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11. 发明授权

US5685327A Ultra-low particle semiconductor apparatus 失效
标题翻译：超低粒子半导体装置
公开(公告)号：US5685327A
公开(公告)日：1997-11-11
申请号：US695285
申请日：1996-08-08
申请人： Raj Mohindra , Abhay Bhushan , Rajiv Bhushan , Suraj Puri , John H. Anderson , Jeffrey Nowell
发明人： Raj Mohindra , Abhay Bhushan , Rajiv Bhushan , Suraj Puri , John H. Anderson , Jeffrey Nowell
IPC分类号： B08B3/10 , G11B23/50 , H01L21/00 , H01L21/306 , B08B3/04
CPC分类号： H01L21/02052 , B08B3/10 , G11B23/505 , H01L21/67028 , H01L21/67051 , H01L21/67057 , H01L21/6708 , H01L21/67086 , H01L21/02049 , Y10S134/902
摘要： Apparatus for cleaning and drying a semiconductor wafer. The apparatus includes a vessel adapted to immerse a partially completed semiconductor wafer in a liquid comprising water. The apparatus also includes a control valve operably coupled to the vessel through a drain, and adapted to allow a gaseous mixture to displace the liquid in the vessel, where the liquid is displaced adjacent to the front face of the partially completed wafer. A controller is included. The controller is operably coupled to a plurality of nozzles. The controller can be used to pulse a drying fluid from the plurality of nozzles to the partially completed wafer to remove a possibility of liquid which may be attached to the partially completed wafer.
摘要翻译：用于清洁和干燥半导体晶片的装置。该装置包括适于将部分完成的半导体晶片浸入包含水的液体中的容器。该装置还包括控制阀，该控制阀通过排水口可操作地连接到容器，并且适于允许气体混合物移动容器中的液体，其中液体邻近部分完成的晶片的前表面移动。包括控制器。控制器可操作地耦合到多个喷嘴。控制器可以用于将干燥流体从多个喷嘴脉冲到部分完成的晶片，以消除可能附着到部分完成的晶片的液体的可能性。

12. 发明授权

US5571337A Method for cleaning and drying a semiconductor wafer 失效
标题翻译：清洗和干燥半导体晶片的方法
公开(公告)号：US5571337A
公开(公告)日：1996-11-05
申请号：US437541
申请日：1995-05-09
申请人： Raj Mohindra , Abhay Bhushan , Rajiv Bhushan , Suraj Puri , John H. Anderson , Jeffrey Nowell
发明人： Raj Mohindra , Abhay Bhushan , Rajiv Bhushan , Suraj Puri , John H. Anderson , Jeffrey Nowell
IPC分类号： B08B3/10 , G11B23/50 , H01L21/00 , H01L21/306 , B08B3/04
CPC分类号： H01L21/02052 , B08B3/10 , G11B23/505 , H01L21/67028 , H01L21/67051 , H01L21/67057 , H01L21/6708 , H01L21/67086 , H01L21/02049 , Y10S134/902
摘要： A method for drying articles with flat surfaces such as a semiconductor wafer. The method includes steps of immersing a semiconductor wafer in a liquid such as water, and displacing the liquid with a gaseous mixture. The liquid is displaced adjacent to a face of the wafer as measured from the face. A step of pulsing drying fluid directed at wafer edges is also included. The method dries wafers without the use of any harmful organic solvents and the like, and also dries wafers without substantial movement.
摘要翻译：用于干燥具有诸如半导体晶片的平坦表面的物品的方法。该方法包括以下步骤：将半导体晶片浸入诸如水的液体中，并用气体混合物置换液体。液体从表面测量时相邻于晶片的表面移动。脉冲干燥流体的步骤也指向晶片边缘。该方法干燥晶片而不使用任何有害的有机溶剂等，并且干燥晶片而没有实质的移动。

