塑料化合物上的第二半导体芯片。半导体芯片通过重新布线在重新布线层之间延伸的层和通孔而彼此连接，通孔在向重新布线层之一的过渡处被加宽。

12. 发明授权

US07795717B2 Electronic component embedded within a plastic compound and including copper columns within the plastic compound extending between upper and lower rewiring layers, and system carrier and panel for producing an electronic component 有权
标题翻译：嵌入在塑料化合物内的电子元件，包括在上和下重新布线层之间延伸的塑料化合物内的铜柱，以及用于制造电子部件的系统载体和面板
公开(公告)号：US07795717B2
公开(公告)日：2010-09-14
申请号：US11267589
申请日：2005-11-07
申请人： Bernd Goller
发明人： Bernd Goller
IPC分类号： H01L23/02 , H01L23/34 , H01L23/48 , H01L23/52 , H01L23/04 , H01L23/12 , H01L23/053 , H01L23/14 , H01L23/29 , H01L23/31 , H01L29/40
CPC分类号： H01L25/50 , H01L21/568 , H01L23/5389 , H01L24/19 , H01L24/96 , H01L24/97 , H01L25/0657 , H01L2224/05001 , H01L2224/05571 , H01L2224/12105 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/97 , H01L2225/06524 , H01L2225/06541 , H01L2225/06586 , H01L2924/00014 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01052 , H01L2924/01057 , H01L2924/01058 , H01L2924/01068 , H01L2924/01082 , H01L2924/14 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H05K1/185 , H05K1/187 , H05K3/205 , H05K3/423 , H05K3/4647 , Y10T29/49121 , H01L2224/81 , H01L2224/82 , H01L2924/00 , H01L2224/05599 , H01L2224/05099
摘要： An electronic component has a first semiconductor chip and a second semiconductor chip that is arranged on a plastic compound in which the first semiconductor chip is embedded. The semiconductor chips are connected to one another by rewiring layers and vias which extend between the rewiring layers, the vias being widened at a transition to one of the rewiring layers.
摘要翻译：电子部件具有第一半导体芯片和布置在第一半导体芯片被嵌入的塑料化合物上的第二半导体芯片。半导体芯片通过重新布线在重新布线层之间延伸的层和通孔彼此连接，通孔在向重新布线层之一的过渡处被加宽。

13. 发明授权

US07566968B2 Biosensor with smart card configuration 有权
标题翻译：具有智能卡配置的生物传感器
公开(公告)号：US07566968B2
公开(公告)日：2009-07-28
申请号：US11196497
申请日：2005-08-04
申请人： Michael Bauer , Bernd Goller , Robert-Christian Hagen , Gerald Ofner , Christian Stuempfl , Holger Woerner
发明人： Michael Bauer , Bernd Goller , Robert-Christian Hagen , Gerald Ofner , Christian Stuempfl , Holger Woerner
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： G01N33/48785 , B01L3/502715 , B01L9/52 , B01L2200/027 , B01L2300/0819 , B01L2300/0877 , H01L2924/0002 , H01L2924/00
摘要： A biosensor that has a smart card configuration includes a semiconductor chip including a bioactive structure and contact areas disposed on a first side of the semiconductor chip, and a rewiring substrate including contact pads, external contact areas and rewiring lines that electrically connect the contact pads to the external contact areas. The rewiring substrate covers a portion of the first side of the semiconductor chip without covering the bioactive structure, such that the rewiring substrate overlaps the contact areas of the semiconductor chip and the contact pads and the contact areas are aligned with and electrically connect to each other. In addition, a measuring apparatus is configured to receive the biosensor and conduct measurements of a fluid medium that is delivered into the measuring apparatus.
摘要翻译：具有智能卡结构的生物传感器包括：半导体芯片，包括生物活性结构和布置在半导体芯片的第一面上的接触区域;以及重新布线基板，包括接触焊盘，外部接触区域和将接触焊盘电连接到外部接触区域。再配线基板覆盖半导体芯片的第一侧的一部分而不覆盖生物活性结构，使得重新布线基板与半导体芯片和接触焊盘的接触区域重叠，并且接触区域彼此对准并电连接。此外，测量装置被配置为接收生物传感器并进行传送到测量装置中的流体介质的测量。

