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    • 11. 发明授权
    • NOR and NAND memory arrangement of resistive memory elements
    • NOR和NAND存储器布置的电阻存储器元件
    • US07746683B2
    • 2010-06-29
    • US11737236
    • 2007-04-19
    • Kurt HoffmannChristine DehmRecai SeziAndreas Walter
    • Kurt HoffmannChristine DehmRecai SeziAndreas Walter
    • G11C11/00
    • G11C13/003B82Y10/00G11C13/0004G11C13/0014G11C13/0016G11C13/0019G11C2213/15G11C2213/75G11C2213/79
    • A memory arrangement includes: a first line for applying a reference voltage, a second line for applying an operating voltage, and a plurality of resistive memory elements, each element includes a resistive memory cell and a MOS memory cell selection transistor. A NOR memory arrangement is configured with each memory element including the resistive memory cell and selection transistor connected in series with the transistor connected to the first line, and the memory cell connected to the second line. A NAND memory arrangement is configured with a series of resistive memory elements forming a chain with each memory element including the resistive memory cell and selection transistor connected in parallel. The chain is connected to the first line disposed on a side of the memory cells facing the selection transistors and the second line disposed on a side of the memory cells which is remote from the selection transistors.
    • 存储器装置包括:用于施加参考电压的第一线,用于施加工作电压的第二线和多个电阻性存储器元件,每个元件包括电阻存储器单元和MOS存储单元选择晶体管。 NOR存储器配置配置有每个存储器元件,其包括与连接到第一线路的晶体管串联连接的电阻存储器单元和选择晶体管,以及连接到第二线路的存储器单元。 NAND存储器配置配置有一系列形成链的电阻存储元件,每个存储元件包括并联连接的电阻存储单元和选择晶体管。 链条连接到布置在面向选择晶体管的存储单元的一侧上的第一行,而第二行设置在远离选择晶体管的存储单元的一侧。
    • 15. 发明授权
    • Apparatus and method for minimizing diffusion in stacked capacitors formed on silicon plugs
    • 用于最小化在硅插头上形成的堆叠电容器中的扩散的装置和方法
    • US06228701B1
    • 2001-05-08
    • US08994275
    • 1997-12-19
    • Christine DehmStephen K. LohCarlos Mazuré
    • Christine DehmStephen K. LohCarlos Mazuré
    • H01L218242
    • H01L28/75H01L27/10855Y10S438/922
    • Methods and apparatus for fabricating stacked capacitor structures, which include barrier layers, are disclosed. According to one aspect of the present invention, a method for reducing outdiffusion within an integrated circuit includes forming a gate oxide layer over a substrate, and further forming a silicon plug over a portion of the gate oxide layer. A silicon dioxide layer is then formed over the gate oxide layer, and is arranged around the silicon plug. A first barrier film is formed over the silicon plug, and a dielectric layer is formed over the silicon dioxide layer. In one embodiment, forming the first barrier film includes forming a first oxide layer over the silicon plug, nitridizing the first oxide layer, and etching the nitridized first oxide layer.