13. 发明授权

US5958146A Ultra-low particle semiconductor cleaner using heated fluids 失效
标题翻译：使用加热流体的超低颗粒半导体清洁剂
公开(公告)号：US5958146A
公开(公告)日：1999-09-28
申请号：US160505
申请日：1998-09-24
申请人： Raj Mohindra , Abhay Bhushan , Rajiv Bhushan , Suraj Puri , David Wong
发明人： Raj Mohindra , Abhay Bhushan , Rajiv Bhushan , Suraj Puri , David Wong
IPC分类号： H01L21/00 , H01L21/306 , B08B3/04 , B08B3/10 , B08B5/00
CPC分类号： H01L21/67057 , H01L21/67051 , H01L21/02049 , Y10S134/902
摘要： A method (400) for cleaning a semiconductor wafer. The method includes immersing (420) a wafer in a hot or heated liquid comprising water. The wafer has a front face, a back face, and an edge. The method also includes providing a substantially particle free environment adjacent to the front face and the back face as the liquid is being removed. A step of introducing a carrier gas comprising a cleaning enhancement substance during the providing step (450) also is included. The cleaning enhancement substance dopes the liquid which is attached to the front face and the back face to cause a concentration gradient of the cleaning enhancement substance in the attached liquid to accelerate fluid flow of the attached liquid off of the wafer.
摘要翻译：一种用于清洁半导体晶片的方法（400）。该方法包括将晶片浸入（420）包含水的热或加热液体中。晶片具有前表面，后表面和边缘。该方法还包括当正在除去液体时提供与前表面和背面相邻的基本上无颗粒的环境。还包括在提供步骤（450）期间引入包含清洁增强物质的载气的步骤。清洁增强物质涂覆附着在前表面和背面上的液体，引起附着液体中的清洁增强物质的浓度梯度，从而加速了附着液体流出晶片的流体流动。

14. 发明授权

US6004399A Ultra-low particle semiconductor cleaner for removal of particle contamination and residues from surface oxide formation on semiconductor wafers 失效
标题翻译：用于去除颗粒污染的超低颗粒半导体清洁剂和半导体晶片上表面氧化物形成的残留物
公开(公告)号：US6004399A
公开(公告)日：1999-12-21
申请号：US784207
申请日：1997-01-15
申请人： Kaichiu Wong , Krishnaswamy Ramkumar , Hanna Bamnolker , Suraj Puri , Rajiv Bhushan , David Wong , Gary Elmore , Raj Mohindra
发明人： Kaichiu Wong , Krishnaswamy Ramkumar , Hanna Bamnolker , Suraj Puri , Rajiv Bhushan , David Wong , Gary Elmore , Raj Mohindra
IPC分类号： B08B3/04 , B08B3/10 , B08B3/12 , H01L21/00 , B08B3/08
CPC分类号： H01L21/67057 , B08B3/04 , B08B3/102 , B08B3/12 , H01L21/67051 , Y10S134/902
摘要： A method is described for cleaning a semiconductor wafer. The method includes immersing a wafer in a liquid comprising water. The wafer has a front face, a back face, and an edge. The method also includes providing a substantially particle free environment adjacent to the front face and the back face as the liquid is being removed. A step of introducing a carrier gas comprising a cleaning enhancement substance also is included. It is believed that the cleaning enhancement substance dopes any liquid adhered to the front and back faces of the wafer to cause a concentration gradient of the cleaning enhancement substance in the liquid and accelerate removal of the adhered liquid off of the water.
摘要翻译：描述了一种用于清洁半导体晶片的方法。该方法包括将晶片浸入包含水的液体中。晶片具有前表面，后表面和边缘。该方法还包括当正在除去液体时提供与前表面和背面相邻的基本上无颗粒的环境。还包括引入包含清洁增强物质的载气的步骤。相信清洁增强物质会粘附到晶片的正面和背面的任何液体，从而引起液体中清洁增强物质的浓度梯度，并加速从水中除去附着液体。