14. 发明申请

US20070128754A1 Sensor component and panel used for the production thereof 有权
标题翻译：用于生产的传感器部件和面板
公开(公告)号：US20070128754A1
公开(公告)日：2007-06-07
申请号：US10561819
申请日：2004-06-04
申请人： Edward Fuergut , Bernd Goller , Robert-Christian Hagen , Simon Jerebic , Jens Pohl , Peter Strobel , Holger Woerner
发明人： Edward Fuergut , Bernd Goller , Robert-Christian Hagen , Simon Jerebic , Jens Pohl , Peter Strobel , Holger Woerner
IPC分类号： H01L21/00 , H01L29/82
CPC分类号： H04N5/2253 , G01J1/02 , G01J1/0204 , G01J1/0411 , H01L23/5389 , H01L24/24 , H01L24/82 , H01L25/16 , H01L2224/04105 , H01L2224/12105 , H01L2224/24195 , H01L2224/24227 , H01L2224/32145 , H01L2224/73267 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/0101 , H01L2924/01032 , H01L2924/01052 , H01L2924/01057 , H01L2924/01058 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H04N5/2254 , H04N5/2257
摘要： A sensor component and a panel used for the production thereof is disclosed. The sensor component has, in addition to a sensor chip with a sensor region, a rear side and passive components. These are embedded jointly in a plastics composition, in such a way that their respective electrodes can be wired from an overall top side of a plastic plate.
摘要翻译：公开了用于生产传感器部件和面板。除了具有传感器区域的传感器芯片之外，传感器部件还具有后侧和无源部件。它们共同地嵌入塑料组合物中，使得它们各自的电极可以从塑料板的整个顶侧布线。

15. 发明授权

US5681060A Plug-in connector for a pressure pipe system 失效
标题翻译：用于压力管道系统的插入式连接器
公开(公告)号：US5681060A
公开(公告)日：1997-10-28
申请号：US758978
申请日：1996-12-02
申请人： Manfred Berg , Bernd Goller
发明人： Manfred Berg , Bernd Goller
IPC分类号： F16L37/088
CPC分类号： F16L37/088
摘要： A connector having a plug part insertable in a sealing and locking manner into a receiver opening of a socket part. An annular retaining element is preassembled into a ring groove of one of the connector parts, prior to insertion. The retaining element is deformable in a radially elastic manner during the insertion process so that the sealing element is pressed into the ring groove, and the retaining element then deforms in an elastic manner into a locking position to engage a ring groove of the other connector part. The retaining element corresponds at least approximately in longitudinal and transverse cross section to the longitudinal and transverse cross sections of the first-mentioned ring groove, at least over two diametrically-opposed regions of the circumference of that ring groove.
摘要翻译：一种连接器，其具有可以密封和锁定方式插入到插座部分的接收器开口中的插头部分。在插入之前，环形保持元件预先组装到一个连接器部件的环形槽中。保持元件在插入过程中可以以径向弹性的方式变形，使得密封元件被压入环槽中，并且保持元件然后以弹性方式变形到锁定位置以接合另一个连接器部分的环槽。保持元件至少在纵向和横向横截面上对应于首先提及的环槽的纵向和横向横截面，至少在该环形槽的圆周的两个直径相对的区域上。

16. 发明授权

US08753901B2 Semiconductor wafer with electrically connected contact and test areas 有权
标题翻译：具有电气连接接触和测试区域的半导体晶圆
公开(公告)号：US08753901B2
公开(公告)日：2014-06-17
申请号：US13192974
申请日：2011-07-28
申请人： Ertle Werner , Bernd Goller , Michael Horn , Bernd Kothe
发明人： Ertle Werner , Bernd Goller , Michael Horn , Bernd Kothe
IPC分类号： H01L21/66 , G01R31/26
CPC分类号： H01L24/06 , H01L22/32 , H01L24/05 , H01L2224/02166 , H01L2224/0392 , H01L2224/04042 , H01L2224/05553 , H01L2224/05624 , H01L2224/48463 , H01L2224/4847 , H01L2224/4943 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/0102 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01046 , H01L2924/01052 , H01L2924/01057 , H01L2924/01068 , H01L2924/01073 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/13091 , H01L2924/14 , H01L2924/00014 , H01L2924/00
摘要： The invention relates to an arrangement of contact areas and test areas on patterned semiconductor chips. The contact areas and the test areas are electrically connected to one another via a conduction web. Whereas the contact areas are arranged in a first region, which has no components of an integrated circuit, the test areas lie in a second region of the top side of the semiconductor chip, which region has components of an integrated circuit.
摘要翻译：本发明涉及图案化半导体芯片上的接触区域和测试区域的布置。接触区域和测试区域通过传导网彼此电连接。而接触区域布置在没有集成电路的部件的第一区域中，测试区域位于半导体芯片的顶侧的第二区域中，该区域具有集成电路的部件。

