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11. 发明申请

US20080174964A1 HEAT DISSIPATION DEVICE 失效
标题翻译：散热装置
公开(公告)号：US20080174964A1
公开(公告)日：2008-07-24
申请号：US11626188
申请日：2007-01-23
申请人： Shi-Wen Zhou , Peng Liu , Chun-Chi Chen
发明人： Shi-Wen Zhou , Peng Liu , Chun-Chi Chen
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , F28D15/0266 , F28F1/12 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a base and two heat sinks formed by aluminum extrusion and located on the base. Each heat sink includes a heat conducting portion. The two heat sinks include a plurality of first fins extending inwardly from first faces of the heat conducting portions and located between the heat conducting portions, and a plurality of second fins extending outwardly from second faces of the heat conducting portions. Two heat pipes connect the base and the two heat sinks. Each heat pipe includes a first section thermally engaged with the base, and two second sections extending from the base and thermally engaged with the heat conducting portion of a corresponding heat sink. The second sections are located outside a hub and below fan blades of an impeller of a fan mounted on the heat sinks.
摘要翻译：散热装置包括一个底座和两个通过铝挤压形成的散热片，并位于基座上。每个散热器包括导热部分。两个散热器包括从导热部分的第一面向内延伸并位于导热部分之间的多个第一散热片和从导热部分的第二面向外延伸的多个第二散热片。两根热管连接底座和两个散热片。每个热管包括与基座热接合的第一部分和从基部延伸并与相应散热器的导热部分热接合的两个第二部分。第二部分位于轮毂外部，并位于安装在散热器上的风扇的叶轮的风扇叶片下方。

12. 发明申请

US20080017351A1 HEAT DISSIPATION DEVICE WITH HEAT PIPES 有权
标题翻译：带热管的散热装置
公开(公告)号：US20080017351A1
公开(公告)日：2008-01-24
申请号：US11309305
申请日：2006-07-24
申请人： Shi-Wen Zhou , Peng Liu , Chun-Chi Chen
发明人： Shi-Wen Zhou , Peng Liu , Chun-Chi Chen
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , F28D15/0266 , F28D15/0275 , F28F1/32 , H01L23/3672 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device is for contacting with a heat generating electronic device to remove heat from the electronic device. The heat dissipation device includes a base for thermally engaging with the electronic device and a plurality of fins arranged on a face of the base. A first heat pipe is located between the base and the fins, and is sinuously positioned on the face of the base. The first heat pipe has a first section located at a central portion of the base and a plurality of second sections located at lateral portions of the base. At least a second heat pipe has a first section thermally positioned to the base, and a second section extending remotely from the base and thermally engaging with the fins.
摘要翻译：散热装置用于与发热电子装置接触以从电子装置移除热量。散热装置包括用于与电子设备热接合的基座和布置在基座的表面上的多个翅片。第一热管位于基座和翅片之间，并且被精确地定位在基座的表面上。第一热管具有位于基部的中心部分处的第一部分和位于基部的侧部的多个第二部分。至少第二热管具有热定位到基部的第一部分，以及从基部远程延伸并与翅片热接合的第二部分。

13. 发明申请

US20080055854A1 HEAT DISSIPATION DEVICE 失效
标题翻译：散热装置
公开(公告)号：US20080055854A1
公开(公告)日：2008-03-06
申请号：US11309616
申请日：2006-09-01
申请人： Shi-Wen Zhou , Peng Liu , Guo Chen
发明人： Shi-Wen Zhou , Peng Liu , Guo Chen
IPC分类号： H05K7/20
CPC分类号： H01L23/467 , F28D15/0275 , F28F3/04 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a heat-absorbing member having two arched concave walls formed at opposite sides thereof, and a plurality of fins extending outwardly and slantwise from each of the two arched concave walls of the heat-absorbing member toward a middle between a front and a rear of the heat dissipation device.
摘要翻译：散热装置包括一个吸热构件，它具有形成在其相对两侧的两个拱形凹壁，以及从吸热构件的两个拱形凹壁中的每一个向外并向前倾斜的多个翅片朝向前部和散热装置的后部。

