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    • 13. 发明申请
    • Structures with seeded single-crystal domains
    • 具有种子单晶畴的结构
    • US20050179086A1
    • 2005-08-18
    • US11101741
    • 2005-04-07
    • Apostolos VoutsasJohn Hartzell
    • Apostolos VoutsasJohn Hartzell
    • C30B1/00C30B1/08H01L27/01
    • B82Y30/00C30B1/00C30B1/08C30B29/06
    • Single-crystal devices and a method for forming semiconductor film single-crystal domains are provided. The method comprises: forming a substrate, such as glass or Si; forming an insulator film overlying the substrate; forming a single-crystal seed overlying the substrate and insulator; forming an amorphous film overlying the seed; annealing the amorphous film; and, forming a single-crystal domain in the film responsive to the single-crystal seed. The annealing technique can be (conventional) laser annealing, a laser induced lateral growth (LiLAC) process, or conventional furnace annealing. In some aspects, forming a single-crystal seed includes forming a nanowire or a self assembled monolayer (SAM). For example, a Si nanowire can be formed having a crystallographic orientation of or . When, the seed has a crystallographic orientation, then an n-type TFT can be formed. Likewise, when a single-crystal seed has a crystallographic orientation, a p-type TFT can be formed.
    • 提供单晶器件和形成半导体膜单晶畴的方法。 该方法包括:形成诸如玻璃或Si的衬底; 形成覆盖在基板上的绝缘膜; 形成覆盖衬底和绝缘体的单晶种子; 形成覆盖种子的无定形膜; 退火非晶膜; 并且响应于单晶种子在膜中形成单晶畴。 退火技术可以是(常规)激光退火,激光诱导横向生长(LiLAC)工艺或常规炉退火。 在一些方面,形成单晶种子包括形成纳米线或自组装单层(SAM)。 例如,可以形成具有<110>或<100>的晶体取向的Si纳米线。 当种子具有<100>晶体取向时,则可以形成n型TFT。 同样,当单晶种子具有<110>结晶取向时,可以形成p型TFT。
    • 14. 发明申请
    • Thin film oxide interface
    • 薄膜氧化物界面
    • US20050136695A1
    • 2005-06-23
    • US11046571
    • 2005-01-28
    • Pooran JoshiJohn HartzellMasahiro AdachiYoshi Ono
    • Pooran JoshiJohn HartzellMasahiro AdachiYoshi Ono
    • H01L21/316H01L21/336H01L29/49H01L29/786H01L23/58H01L21/26H01L21/324H01L21/42H01L21/477
    • H01L29/66757H01L29/4908H01L29/66772
    • An oxide interface and a method for fabricating an oxide interface are provided. The method comprises forming a silicon layer and an oxide layer overlying the silicon layer. The oxide layer is formed at a temperature of less than 400° C. using an inductively coupled plasma source. In some aspects of the method, the oxide layer is more than 20 nanometers (nm) thick and has a refractive index between 1.45 and 1.47. In some aspects of the method, the oxide layer is formed by plasma oxidizing the silicon layer, producing plasma oxide at a rate of up to approximately 4.4 nm per minute (after one minute). In some aspects of the method, a high-density plasma enhanced chemical vapor deposition (HD-PECVD) process is used to form the oxide layer. In some aspects of the method, the silicon and oxide layers are incorporated into a thin film transistor.