17. 发明授权

US07524699B2 Electronic component and a panel 有权
标题翻译：电子元件和面板
公开(公告)号：US07524699B2
公开(公告)日：2009-04-28
申请号：US10529565
申请日：2004-07-08
申请人： Edward Fuergut , Bernd Goller , Robert-Christian Hagen , Simon Jerebic , Jens Pohl , Peter Strobel , Holger Woerner
发明人： Edward Fuergut , Bernd Goller , Robert-Christian Hagen , Simon Jerebic , Jens Pohl , Peter Strobel , Holger Woerner
IPC分类号： H01L21/44 , H01L21/48 , H01L21/50
CPC分类号： H01L23/3128 , H01L23/49537 , H01L23/49575 , H01L24/45 , H01L24/48 , H01L24/97 , H01L25/065 , H01L25/0657 , H01L2224/05001 , H01L2224/05026 , H01L2224/05571 , H01L2224/056 , H01L2224/16 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/97 , H01L2225/0651 , H01L2225/06517 , H01L2225/06527 , H01L2225/06541 , H01L2225/06572 , H01L2225/06582 , H01L2924/00014 , H01L2924/01005 , H01L2924/0101 , H01L2924/01013 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01057 , H01L2924/01058 , H01L2924/01068 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2224/85 , H01L2924/00 , H01L2224/05099 , H01L2924/00012
摘要： One embodiment of the invention relates to an electronic component having stacked semiconductor chips, and to a panel for production of the component. In one case, the stack has a flat conductor structure with a chip island on which a stacked semiconductor chip is arranged, while a first semiconductor chip is located underneath it. The chip island is surrounded by flat conductors which have contact pillars. These contact pillars have pillar contact pads which, together with the active upper face of the first semiconductor chip and the upper face areas of a plastic encapsulation compound form a coplanar overall upper face.
摘要翻译：本发明的一个实施例涉及具有堆叠的半导体芯片的电子部件和用于生产部件的面板。在一种情况下，堆叠具有平坦的导体结构，其中布置有堆叠半导体芯片的芯片岛，而第一半导体芯片位于其下方。芯片岛由具有接触柱的扁平导体包围。这些接触柱具有支柱接触垫，其与第一半导体芯片的有源上表面和塑料封装化合物的上表面区域一起形成共面的整个上表面。

18. 发明申请

US20070108580A1 Semiconductor wafer, panel and electronic component with stacked semiconductor chips, and also method for producing same 有权
标题翻译：具有堆叠半导体芯片的半导体晶片，面板和电子部件，以及其制造方法
公开(公告)号：US20070108580A1
公开(公告)日：2007-05-17
申请号：US10555858
申请日：2004-05-04
申请人： Bernd Goller
发明人： Bernd Goller
IPC分类号： H01L23/02
CPC分类号： H01L24/82 , H01L21/561 , H01L21/568 , H01L23/16 , H01L23/3114 , H01L24/19 , H01L24/94 , H01L24/96 , H01L24/97 , H01L25/0657 , H01L25/50 , H01L2224/04105 , H01L2224/05571 , H01L2224/05573 , H01L2224/12105 , H01L2224/16145 , H01L2224/73209 , H01L2224/92124 , H01L2224/94 , H01L2224/97 , H01L2225/06513 , H01L2225/06517 , H01L2225/06527 , H01L2225/06586 , H01L2924/00014 , H01L2924/01004 , H01L2924/01029 , H01L2924/01033 , H01L2924/01068 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2224/82 , H01L2224/81 , H01L2924/00012 , H01L2224/05599
摘要： A semiconductor wafer, a panel, and an electronic component, and also methods for producing them is disclosed. In this context, the electronic component has a stack of two semiconductor chips. The top stacked semiconductor chip is thin-ground and is arranged using flip-chip technology on a central regions of the bottom semiconductor chip. An edge region of the bottom semiconductor chip contains vias through a leveling layer to a rewiring plane, which for its part carries external contacts.
摘要翻译：公开了一种半导体晶片，面板和电子部件，以及其制造方法。在这种情况下，电子部件具有两个半导体芯片的堆叠。顶层堆叠的半导体芯片是薄地，并且在底部半导体芯片的中心区域上使用倒装芯片技术布置。底部半导体芯片的边缘区域包含通过调平层的通孔到重新布线平面，其重新布线，其部分承载外部接触。