    • 公开了用于制造包括阻挡层的叠层电容器结构的方法和装置。 根据本发明的一个方面,一种用于减小集成电路内的扩散扩散的方法包括:在衬底上形成栅极氧化层,并进一步在栅极氧化物层的一部分上形成硅插头。 然后在栅极氧化物层上形成二氧化硅层,并且布置在硅插头周围。 在硅塞上形成第一阻挡膜,并且在二氧化硅层上形成电介质层。 在一个实施例中,形成第一阻挡膜包括在硅插塞上形成第一氧化物层,对第一氧化物层进行氮化,以及蚀刻氮化的第一氧化物层。
    • 16. 发明授权
    • Method of forming a dopant outdiffusion control structure including
selectively grown silicon nitride in a trench capacitor of a DRAM cell
    • 在DRAM单元的沟槽电容器中形成包括选择性地生长的氮化硅的掺杂剂扩散扩散控制结构的方法
    • US5998253A
    • 1999-12-07
    • US993743
    • 1997-12-19
    • Stephen K. LohChristine DehmChristopher C. Parks
    • Stephen K. LohChristine DehmChristopher C. Parks
    • H01L29/78H01L21/28H01L21/8234H01L21/8238H01L27/088H01L29/49H01L21/70
    • H01L21/8238H01L21/28061H01L29/4916H01L29/4933
    • A method for controlling dopant outdiffusion within an integrated circuit is disclosed. The method includes providing a substrate, forming a trench in the substrate, and forming a first doped layer in the trench. The first doped layer has a first dopant concentration. The method further includes forming a dopant diffusion control structure above the first doped layer. The dopant diffusion control structure includes silicon nitride (Si.sub.x N.sub.y) disposed in grain boundaries of the first doped layer. The method also includes forming a second layer above the dopant diffusion control structure. The second layer has a second dopant concentration lower than the first dopant concentration. Forming the dopant diffusion control structure includes, in one example, forming a first oxide layer over the first doped silicon layer, nitridizing the first oxide layer, thereby forming an oxynitride (SiO.sub.x N.sub.y) layer and causing the silicon nitride to migrate into the grain boundaries, and removing the oxynitride layer, thereby exposing the silicon nitride at the grain boundaries at an interface of the first doped layer.
    • 公开了一种用于控制集成电路内的掺杂物扩散扩散的方法。 该方法包括提供衬底,在衬底中形成沟槽,以及在沟槽中形成第一掺杂层。 第一掺杂层具有第一掺杂浓度。 该方法还包括在第一掺杂层之上形成掺杂剂扩散控制结构。 掺杂剂扩散控制结构包括设置在第一掺杂层的晶界中的氮化硅(SixNy)。 该方法还包括在掺杂剂扩散控制结构上方形成第二层。 第二层具有低于第一掺杂剂浓度的第二掺杂剂浓度。 在一个示例中,形成掺杂剂扩散控制结构包括在第一掺杂硅层上形成第一氧化物层,对第一氧化物层进行氮化,从而形成氧氮化物(SiO x N y)层并使氮化硅迁移到晶界, 并去除氧氮化物层,从而在第一掺杂层的界面处的晶界暴露氮化硅。
    • 18. 发明申请
    • NOR and NAND Memory Arrangement of Resistive Memory Elements
    • NOR和NAND内存排列的电阻式存储元件
    • US20070242496A1
    • 2007-10-18
    • US11737236
    • 2007-04-19
    • Kurt HoffmannChristine DehmRecai SeziAndreas Walter
    • Kurt HoffmannChristine DehmRecai SeziAndreas Walter
    • G11C11/00
    • G11C13/003B82Y10/00G11C13/0004G11C13/0014G11C13/0016G11C13/0019G11C2213/15G11C2213/75G11C2213/79
    • A memory arrangement includes: a first line for applying a reference voltage, a second line for applying an operating voltage, and a plurality of resistive memory elements, each element includes a resistive memory cell and a MOS memory cell selection transistor. A NOR memory arrangement is configured with each memory element including the resistive memory cell and selection transistor connected in series with the transistor connected to the first line, and the memory cell connected to the second line. A NAND memory arrangement is configured with a series of resistive memory elements forming a chain with each memory element including the resistive memory cell and selection transistor connected in parallel. The chain is connected to the first line disposed on a side of the memory cells facing the selection transistors and the second line disposed on a side of the memory cells which is remote from the selection transistors.
    • 存储器装置包括:用于施加参考电压的第一线,用于施加工作电压的第二线和多个电阻性存储器元件,每个元件包括电阻存储器单元和MOS存储单元选择晶体管。 NOR存储器配置配置有每个存储器元件,其包括与连接到第一线路的晶体管串联连接的电阻存储器单元和选择晶体管,以及连接到第二线路的存储器单元。 NAND存储器配置配置有一系列形成链的电阻存储元件,每个存储元件包括并联连接的电阻存储单元和选择晶体管。 链条连接到布置在面向选择晶体管的存储单元的一侧上的第一行,而第二行设置在远离选择晶体管的存储单元的一侧。