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11. 发明申请

US20110143556A1 CONNECTING MECHANISM FOR CONNECTING POWER ADAPTER AND ELECTRONIC DEVICE 审中-公开
标题翻译：用于连接电源适配器和电子设备的连接机构
公开(公告)号：US20110143556A1
公开(公告)日：2011-06-16
申请号：US12963584
申请日：2010-12-08
申请人： Jui-Yuan Hsu
发明人： Jui-Yuan Hsu
IPC分类号： H01R11/30
CPC分类号： H01F38/14 , H01R13/6205
摘要： A connecting mechanism is provided for connecting a power adapter and an electronic device. The connecting mechanism includes a first connecting part and a second connecting part. The first connecting part is connected with the power adapter, and includes a first magnetic core, a first winding and a first magnetic element. The second connecting part is connected with the electronic device, and includes a second magnetic core, a second winding and a second magnetic element. The first magnetic element and the second magnetic element are aligned with and magnetically attracted by each other, so that the first connecting part is fixed onto the second connecting part and electromagnetic coupling between the first winding and the second winding is produced.
摘要翻译：提供连接电源适配器和电子设备的连接机构。连接机构包括第一连接部和第二连接部。第一连接部与电源适配器连接，并且包括第一磁芯，第一绕组和第一磁性元件。第二连接部分与电子装置连接，并包括第二磁芯，第二绕组和第二磁性元件。第一磁性元件和第二磁性元件彼此对齐并被磁性地吸引，使得第一连接部分固定在第二连接部分上，并且产生第一绕组和第二绕组之间的电磁耦合。

12. 发明申请

US20100033282A1 ASSEMBLY STRUCTURE OF TRANSFORMER, SYSTEM CIRCUIT BOARD AND AUXILIARY CIRCUIT BOARD 有权
标题翻译：变压器，系统电路板和辅助电路板的组装结构
公开(公告)号：US20100033282A1
公开(公告)日：2010-02-11
申请号：US12536943
申请日：2009-08-06
申请人： Jui-Yuan Hsu , Hong-Jian Gan
发明人： Jui-Yuan Hsu , Hong-Jian Gan
IPC分类号： H01F27/06
CPC分类号： H01F27/06 , H01F27/2866 , H01F27/2871 , H01F27/325 , H01F27/40 , H01F2027/065 , H05K1/141 , H05K3/366 , H05K2201/049 , H05K2201/1003
摘要： An assembly structure includes a transformer, a system circuit board and an auxiliary circuit board. The transformer includes a primary winding coil, a secondary winding assembly and a magnetic core assembly. The magnetic core assembly is partially embedded within the primary winding coil and the secondary winding assembly. The secondary winding assembly has multiple output ends. The system circuit board is connected to the primary winding coil. The auxiliary circuit board is connected to the system circuit board and has multiple connecting parts. The output ends of the secondary winding assembly of the transformer are connected with corresponding connecting parts of the auxiliary circuit board.
摘要翻译：组装结构包括变压器，系统电路板和辅助电路板。变压器包括初级绕组线圈，次级绕组组件和磁芯组件。磁芯组件部分地嵌入初级绕组线圈和次级绕组组件内。次级绕组组件具有多个输出端。系统电路板连接到初级绕组线圈。辅助电路板连接到系统电路板，并具有多个连接部分。变压器的次级绕组组件的输出端与辅助电路板的相应连接部分连接。

13. 发明申请

US20070297142A1 POWER SUPPLY APPARATUS HAVING PASSIVE HEAT-DISSIPATION MECHANISM AND FABRICATION METHOD THEREOF 审中-公开
标题翻译：具有被动散热机构的电源装置及其制造方法
公开(公告)号：US20070297142A1
公开(公告)日：2007-12-27
申请号：US11467384
申请日：2006-08-25
申请人： Jui-Yuan Hsu
发明人： Jui-Yuan Hsu
IPC分类号： H05K7/20
CPC分类号： H05K7/20009
摘要： A power supply apparatus includes an insulating housing, a printed circuit board and at least an electronic component. The insulating housing has a substantially closed receptacle and made of a material having a thermal conductivity in a range of from 2.0 to 10.0 W/mK. The printed circuit board is accommodated within the receptacle of the insulating housing. The electronic component is mounted on the printed circuit board.
摘要翻译：电源装置包括绝缘壳体，印刷电路板和至少电子部件。绝缘壳体具有基本封闭的容器，并由具有2.0至10.0W / mK范围内的热导率的材料制成。印刷电路板容纳在绝缘外壳的插座内。电子部件安装在印刷电路板上。

