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    • 18. 发明授权
    • Plasma etching of organic materials
    • 有机材料的等离子体蚀刻
    • US4529860A
    • 1985-07-16
    • US403995
    • 1982-08-02
    • Francine Y. Robb
    • Francine Y. Robb
    • C08J7/00H01L21/302H01L21/3065H01L21/311B23K9/00
    • H01L21/31138H01L21/311
    • A method is provided for anisotropically etching organic material to reduce mask undercutting. The layer of organic material to be patterned, with an overlying patterning mask is provided on a substrate. The substrate with the layer of organic material on it is placed on the powered electrode within a plasma reactor. A hydrogen plasma is generated in the reactor at a pressure between about 13.3 Pa and about 53 Pa. The organic layer which is not protected by the etch mask is etched by the hydrogen plasma. At these pressures the organic layer is removed by a process of ion assisted etching in which the hydrogen plasma chemically reacts with the organic material and the reaction is enhanced by ionic bombardment of the plasma species. Because the substrate and the organic material are placed on the powered electrode, the plasma ions impact the surface of the organic layer in a direction substantially perpendicular to the surface of the layer thus providing anisotropy to the etch.
    • 提供了一种用于各向异性蚀刻有机材料以减少掩模底切的方法。 在基板上设置有图案化的有机材料层,具有上覆图案掩模。 其上具有有机材料层的衬底被放置在等离子体反应器内的动力电极上。 在反应器中在约13.3Pa至约53Pa之间的压力下产生氢等离子体,用氢等离子体蚀刻未被蚀刻掩模保护的有机层。 在这些压力下,通过离子辅助蚀刻的过程去除有机层,其中氢等离子体与有机材料发生化学反应,并且通过等离子体物质的离子轰击增强反应。 因为衬底和有机材料被放置在动力电极上,等离子体离子在基本上垂直于层的表面的方向上冲击有机层的表面,从而提供蚀刻的各向异性。