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11. 发明专利

JP2007262213A Removable adhesive sheet 审中-公开
标题翻译：可拆卸粘合片
公开(公告)号：JP2007262213A
公开(公告)日：2007-10-11
申请号：JP2006088122
申请日：2006-03-28
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： HASHIMOTO KOICHI , TAKAHASHI TOMOKAZU
IPC分类号： C09J7/02 , B32B27/30 , C09J133/06 , H01L21/301 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a removable adhesive sheet having little contamination due to transfer to the semiconductor wafer which is an adherend when releasing the sheet after attaching the sheet once and useful as a protective sheet in polishing step of the semiconductor wafer and an adhesive sheet for wafer retention in dicing step. SOLUTION: The removable adhesive sheet has an adhesive layer (layer B) on at least one side of a substrate film (layer A) and the layer A and the layer B each comprise (meth)acrylic acid alkyl ester copolymer as a main component or the removable adhesive sheet has an adhesive layer (layer B) on at least one side of a substrate film (layer A) and has a mold release film (layer C) which is a surface layer of the layer B on the side opposite to the layer A, and the layer B and the layer C each comprise a (meth)acrylate copolymer as a main component. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种可移除的粘合片，由于在半导体晶片的研磨步骤中作为保护片安装一次并用作保护片后的剥离片时作为被粘物的半导体晶片的转移而具有很小的污染以及用于在切割步骤中晶片保持的粘合片。解决方案：可移除粘合片在基材膜（A层）的至少一侧上具有粘合层（B层），层A和层B各自包含（甲基）丙烯酸烷基酯共聚物作为主要成分或可移除粘合片在基材膜（A层）的至少一侧上具有粘合剂层（B层），并且具有作为层B侧的表面层的脱模膜（C层）与层A相对，层B和层C各自包含（甲基）丙烯酸酯共聚物作为主要成分。版权所有（C）2008，JPO＆INPIT

12. 发明专利

JP2005239889A Rolled pressure-sensitive adhesive sheet for processing wafer 有权
标题翻译：用于加工波纹的压敏粘度粘合片
公开(公告)号：JP2005239889A
公开(公告)日：2005-09-08
申请号：JP2004051902
申请日：2004-02-26
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： HASHIMOTO KOICHI , YAMAMOTO KAZUHIKO
IPC分类号： C09J7/02 , C09J133/00 , C09J175/14 , C09J201/02 , H01L21/00 , H01L21/301 , H01L21/304
CPC分类号： C09J7/22 , C09J7/38 , C09J7/403 , C09J2203/326 , C09J2205/31 , H01L21/67132 , Y10S428/906 , Y10T428/14 , Y10T428/1476 , Y10T428/24355
摘要： PROBLEM TO BE SOLVED: To prepare a rolled pressure-sensitive adhesive sheet for processing wafers, which is excellent in storage stability, radiation curability and does not soil wafers, a pressure-sensitive adhesive sheet for processing wafers obtained by cutting the rolled pressure-sensitive adhesive sheet for processing wafers, and a pressure-sensitive adhesive sheet attached with a semiconductor wafer. SOLUTION: The rolled pressure-sensitive adhesive sheet for processing wafers is composed of a laminated film in which a substrate film, a radiation curable pressure-sensitive adhesive layer and a release film are laminated in this order and is wound in a plurality of layers. The surface opposite to the surface of the substrate film and/or the release film in contact with the radiation curable pressure-sensitive adhesive layer has a number-average roughness (Ra) of not less than 1 μm. The weight of a radical polymerization inhibitor contained in the radiation curable pressure-sensitive adhesive layer is less than 1,000 ppm. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了制备用于处理晶片的压延压敏粘合片，其储存稳定性，辐射固化性优异并且不会污染晶片，用于处理通过切割轧制获得的晶片的压敏粘合片用于处理晶片的压敏粘合片和粘附有半导体晶片的压敏粘合片。＆lt; P＆gt;解决方案：用于处理晶片的压延压敏粘合片由依次层叠基板，可辐射固化型粘合剂层和剥离膜的层叠膜构成，并且以多个的层。与基板膜的表面相对的表面和/或与可辐射固化型粘合剂层接触的剥离膜的表面的平均粗糙度（Ra）不小于1μm。包含在可辐射固化型压敏粘合剂层中的自由基聚合抑制剂的重量小于1,000ppm。版权所有（C）2005，JPO＆NCIPI