14. 发明授权

US06930883B2 Heat-dispersing module of electronic device 有权
标题翻译：电子装置散热模块
公开(公告)号：US06930883B2
公开(公告)日：2005-08-16
申请号：US10691647
申请日：2003-10-24
申请人： Hung Chang Hsieh , Chih-Chi Wu , Jui-Yuan Hsu , Chih-Jen Chen , Min-Kuang Chang
发明人： Hung Chang Hsieh , Chih-Chi Wu , Jui-Yuan Hsu , Chih-Jen Chen , Min-Kuang Chang
IPC分类号： G06F1/20 , H05K7/20
CPC分类号： H05K7/20909 , G06F1/20
摘要： A heat-dispersing module of an electronic device is disclosed. The heat-dispersing module includes: a housing having a top surface, a bottom surface, a first side surface and a second side surface, wherein the first side surface is opposite to the second side surface; a heat-dispersing fan mounted on the first side surface of the housing; a first vent area disposed on the second side surface of the housing; a second vent area disposed on the top surface of the housing; and a printed circuit board positioned in the housing, thereby a first airflow channel is formed between the top surface of the housing and the printed circuit board and a second airflow channel is formed between the bottom surface of the housing and the printed circuit board, wherein the printed circuit board produces a relatively higher heat at the second airflow channel than the first airflow channel and a distance of the second airflow channel from the printed circuit board to the bottom surface is relatively larger than that of the first airflow channel from the printed circuit board to the top surface.
摘要翻译：公开了一种电子设备的散热模块。散热模块包括：壳体，其具有顶表面，底表面，第一侧表面和第二侧表面，其中第一侧表面与第二侧表面相对; 安装在所述壳体的所述第一侧表面上的散热风扇; 设置在所述壳体的第二侧表面上的第一通气区域; 设置在所述壳体的顶表面上的第二通气区域; 以及位于壳体中的印刷电路板，由此在壳体的顶表面和印刷电路板之间形成第一气流通道，并且在壳体的底表面和印刷电路板之间形成第二气流通道，其中印刷电路板在第二气流通道处产生比第一气流通道相对较高的热量，并且第二气流通道从印刷电路板到底面的距离比来自印刷电路的第一气流通道的距离板到顶面。

15. 发明申请

US20050006083A1 Temperature-homogenizing device 有权
标题翻译：温度均化装置
公开(公告)号：US20050006083A1
公开(公告)日：2005-01-13
申请号：US10756064
申请日：2004-01-13
申请人： Yin-Yuan Chen , Wen-Ching Wu , Jui-Yuan Hsu
发明人： Yin-Yuan Chen , Wen-Ching Wu , Jui-Yuan Hsu
IPC分类号： H01L23/36 , H01L23/433 , H05K7/20
CPC分类号： H05K7/20436 , H01L23/36 , H01L23/433 , H01L2924/0002 , H05K7/20481 , H01L2924/00
摘要： A temperature-homogenizing device for uniformly dissipating heat generated from electronic components in an electronic device to a housing of the electronic device includes a first and a second higher thermally conductive layers and a first lower thermally conductive layer. The first lower thermally conductive layer is disposed between the first and the second higher thermally conductive layers, and made of a material or a medium having a lower thermal conductivity than each of the first and the second higher thermally conductive layers. By means of this temperature-homogenizing device, the heat is homogeneously distributed throughout the first and the second higher thermally conductive layers at a higher thermal conduction rate and transferred through the first lower thermally conductive layer at a lower thermal conduction rate so as to maintain homogeneous temperature distribution on the housing.
摘要翻译：用于将电子设备中的电子部件产生的热量均匀地散发到电子设备的壳体的温度均化装置包括第一和第二较高导热层和第一下部导热层。第一下部导热层设置在第一和第二较高导热层之间，并且由具有比每个第一和第二较高导热层的导热性低的材料或介质制成。通过该温度均化装置，热量以更高的热传导速率均匀地分布在第一和第二较高的导热层中，并以较低的热传导速率转移通过第一较低导热层，以保持均匀温度分布在房屋上。