15. 发明授权

US06312597B1 Apparatus for delivering ultra-low particle counts in semiconductor manufacturing 失效
标题翻译：用于在半导体制造中提供超低粒子计数的装置
公开(公告)号：US06312597B1
公开(公告)日：2001-11-06
申请号：US08568595
申请日：1995-12-01
申请人： Raj Mohindra , Abhay K. Bhushan , Rajiv Bhushan , Suraj Puri
发明人： Raj Mohindra , Abhay K. Bhushan , Rajiv Bhushan , Suraj Puri
IPC分类号： B08B310
CPC分类号： H01L21/02052 , H01L21/67028 , Y10S134/902 , Y10S210/90
摘要： The invention relates to a wafer rinsing system for rinsing chemicals and particles off of wafers without introducing contaminants. The system reduces the particle count on wafers by filtering the water and the gas used during rinsing at the wet bench. The system includes a rinsing unit, a local water filter bank, a local gas filtering system, an H2O2 injection unit, an auxiliary chemical injection unit, and a controller for operating the other components. The water filter bank provides a multiple stage filtering system to eliminate particles without a substantial drop in water pressure. The H2O2 injection unit provides a local source of H2O2 to clean the filter and rinser and to provide a mechanism for controlling the formation of native oxide on the wafer during rinsing. The auxiliary chemical injection unit provides a chemical additive to the rinsing unit to enhance the wafer cleaning process. The gas filtering system provides clean gas to the rinsing unit and to the injection units. The clean gas provides a clean atmosphere over the chemicals in each injection unit, and over the water in the rinser.
摘要翻译：本发明涉及一种用于在不引入污染物的情况下漂洗化学品和离开晶片的颗粒的晶片冲洗系统。该系统通过过滤在湿式工作台漂洗期间使用的水和气体来减少晶片上的颗粒数。该系统包括冲洗单元，局部水过滤器组，局部气体过滤系统，H 2 O 2注入单元，辅助化学品注入单元和用于操作其它组件的控制器。水过滤器组提供了一个多级过滤系统，以消除颗粒物而不会明显下降水压。 H 2 O 2注入单元提供H 2 O 2的局部源以清洁过滤器和冲洗器，并提供用于在冲洗期间控制晶片上的天然氧化物形成的机制。辅助化学品注入单元为冲洗单元提供化学添加剂以增强晶片清洗过程。气体过滤系统为冲洗单元和注射单元提供清洁的气体。清洁气体在每个注射单元中的化学品和冲洗器中的水中提供清洁的气氛。

16. 发明授权

US5651379A Method and apparatus for delivering ultra-low particle counts in semiconductor manufacturing 失效
标题翻译：用于在半导体制造中提供超低粒子计数的方法和装置
公开(公告)号：US5651379A
公开(公告)日：1997-07-29
申请号：US566302
申请日：1995-12-01
申请人： Raj Mohindra , Abhay K. Bhushan , Rajiv Bhushan , Suraj Puri
发明人： Raj Mohindra , Abhay K. Bhushan , Rajiv Bhushan , Suraj Puri
IPC分类号： B08B3/10 , B01D35/02 , B01D35/06 , B03C5/00 , B03C5/02 , H01L21/00 , H01L21/304 , H01L21/306 , B08B3/04
CPC分类号： H01L21/02052 , H01L21/67028 , Y10S134/902 , Y10S210/90
摘要： The invention relates to a wafer rinsing system for rinsing chemicals and particles off of wafers without introducing contaminants. The system reduces the particle count on wafers by filtering the water and the gas used during rinsing at the wet bench. The system includes a rinsing unit, a local water filter bank, a local gas filtering system, an H.sub.2 O.sub.2 injection unit, an auxiliary chemical injection unit, and a controller for operating the other components. The water filter bank provides a multiple stage filtering system to eliminate particles without a substantial drop in water pressure. The H.sub.2 O.sub.2 injection unit provides a local source of H.sub.2 O.sub.2 to clean the filter and rinser and to provide a mechanism for controlling the formation of native oxide on the wafer during rinsing. The auxiliary chemical injection unit provides a chemical additive to the rinsing unit to enhance the wafer cleaning process. The gas filtering system provides clean gas to the rinsing unit and to the injection units. The clean gas provides a clean atmosphere over the chemicals in each injection unit, and over the water in the rinser.
摘要翻译：本发明涉及一种用于在不引入污染物的情况下漂洗化学品和离开晶片的颗粒的晶片冲洗系统。该系统通过过滤在湿式工作台漂洗期间使用的水和气体来减少晶片上的颗粒数。该系统包括冲洗单元，局部水过滤器组，局部气体过滤系统，H 2 O 2注入单元，辅助化学品注入单元和用于操作其它组件的控制器。水过滤器组提供了一个多级过滤系统，以消除颗粒物而不会明显下降水压。 H 2 O 2注入单元提供H 2 O 2的局部源以清洁过滤器和冲洗器，并提供用于在冲洗期间控制晶片上的天然氧化物形成的机制。辅助化学品注入单元为冲洗单元提供化学添加剂以增强晶片清洗过程。气体过滤系统为冲洗单元和注射单元提供清洁的气体。清洁气体在每个注射单元中的化学品和冲洗器中的水中提供清洁的气氛。