13. 发明专利

JP2000223453A SEMICONDUCTOR WAFER PROTECTIVE ADHESIVE SHEET, AND GRINDING METHOD OF SEMICONDUCTOR WAFER 失效
公开(公告)号：JP2000223453A
公开(公告)日：2000-08-11
申请号：JP2558899
申请日：1999-02-02
申请人： NITTO DENKO CORP
发明人： AKAZAWA MITSUHARU , NAKAGAWA YOSHIO , FUKUOKA TAKAHIRO , HASHIMOTO KOICHI , KUBOZONO TATSUYA
IPC分类号： C09J7/02 , C09J4/00 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To obtain a radiation-curing protective adhesive sheet which is capable of restraining a wafer from warping, after it is irradiated with radiation. SOLUTION: A semiconductor wafer protective adhesive sheet is composed of a base film and an adhesive layer, to serve as a radiation-curing semiconductor wafer protective adhesive sheet, and the shrinking force of the adhesive layer is below 30 MPa, after it has been cured by radiation. The adhesive sheet comprises two types of adhesive layers, (i) one where 30 to 300 pts.wt. radiation-reactive oligomer which has 1 to 5 unsaturated bonds per molecule are compounded with 100 pts.wt. main polymer, that serve as a skeleton for the formation of an adhesive layer and (ii) the other is that 10 to 40 pts.wt. radiation-reactive oligomer which has 6 or more unsaturated bonds per molecule are compounded with 100 pts.wt. main polymer, that serve as a skeleton for the formation of an adhesive layer.

14. 发明专利

JPH1083088A RESIST REMOVING DEVICE 失效
公开(公告)号：JPH1083088A
公开(公告)日：1998-03-31
申请号：JP23827696
申请日：1996-09-10
申请人： NITTO DENKO CORP
发明人： YAMAMOTO TAKAYUKI , NAMIKAWA AKIRA , HASHIMOTO KOICHI , YAMAMOTO MASAYUKI
IPC分类号： G03F7/42 , H01L21/027
摘要： PROBLEM TO BE SOLVED: To prevent the breakage of a substrate arising from peeling of a tacky adhesive tape in the state that a tacky adhesive infiltrates to the outer peripheral edge of the substrate in a device for removing the unnecessary resist of the substrate surface together with the tacky adhesive tape sticking the tacky adhesive tape onto the substrate and peeling the tape. SOLUTION: A positioning table 40 which exists in proximity to the outer peripheral edge of the substrate W and has the surface flush with the substrate surface is arranged around the substrate W, and the tacky adhesive tape is stuck to the substrate W and the table 40, thereby, the drop of the tacky adhesive tape into the clearance (c) between the substrate W and the table 40 is suppressed and the infiltration of the tacky adhesive to the outer peripheral edge of the substrate is suppressed. At this time, the intrusion of the tacky adhesive into the clearance (c) between the substrate W and the table 40 and the infiltration of the tacky adhesive to the outer peripheral edge of the substrate are additionally suppressed if the moving speed for affixing the tacky adhesive tape is set higher only near the start of the sticking to the substrate W and near the end of the sticking or a tacky adhesive tape sticking pressure is set small.

15. 发明专利

JPH09311469A ADHESIVE SHEETS FOR REMOVING RESIST AND METHOD FOR REMOVING RESIST 失效
公开(公告)号：JPH09311469A
公开(公告)日：1997-12-02
申请号：JP12564596
申请日：1996-05-21
申请人： NITTO DENKO CORP
发明人： KIHARA YASUO , HASHIMOTO KOICHI
IPC分类号： G03F7/42 , C09J4/02 , C09J7/02 , H01L21/027
摘要： PROBLEM TO BE SOLVED: To suppress the progress of photosetting reaction of a photosetting adhesive sheet during production and preservation and to stably and surely remove an unnecessary resist film image on an article with the adhesive sheet. SOLUTION: A photosetting adhesive layer is formed on a film substrate and a light shielding separator having

16. 发明专利

JPH09311463A ADHESIVE SHEET FOR REMOVING RESIST AND METHOD FOR REMOVING RESIST 失效
公开(公告)号：JPH09311463A
公开(公告)日：1997-12-02
申请号：JP12563996
申请日：1996-05-21
申请人： NITTO DENKO CORP
发明人： KIHARA YASUO , HASHIMOTO KOICHI , SEKIDO TATSUYA , OKAWA YUJI , MATSUMURA TAKESHI
IPC分类号： G03F7/42 , C09J7/02 , C09J11/00 , C09J201/00 , H01L21/027
摘要： PROBLEM TO BE SOLVED: To easily and surely remove an unnecessary resist film image on an article with an adhesive sheet independently of the kind and properties of the resist and to prevent the leaving of particles on the article after the removal. SOLUTION: An adhesive layer contg. 0.01-3wt.% surfactant is formed on a film substrate to obtain the objective adhesive sheet for removing a resist. This adhesive sheet is stuck on an article on which a resist film image exists and the sheet, together with the resist material, is peeled to remove the resist material on the article. When the adhesive sheet is a curable sheet, it is cured before the peeling.