14. 发明授权

US07423877B2 Heat dissipation device 失效
标题翻译：散热装置
公开(公告)号：US07423877B2
公开(公告)日：2008-09-09
申请号：US11309616
申请日：2006-09-01
申请人： Shi-Wen Zhou , Peng Liu , Guo Chen
发明人： Shi-Wen Zhou , Peng Liu , Guo Chen
IPC分类号： H05K7/20 , F28F7/00 , H01L23/34
CPC分类号： H01L23/467 , F28D15/0275 , F28F3/04 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a heat-absorbing member having two arched concave walls formed at opposite sides thereof, and a plurality of fins extending outwardly and slantwise from each of the two arched concave walls of the heat-absorbing member toward a middle between a front and a rear of the heat dissipation device.
摘要翻译：散热装置包括一个吸热构件，它具有形成在其相对两侧的两个拱形凹壁，以及从吸热构件的两个拱形凹壁中的每一个向外并向前倾斜的多个翅片朝向前部和散热装置的后部。

15. 发明授权

US07891411B2 Heat dissipation device having a fan for dissipating heat generated by at least two electronic components 有权
标题翻译：散热装置具有用于散发由至少两个电子部件产生的热量的风扇
公开(公告)号：US07891411B2
公开(公告)日：2011-02-22
申请号：US11767032
申请日：2007-06-22
申请人： Shi-Wen Zhou , Peng Liu , Jun Cao
发明人： Shi-Wen Zhou , Peng Liu , Jun Cao
IPC分类号： F28F7/00 , H05K7/20
CPC分类号： F28D15/0266 , F28D15/0275 , F28F1/32 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device for at least two heat-generating electronic components, includes a base, a fin set and a plurality of heat pipes. The base includes a supporting frame and at least two plates attached to a bottom of the frame for contacting with the at least two heat-generating electronic components. The fin set includes a plurality of fins on the base. The heat pipes respectively and thermally connect the at least two plates and the fin set together. A single fan is attached to the heat dissipation device for generating an airflow through the fin set to dissipate heat in the fin set absorbed from the at least two heat-generating electronic components.
摘要翻译：一种用于至少两个发热电子部件的散热装置，包括基座，翅片组和多个热管。基座包括支撑框架和附接到框架的底部的至少两个板，用于与至少两个发热电子部件接触。翅片组包括在基座上的多个翅片。热管分别将至少两个板和翅片组热连接在一起。单个风扇附接到散热装置，用于产生通过散热片组的气流，以散发从至少两个发热电子部件吸收的散热片组中的热量。

16. 发明授权

US07646604B2 Heat dissipation device having a fan mounted thereon 失效
标题翻译：具有安装在其上的风扇的散热装置
公开(公告)号：US07646604B2
公开(公告)日：2010-01-12
申请号：US11767040
申请日：2007-06-22
申请人： Jun Cao , Peng Liu , Shi-Wen Zhou
发明人： Jun Cao , Peng Liu , Shi-Wen Zhou
IPC分类号： H05K7/20 , G06F1/20
CPC分类号： F28D15/0275 , H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device for at least a heat-generating electronic component includes a heat sink, a fan for providing an airflow through the heat sink and a fan holder coupling the fan to the heat sink. The heat sink has a first locking part and a second locking part opposite to the first locking part. The fan holder has a first engaging part engaging with the first locking part at one side of the heat sink and a second engaging part engaging with the second locking part of the heat sink at an opposite side thereof. The first engaging part has a horizontally extending fixing arm and a barb extending downwardly from the fixing arm and hooking with a top side of the heat sink.
摘要翻译：用于至少一个发热电子部件的散热装置包括散热器，用于提供通过散热器的气流的风扇和将风扇连接到散热器的风扇架。散热器具有与第一锁定部相对的第一锁定部和第二锁定部。风扇保持器具有与散热器一侧的第一锁定部分接合的第一接合部分和在其相对侧与散热器的第二锁定部分接合的第二接合部分。第一接合部分具有水平延伸的固定臂和从固定臂向下延伸并与散热器的顶侧钩住的倒钩。