17. 发明授权

US5542441A Apparatus for delivering ultra-low particle counts in semiconductor manufacturing 失效
标题翻译：用于在半导体制造中提供超低粒子计数的装置
公开(公告)号：US5542441A
公开(公告)日：1996-08-06
申请号：US285316
申请日：1994-08-03
申请人： Raj Mohindra , Abhay K. Bhushan , Rajiv Bhushan , Suraj Puri
发明人： Raj Mohindra , Abhay K. Bhushan , Rajiv Bhushan , Suraj Puri
IPC分类号： B08B3/10 , B01D35/02 , B01D35/06 , B03C5/00 , B03C5/02 , H01L21/00 , H01L21/304 , H01L21/306 , B08B3/04
CPC分类号： H01L21/02052 , H01L21/67028 , Y10S134/902 , Y10S210/90
摘要： The invention relates to a wafer rinsing system for rinsing chemicals and particles off of wafers without introducing contaminants. The system reduces the particle count on wafers by filtering the water and the gas used during rinsing at the wet bench. The system includes a rinsing unit, a local water filter bank, a local gas filtering system, an H.sub.2 O.sub.2 injection unit, an auxiliary chemical injection unit, and a controller for operating the other components. The water filter bank provides a multiple stage filtering system to eliminate particles without a substantial drop in water pressure. The H.sub.2 O.sub.2 injection unit provides a local source of H.sub.2 O.sub.2 to clean the filter and rinser and to provide a mechanism for controlling the formation of native oxide on the wafer during rinsing. The auxiliary chemical injection unit provides a chemical additive to the rinsing unit to enhance the wafer cleaning process. The gas filtering system provides clean gas to the rinsing unit and to the injection units. The clean gas provides a clean atmosphere over the chemicals in each injection unit, and over the water in the rinser.
摘要翻译：本发明涉及一种用于在不引入污染物的情况下漂洗化学品和离开晶片的颗粒的晶片冲洗系统。该系统通过过滤在湿式工作台漂洗期间使用的水和气体来减少晶片上的颗粒数。该系统包括冲洗单元，局部水过滤器组，局部气体过滤系统，H 2 O 2注入单元，辅助化学品注入单元和用于操作其它组件的控制器。水过滤器组提供了一个多级过滤系统，以消除颗粒物而不会明显下降水压。 H 2 O 2注入单元提供H 2 O 2的局部源以清洁过滤器和冲洗器，并提供用于在冲洗期间控制晶片上的天然氧化物形成的机制。辅助化学品注入单元为冲洗单元提供化学添加剂以增强晶片清洗过程。气体过滤系统为冲洗单元和注射单元提供清洁的气体。清洁气体在每个注射单元中的化学品和冲洗器中的水中提供清洁的气氛。

18. 发明授权

US06799583B2 Methods for cleaning microelectronic substrates using ultradilute cleaning liquids 失效
公开(公告)号：US06799583B2
公开(公告)日：2004-10-05
申请号：US09311800
申请日：1999-05-13
申请人： Suraj Puri , Joseph Medeiros, Jr. , Raj Mohindra
发明人： Suraj Puri , Joseph Medeiros, Jr. , Raj Mohindra
IPC分类号： B08B600
CPC分类号： H01L21/02052 , B08B3/08 , B08B3/12 , C03C23/0075 , C11D3/2017 , C11D7/06 , C11D7/261 , C11D11/0047 , C11D11/007 , H01L21/67057 , Y10S134/902
摘要： A method of cleaning a surface of an article using cleaning liquids in combination with acoustic energy. Preferably, an ultradilute concentration of a cleaning enhancement substance, such as ammonia gas, is dissolved in a liquid solvent, such as filtered deionized water, to form a cleaning liquid. The cleaning liquid is caused to contact the surface to be cleaned. Acoustic energy is applied to the liquid during such contact. Optionally, the surface to be cleaned can be oxidized, e.g., by ozonated water, prior to cleaning.