16. 发明授权

US06200150B1 Flat-cable-type connector having auxiliary structure to enhance clamping force 有权
标题翻译：具有辅助结构的扁平电缆型连接器，以增强夹紧力
公开(公告)号：US06200150B1
公开(公告)日：2001-03-13
申请号：US09314223
申请日：1999-05-18
申请人： Jui-Yuan Hsu
发明人： Jui-Yuan Hsu
IPC分类号： H01R1315
CPC分类号： H01R12/88
摘要： A connector for connecting a first device with a second device through a combination thereof with a flat cable of the second device is disclosed. The connector includes a connecting head for receiving the flat cable therefrom; and an auxiliary device, located outside the connecting head for being exerted thereon a first directional force to clamp the flat cable in the connecting head, and a second directional force to release the flat cable from the connecting head. By providing such an auxiliary device to facilitate the clamping of the flat cable in the connecting head, the connector can be in good mechanical and electronic connection with a flat cable.
摘要翻译：公开了一种用于通过其与第二设备的扁平电缆的组合将第一设备与第二设备连接的连接器。连接器包括用于从其接收扁平电缆的连接头; 以及位于连接头外侧的辅助装置，用于在其上施加第一定向力以将扁平电缆夹持在连接头中，以及第二定向力以将扁平电缆从连接头释放。通过提供这种辅助装置以便于将扁平电缆夹紧在连接头中，连接器可以与扁平电缆良好的机械和电子连接。

17. 发明申请

US20080304238A1 ELECTRONIC DEVICE HAVING PASSIVE HEAT-DISSIPATING MECHANISM 审中-公开
标题翻译：具有被动热释放机构的电子设备
公开(公告)号：US20080304238A1
公开(公告)日：2008-12-11
申请号：US11938590
申请日：2007-11-12
申请人： Shih-Kai Chien , Yin-Yuan Chen , Ke-Cheng Lin , Jui-Yuan Hsu , Wen-Yi Yeh
发明人： Shih-Kai Chien , Yin-Yuan Chen , Ke-Cheng Lin , Jui-Yuan Hsu , Wen-Yi Yeh
IPC分类号： H05K7/20
CPC分类号： H05K7/20427
摘要： The present invention relates to an electronic device having a passive heat-dissipating mechanism. The electronic device includes a circuit board and a radiation enhancement layer. The circuit board has at least an electronic component thereon. The radiation enhancement layer is attached onto at least a portion of a surface of the electronic component for facilitating radiating the heat from the electronic component to the ambient air via natural convection. The radiation enhancement layer is made of a ceramic material.
摘要翻译：本发明涉及一种具有被动散热机构的电子设备。电子设备包括电路板和辐射增强层。电路板上至少有一个电子部件。辐射增强层附着在电子部件的表面的至少一部分上，以便于通过自然对流将热量从电子部件辐射到环境空气。辐射增强层由陶瓷材料制成。

18. 发明授权

US07324345B2 Electronic device with heat-dissipation structure 有权
标题翻译：具有散热结构的电子设备
公开(公告)号：US07324345B2
公开(公告)日：2008-01-29
申请号：US11287023
申请日：2005-11-23
申请人： Kuo-Liang Lee , Wen-Ching Wu , Jui-Yuan Hsu
发明人： Kuo-Liang Lee , Wen-Ching Wu , Jui-Yuan Hsu
IPC分类号： H05K7/20
CPC分类号： H05K7/20518
摘要： An electronic device with a heat-dissipation structure is disclosed. The electronic device comprises a housing, a printed circuit board assembly, and a heat sink. The printed circuit board assembly is disposed in an interior of the housing, and the printed circuit board assembly forms a high-temperatured heat flow area and a low-temperatured heat flow area in the electronic device. The heat sink is disposed between the printed circuit board assembly and the housing and in the low-temperatured heat flow area for balancing heat flow and homogenizing temperature of the electronic device to enhance heat-dissipation efficiency.
摘要翻译：公开了一种具有散热结构的电子设备。电子设备包括壳体，印刷电路板组件和散热器。印刷电路板组件设置在壳体的内部，并且印刷电路板组件在电子设备中形成高温热流区域和低温热流区域。散热器布置在印刷电路板组件和壳体之间以及在低温热流区域中，用于平衡电子设备的热流和均匀化温度，以增强散热效率。