17. 发明授权

US07495913B1 Heat dissipating assembly having a fan duct 失效
标题翻译：具有风扇导管的散热组件
公开(公告)号：US07495913B1
公开(公告)日：2009-02-24
申请号：US11836718
申请日：2007-08-09
申请人： Peng Liu , Jun Cao , Shi-Wen Zhou
发明人： Peng Liu , Jun Cao , Shi-Wen Zhou
IPC分类号： H05K7/20 , F28F7/00
CPC分类号： G06F1/20
摘要： A heat dissipating assembly for dissipating heat from a CPU and a VRM simultaneously includes a base (10) contacting the CPU, a heat sink (20) mounted on the base, a pair of fans (30) attached on a front side of the heat sink, and a fan duct (40) secured to the fans. The fan duct has a first inlet (440) through which a part of airflow flows into the fan duct, a second inlet (460) through which another part of the airflow flowing into the fan duct. The another part of the airflow also flows through the VRM so it can cool the VRM. The fan duct further has an outlet (480) for allowing the airflow generated by the fans to blow to the heat sink.
摘要翻译：用于从CPU和VRM中散热的散热组件同时包括接触CPU的基座（10），安装在基座上的散热器（20），安装在热源正面上的一对风扇（30）水槽和固定到风扇的风扇导管（40）。风扇管道具有第一入口（440），气流的一部分通过该第一入口流入风扇管道;第二入口（460），流过风扇管道的气流的另一部分穿过第二入口。气流的另一部分也流经VRM，因此可以对VRM进行冷却。风扇导管还具有用于允许由风扇产生的气流吹向散热器的出口（480）。

18. 外观设计

USD864282S1 Tripod 有权
公开(公告)号：USD864282S1
公开(公告)日：2019-10-22
申请号：US29624430
申请日：2017-11-01
申请人： Peng Liu
设计人： Peng Liu
摘要： FIG. 1 is a perspective view of a tripod showing my new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.

19. 发明申请

US20180144929A1 METHOD FOR FORMING HIGH ASPECT RATIO PATTERNING STRUCTURE 有权
公开(公告)号：US20180144929A1
公开(公告)日：2018-05-24
申请号：US15385884
申请日：2016-12-21
申请人： Peng Liu , Qiyan Feng , Yu Ren , Yukun Lv , Jun Zhu , Hsusheng Chang
发明人： Peng Liu , Qiyan Feng , Yu Ren , Yukun Lv , Jun Zhu , Hsusheng Chang
IPC分类号： H01L21/027 , H01L21/311 , H01L21/02 , G03F7/095
CPC分类号： H01L21/0273 , G03F7/095 , H01L21/02271 , H01L21/02282 , H01L21/3065 , H01L21/3081 , H01L21/31116 , H01L21/31138
摘要： The invention disclosed a method for forming high aspect ratio patterning structure. Firstly, forming a dielectric film ashing stop layer, a first photoresist layer, a first hard mask layer and a second photoresist layer on a semiconductor substrate in turn. A second hard mask layer having a high etch selectivity ratio with the first photoresist layer is formed on top surface and sidewall of the pattern by utilizing a low temperature chemical vapor deposition process, which can be a protect for the pattern sidewall during the later etching process of the first photoresist layer. So, the cone-shaped or the bowling-shaped photoresist morphology caused by plasma bombardment can be avoided. Therefore, the problems of the insufficient of selectivity ratio, burrs at the edge of the pattern and larger critical dimension can be solved, and the implanted ions can be well distributed according to the design of the device.

20. 发明授权

US09000662B2 Field emission device and field emission display having same 有权
标题翻译：场发射器件和场发射显示器具有相同的
公开(公告)号：US09000662B2
公开(公告)日：2015-04-07
申请号：US13630255
申请日：2012-09-28
申请人： Peng Liu , Shou-Shan Fan , Yang Wei
发明人： Peng Liu , Shou-Shan Fan , Yang Wei
IPC分类号： H05B33/02 , H01J3/02 , H01J29/46 , H01J31/12
CPC分类号： H01J3/021 , H01J29/467 , H01J31/127 , H01J2329/463
摘要： A field emission device includes a cathode and a carbon nanotube (CNT) gate electrode. The CNT gate electrode which is electrically insulated from the cathode includes a CNT layer and a dielectric layer. The CNT layer which has a surface includes a number of micropores. The dielectric layer is coated on the surface of the CNT layer and an inner wall of each of the micropores.
摘要翻译：场致发射器件包括阴极和碳纳米管（CNT）栅电极。与阴极电绝缘的CNT栅极包括CNT层和电介质层。具有表面的CNT层包括多个微孔。介电层被涂覆在CNT层的表面和每个微孔的内壁上。

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