19. 发明授权

US6045621A Method for cleaning objects using a fluid charge 有权
标题翻译：使用流体充电清洁物体的方法
公开(公告)号：US6045621A
公开(公告)日：2000-04-04
申请号：US179540
申请日：1998-10-26
申请人： Suraj Puri , Raj Mohindra
发明人： Suraj Puri , Raj Mohindra
IPC分类号： B08B3/04 , G11B23/50 , H01L21/00
CPC分类号： H01L21/67028 , B08B3/04 , G11B23/505 , Y10S134/902
摘要： A method for cleaning an object. The method (400) includes immersing (420) an object in a liquid comprising water, which can be ultra-clean. The object has a front face, a back face, and an edge. The method includes providing (450) a cleaning enhancement substance (e.g., trace amount of polar organic compound, surfactant, ammonia bearing compound) into the liquid. In one embodiment, the cleaning enhancement substance can form a liquid film, such as a monolayer overlying an upper surface or level of the liquid. The method also includes providing a substantially particle free environment (e.g., ultra-clean gas, ultra-clean non-reactive gas) adjacent to the front face and the back face of the object as the liquid including the cleaning enhancement substance is being removed.
摘要翻译：清洁物体的方法。方法（400）包括将物体浸入（420）包含水的液体中，其可以是超洁净的。该物体具有前表面，后表面和边缘。该方法包括向液体中提供（450）清洁增强物质（例如痕量的极性有机化合物，表面活性剂，含氨化合物）。在一个实施方案中，清洁增强物质可以形成液膜，例如覆盖在液体的上表面或水平上的单层。该方法还包括当除去包括清洁增强物质的液体时，提供与物体的正面和背面相邻的基本上无颗粒的环境（例如，超洁净气体，超清洁非反应性气体）。

20. 发明授权

US5988189A Method and apparatus for cleaning wafers using multiple tanks 失效
标题翻译：使用多个罐清洗晶片的方法和设备
公开(公告)号：US5988189A
公开(公告)日：1999-11-23
申请号：US111149
申请日：1998-07-06
申请人： Raj Mohindra , David C. Wong , Suraj Puri
发明人： Raj Mohindra , David C. Wong , Suraj Puri
IPC分类号： B08B3/10 , G11B23/50 , H01L21/00 , H01L21/306 , B08B3/02
CPC分类号： H01L21/02052 , B08B3/10 , G11B23/505 , H01L21/67028 , H01L21/67051 , H01L21/67057 , H01L21/6708 , H01L21/67086 , H01L21/67207 , H01L21/02049 , Y10S134/902
摘要： A cleaning system (1, 5) having multiple cleaning chambers (200) is provided. Each cleaning chamber (200) includes an interior region sufficient for immersing a carrier (242), which has at least one wafer disposed therein, into an ultra-clean liquid. The cleaning chamber (200) also has an inlet operably coupled to the interior region to introduce a gas into the interior region and a drain operably coupled to the interior region to remove the ultra-clean liquid from the interior region at a selected rate. A controller 14 is operably coupled to the chamber (200) for selectively controlling the selected rate. In an alternative embodiment, an installation technique (80) for the above cleaning system (1,5) is provided.
摘要翻译：提供具有多个清洁室（200）的清洁系统（1,5）。每个清洁室（200）包括足够的内部区域，用于将其中设置有至少一个晶片的载体（242）浸入超清洁液体中。清洁室（200）还具有可操作地连接到内部区域以将气体引入内部区域的入口和可操作地联接到内部区域的排水口，以选择的速率从内部区域移除超清洁液体。控制器14可操作地耦合到腔室（200），以选择性地控制所选择的速率。在替代实施例中，提供了用于上述清洁系统（1,5）的安装技术（80）。

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