    • 提供氧化物界面和制造氧化物界面的方法。 该方法包括形成硅层和覆盖硅层的氧化物层。 使用电感耦合等离子体源在低于400℃的温度下形成氧化物层。 在该方法的一些方面,氧化物层的厚度大于20纳米(nm),折射率在1.45和1.47之间。 在该方法的一些方面,通过等离子体氧化硅层形成氧化物层,以每分钟高达约4.4nm的速率产生等离子体氧化物(1分钟后)。 在该方法的某些方面,使用高密度等离子体增强化学气相沉积(HD-PECVD)工艺来形成氧化物层。 在该方法的一些方面,将硅和氧化物层结合到薄膜晶体管中。
    • 17. 发明申请
    • Piezo-diode cantilever MEMS
    • 压电二极管悬臂MEMS
    • US20070278600A1
    • 2007-12-06
    • US11717231
    • 2007-03-13
    • Changqing ZhanPaul SchueleJohn ConleyJohn Hartzell
    • Changqing ZhanPaul SchueleJohn ConleyJohn Hartzell
    • H01L29/84H01L21/02
    • B81B3/0021H01L29/868
    • A piezo thin-film diode (piezo-diode) cantilever microelectromechanical system (MEMS) and associated fabrication processes are provided. The method deposits thin-films overlying a substrate. The substrate can be made of glass, polymer, quartz, metal foil, Si, sapphire, ceramic, or compound semiconductor materials. Amorphous silicon (a-Si), polycrystalline Si (poly-Si), oxides, a-SiGe, poly-SiGe, metals, metal-containing compounds, nitrides, polymers, ceramic films, magnetic films, and compound semiconductor materials are some examples of thin-film materials. A cantilever beam is formed from the thin-films, and a diode is embedded with the cantilever beam. The diode is made from a thin-film shared in common with the cantilever beam. The shared thin-film may a film overlying a cantilever beam top surface, a thin-film overlying a cantilever beam bottom surface, or a thin-film embedded within the cantilever beam.
    • 提供压电薄膜二极管(压电二极管)悬臂微机电系统(MEMS)及相关制造工艺。 该方法沉积覆盖在基底上的薄膜。 基板可以由玻璃,聚合物,石英,金属箔,Si,蓝宝石,陶瓷或化合物半导体材料制成。 非晶硅(a-Si),多晶Si(poly-Si),氧化物,a-SiGe,poly-SiGe,金属,含金属的化合物,氮化物,聚合物,陶瓷膜,磁性膜和化合物半导体材料是一些例子 的薄膜材料。 悬臂梁由薄膜形成,二极管嵌入悬臂梁。 二极管由与悬臂梁共用的薄膜制成。 共享的薄膜可以是覆盖悬臂梁顶表面的薄膜,覆盖悬臂梁底表面的薄膜或嵌入在悬臂梁内的薄膜。
    • 18. 发明申请
    • MEMS pixel sensor
    • MEMS像素传感器
    • US20070023851A1
    • 2007-02-01
    • US11516473
    • 2006-09-06
    • John HartzellChangqing ZhanMichael Wolfson
    • John HartzellChangqing ZhanMichael Wolfson
    • H01L29/66
    • G01L1/18B81C1/00246G01L1/16H01L27/12H01L27/20H04R17/02H04R19/00H04R31/00H04R2499/11
    • A MEMS pixel sensor is provided with a thin-film mechanical device having a mechanical body, with a mechanical state responsive to a proximate environment. A thin-film electronic device converts the mechanical state into electrical signals. A pixel interface supplies power to the electronic device and transceives electrical signals. The sensor is able to operate dynamically, in real-time. For example, if the mechanical device undergoes a sequence of mechanical states at a corresponding plurality of times, the electronic device is able to supply a sequence of electrical signals to the pixel interface that are responsive to the sequence of mechanical states, at the plurality of times. Each MEMS pixel sensor may include a number of mechanical devices, and corresponding electronic devices, to provide redundancy or to measure a broadband response range.
    • MEMS像素传感器设置有具有机械体的薄膜机械装置,其具有响应于邻近环境的机械状态。 薄膜电子设备将机械状态转换为电信号。 像素接口为电子设备供电并收发电信号。 该传感器能够实时动态地运行。 例如,如果机械装置在相应的多次经历了一系列机械状态,那么电子装置能够在多个时刻向像素接口提供响应于机械状态序列的电信号序列 次 每个MEMS像素传感器可以包括多个机械装置和相应的电子装置,以提供冗余或测量宽带响应范围。