17. 发明专利

JPH09265191A METHOD FOR REMOVING RESIST AND ADHESIVE OR ADHESIVE SHEETS USED FOR THE SAME 失效
公开(公告)号：JPH09265191A
公开(公告)日：1997-10-07
申请号：JP7563496
申请日：1996-03-29
申请人： NITTO DENKO CORP
发明人： YAMAMOTO TAKAYUKI , HASHIMOTO KOICHI , MATSUMURA TAKESHI , SEKIDO TATSUYA
IPC分类号： G03F7/42 , H01L21/027
摘要： PROBLEM TO BE SOLVED: To easily and surely remove an unnecessary resist on an article by making the adhesive strength of an adhesive layer to the resist higher than that of the resist to the article and specifying the modulus of elasticity of the adhesive layer. SOLUTION: When an adhesive layer is formed on an article such as a wafer on which a resist exists and the resist is removed by peeling the adhesive layer, together with the resist, from the article, the adhesive strength of the adhesive layer to the resist is made higher than that of the resist to the article and the modulus of elasticity of the adhesive layer is regulated to >=1kg/mm at the time of peeling. The pref. 180 deg. peeling and adhesive strength between the adhesive layer and the resist is >=5g/10mm, especially 5-5,000g/10mm, more especially about 100-4,000g/10mm.

18. 发明专利

JPH09223655A METHOD FOR PREVENTING GENERATION OF PARTICLE 失效
公开(公告)号：JPH09223655A
公开(公告)日：1997-08-26
申请号：JP2902996
申请日：1996-02-16
申请人： NITTO DENKO CORP
发明人： TOYODA HIDESHI , HASHIMOTO KOICHI
IPC分类号： G03F7/42 , H01L21/027
摘要： PROBLEM TO BE SOLVED: To prevent the generation of particles on an article such as a semiconductor substrate after the releasing operation of an adhesive sheet or the like to release and remove the resist material on the article by using the sheet or the like. SOLUTION: The method for preventing the generation of particle comprises the steps of sticking an adhesive sheet or the like on an article where a resist material exists, curing the sheet or the like when the sheet or the like is curable type, then integrally releasing the sheet or the like integrally with the material, and removing the material on the article. In this case, the sheet or the like is stuck or cured in a reduced pressure atmosphere or inert gas atmosphere to prevent the generation of the particles on the article.

19. 发明专利

JPH09207097A CUTTING METHOD FOR ULTRAVIOLET CURING TYPE ADHESIVE SHEET 失效
公开(公告)号：JPH09207097A
公开(公告)日：1997-08-12
申请号：JP1475396
申请日：1996-01-31
申请人： NITTO DENKO CORP
发明人： HASHIMOTO KOICHI , NAMIKAWA AKIRA , CHIKADA YASU
IPC分类号： B26D7/08
摘要： PROBLEM TO BE SOLVED: To prevent the falling off and scattering of an adhesive material, and moreover the lowering of cutting accuracy due to the above accidents by previously ultraviolet-hardening a prearranged cutting portion on adhesive sheets in the case of cutting ultraviolet curing type adhesive sheets. SOLUTION: Long ultraviolet curing type adhesive sheets 4 wound round a winding out roll is made to proceed at fixed speed toward a winding roll as the sheet is rewound. While the sheets proceed like this, ultraviolet rays 3 are irradiated to a prearranged cut portion 8 through a converging fiber or a converging lense 2 from an ultraviolet generating device for hardening the portion 8. After hardening the portion 8, the adhesive sheet is cut continuously in a proceeding direction, namely a longitudinal direction, by a cutting device 7. Two sheets 4A, 4B narrowed in width by a cut portion 9 are severally wound round a winding roll.

20. 发明专利

JPH07242860A PROTECTION MEMBER FOR SEMICONDUCTOR WAFER 失效
公开(公告)号：JPH07242860A
公开(公告)日：1995-09-19
申请号：JP6017294
申请日：1994-03-03
申请人： NITTO DENKO CORP
发明人： YAMAMOTO MASASHI , CHIKADA YASU , HASHIMOTO KOICHI
IPC分类号： C09J7/02 , C09J133/02 , C09J163/00 , H01L21/304
摘要： PURPOSE:To obtain a protection member for the covering of a circuit pattern surface of a semiconductor wafer, having a specific water-swelling tacky adhesive layer on a supporting film, leaving little residual particle contaminant, satisfying peeling releasability and having excellent corrosion protecting property and cleanability. CONSTITUTION:This protection member is composed of (A) a water-swelling tacky adhesive layer 2 having an adhesive force of 50-300g/20 ram to a mirror wafer measured by 180 deg. peeling method and produced by crosslinking a hydrophilic polymer having a weight-average molecular weight of 50,000-3,000,000 and containing (meth)acrylic acid and/or a (meth)acrylic acid derivative capable of forming a homopolymer having a glass transition temperature of =40% and (B) a supporting film 1 such as a plastic film supporting the tacky adhesive layer A.

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