19. 发明授权

US07066244B2 Temperature-homogenizing device 有权
标题翻译：温度均化装置
公开(公告)号：US07066244B2
公开(公告)日：2006-06-27
申请号：US10756064
申请日：2004-01-13
申请人： Yin-Yuan Chen , Wen-Ching Wu , Jui-Yuan Hsu
发明人： Yin-Yuan Chen , Wen-Ching Wu , Jui-Yuan Hsu
IPC分类号： F28F7/00
CPC分类号： H05K7/20436 , H01L23/36 , H01L23/433 , H01L2924/0002 , H05K7/20481 , H01L2924/00
摘要： A temperature-homogenizing device for uniformly dissipating heat generated from electronic components in an electronic device to a housing of the electronic device includes a first and a second higher thermally conductive layers and a first lower thermally conductive layer. The first lower thermally conductive layer is disposed between the first and the second higher thermally conductive layers, and made of a material or a medium having a lower thermal conductivity than each of the first and the second higher thermally conductive layers. By means of this temperature-homogenizing device, the heat is homogeneously distributed throughout the first and the second higher thermally conductive layers at a higher thermal conduction rate and transferred through the first lower thermally conductive layer at a lower thermal conduction rate so as to maintain homogeneous temperature distribution on the housing.
摘要翻译：用于将电子设备中的电子部件产生的热量均匀地散发到电子设备的壳体的温度均化装置包括第一和第二较高导热层和第一下部导热层。第一下部导热层设置在第一和第二较高导热层之间，并且由具有比每个第一和第二较高导热层的导热性低的材料或介质制成。通过该温度均化装置，热量以更高的热传导速率均匀地分布在第一和第二较高的导热层中，并以较低的热传导速率转移通过第一较低导热层，以保持均匀温度分布在房屋上。

20. 发明授权

US07862386B2 Power connector and power supply cord set having such power connector 有权
标题翻译：电源连接器和电源线组具有这样的电源连接器
公开(公告)号：US07862386B2
公开(公告)日：2011-01-04
申请号：US12501550
申请日：2009-07-13
申请人： Jui-Yuan Hsu , Ya-Hui Chen
发明人： Jui-Yuan Hsu , Ya-Hui Chen
IPC分类号： H01R24/00
CPC分类号： H01R24/38 , H01R12/716 , H01R2103/00 , H01R2201/06
摘要： A power supply cord set includes a power connector and a power cord. The power connector includes an insulating body, a first conducting element and a second conducting element. The second conducting element includes a first conducting part having a first connecting segment and a second connecting segment. The power cord includes a first multi-core wire and a second multi-core wire, which are covered by the external insulating cover layer. The internal insulating cover layer is partially extended out of a distal aperture of the external insulating cover layer. The bare wire portion of the first multi-core wire is fixed on the first conducting element of the power connector. The bare wire portion of the second multi-core wire is fixed on the first connecting segment of the second conducting element. A terminal part of the internal insulating cover layer is fixed by the second connecting segment.
摘要翻译：电源线组包括电源连接器和电源线。电源连接器包括绝缘体，第一导电元件和第二导电元件。第二导电元件包括具有第一连接段和第二连接段的第一导电部分。电源线包括由外部绝缘覆盖层覆盖的第一多芯线和第二多芯线。内部绝缘覆盖层部分地从外部绝缘覆盖层的远端孔延伸出来。第一多芯线的裸线部固定在电源连接器的第一导电元件上。第二多芯线的裸线部分固定在第二导电元件的第一连接段上。内部绝缘覆盖层的端子部分由第二连接段固定。

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