19. 发明申请

US20060157849A1 Electronic component with semiconductor chip and semiconductor wafer with contact pads, and method for the production thereof 审中-公开
标题翻译：具有半导体芯片的电子部件和具有接触焊盘的半导体晶片及其制造方法
公开(公告)号：US20060157849A1
公开(公告)日：2006-07-20
申请号：US11337084
申请日：2006-01-23
申请人： Bernd Goller , Hermann Vilsmeier
发明人： Bernd Goller , Hermann Vilsmeier
IPC分类号： H01L23/48 , H01L21/44
CPC分类号： H01L24/05 , H01L24/03 , H01L24/06 , H01L24/48 , H01L2224/04042 , H01L2224/05556 , H01L2224/05599 , H01L2224/45015 , H01L2224/4845 , H01L2224/48463 , H01L2224/85205 , H01L2224/85399 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01033 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/181 , H01L2924/20751 , H01L2924/20752 , H01L2224/45099 , H01L2924/00
摘要： An electronic component with semiconductor chips and a semiconductor wafer with contact pads are described, as well as methods of forming such structures. The contact pads on the semiconductor chip include mesa structures that are dimensioned in such a way that they are adapted to the sizes of compression heads of bond connections and also exert a pressure-distributing effect on the upper side of the contact pads.
摘要翻译：描述了具有半导体芯片的电子部件和具有接触焊盘的半导体晶片，以及形成这种结构的方法。半导体芯片上的接触焊盘包括台面结构，其尺寸使得它们适合于接合连接的压缩头的尺寸，并且还在接触焊盘的上侧施加压力分布效应。

20. 发明申请

US20060125042A1 Electronic component and panel for producing the same 有权
标题翻译：电子部件和面板用于生产
公开(公告)号：US20060125042A1
公开(公告)日：2006-06-15
申请号：US10529565
申请日：2004-07-08
申请人： Edward Fuergut , Bernd Goller , Robert-Christian Hagen , Simon Jerebic , Jens Pohl , Peter Strobel , Holger Woerner
发明人： Edward Fuergut , Bernd Goller , Robert-Christian Hagen , Simon Jerebic , Jens Pohl , Peter Strobel , Holger Woerner
IPC分类号： H01L29/00
CPC分类号： H01L23/3128 , H01L23/49537 , H01L23/49575 , H01L24/45 , H01L24/48 , H01L24/97 , H01L25/065 , H01L25/0657 , H01L2224/05001 , H01L2224/05026 , H01L2224/05571 , H01L2224/056 , H01L2224/16 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/97 , H01L2225/0651 , H01L2225/06517 , H01L2225/06527 , H01L2225/06541 , H01L2225/06572 , H01L2225/06582 , H01L2924/00014 , H01L2924/01005 , H01L2924/0101 , H01L2924/01013 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01057 , H01L2924/01058 , H01L2924/01068 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2224/85 , H01L2924/00 , H01L2224/05099 , H01L2924/00012
摘要： One embodiment of the invention relates to an electronic component having stacked semiconductor chips, and to a panel for production of the component. In one case, the stack has a flat conductor structure with a chip island on which a stacked semiconductor chip is arranged, while a first semiconductor chip is located underneath it. The chip island is surrounded by flat conductors which have contact pillars. These contact pillars have pillar contact pads which, together with the active upper face of the first semiconductor chip and the upper face areas of a plastic encapsulation compound form a coplanar overall upper face.
摘要翻译：本发明的一个实施例涉及具有堆叠的半导体芯片的电子部件和用于生产部件的面板。在一种情况下，堆叠具有平坦的导体结构，其中布置有堆叠半导体芯片的芯片岛，而第一半导体芯片位于其下方。芯片岛由具有接触柱的扁平导体包围。这些接触柱具有支柱接触垫，其与第一半导体芯片的有源上表面和塑料封装化合物的上表面区域一起形成共面的整个上表面。

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