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11. 发明申请

US20080171292A1 Methods for Providing a Confined Liquid for Immersion Lithography 失效
标题翻译：提供浸没液相色谱液体的方法
公开(公告)号：US20080171292A1
公开(公告)日：2008-07-17
申请号：US12055219
申请日：2008-03-25
申请人： David Hemker , Fred C. Redeker , John Boyd , John M. de Larios , Michael Ravkin , Mikhail Korolik
发明人： David Hemker , Fred C. Redeker , John Boyd , John M. de Larios , Michael Ravkin , Mikhail Korolik
IPC分类号： G03F7/00
CPC分类号： G03F7/70341 , Y10S134/902
摘要： A method for processing a substrate is provided which includes generating a meniscus on the surface of the substrate and applying photolithography light through the meniscus to enable photolithography processing of a surface of the substrate.
摘要翻译：提供了一种用于处理衬底的方法，其包括在衬底的表面上产生弯月面并且通过弯月面施加光刻光以实现衬底表面的光刻处理。

12. 发明授权

US07367345B1 Apparatus and method for providing a confined liquid for immersion lithography 失效
标题翻译：用于提供用于浸没光刻的限制液体的装置和方法
公开(公告)号：US07367345B1
公开(公告)日：2008-05-06
申请号：US10834548
申请日：2004-04-28
申请人： David Hemker , Fred C. Redeker , John Boyd , John M. de Larios , Michael Ravkin , Mikhail Korolik
发明人： David Hemker , Fred C. Redeker , John Boyd , John M. de Larios , Michael Ravkin , Mikhail Korolik
IPC分类号： B08B3/10 , B08B7/04 , G03C5/00
CPC分类号： G03F7/70341 , Y10S134/902
摘要： A method for processing a substrate is provided which includes generating a meniscus on the surface of the substrate and applying photolithography light through the meniscus to enable photolithography processing of a surface of the substrate.
摘要翻译：提供了一种用于处理衬底的方法，其包括在衬底的表面上产生弯月面并且通过弯月面施加光刻光以实现衬底表面的光刻处理。

13. 发明授权

US07645364B2 Apparatus and method for plating semiconductor wafers 失效
标题翻译：用于电镀半导体晶片的装置和方法
公开(公告)号：US07645364B2
公开(公告)日：2010-01-12
申请号：US10882712
申请日：2004-06-30
申请人： Yezdi N. Dordi , Fred C. Redeker , John M. Boyd , Robert Maraschin , Carl Woods
发明人： Yezdi N. Dordi , Fred C. Redeker , John M. Boyd , Robert Maraschin , Carl Woods
IPC分类号： C25D21/00
CPC分类号： C25D17/14 , C25D5/06 , C25D7/123 , C25D17/001 , C25D21/12 , H01L21/2885
摘要： An electroplating apparatus for electroplating a surface of a wafer is provided. The wafer is capable of being electrically charged as a cathode. The electroplating apparatus includes a plating head capable of being positioned either over or under the surface of a wafer and capable of being electrically charged as an anode. The plating head is capable of enabling metallic plating between the surface of the wafer and the plating head when the wafer and plating head are charged. The plating head further comprises a voltage sensor pair capable of sensing a voltage present between the plating head and the surface of the wafer, and a controller capable of receiving data from the voltage sensor pair. The data received from the voltage sensor pair is used by the controller to maintain a substantially constant voltage to be applied by the anode when the plating head is placed in positions over the surface of the wafer. A method of electroplating a wafer is also provided.
摘要翻译：提供了一种用于电镀晶片表面的电镀设备。该晶片能够作为阴极充电。电镀装置包括能够位于晶片表面的上方或下方并能够作为阳极带电的电镀头。当晶片和电镀头被充电时，电镀头能够在晶片表面和电镀头之间实现金属电镀。电镀头还包括能够感测电镀头和晶片表面之间的电压的电压传感器对，以及能够从电压传感器对接收数据的控制器。当电镀头位于晶片表面上方时，由电压传感器对接收的数据由控制器使用以保持由阳极施加的基本上恒定的电压。还提供了一种电镀晶片的方法。

14. 发明申请

US20080271992A1 Apparatus and method for plating semiconductor wafers 失效
标题翻译：用于电镀半导体晶片的装置和方法
公开(公告)号：US20080271992A1
公开(公告)日：2008-11-06
申请号：US10882712
申请日：2004-06-30
申请人： Yezdi N. Dordi , Fred C. Redeker , John M. Boyd , Robert Maraschin , Carl Woods
发明人： Yezdi N. Dordi , Fred C. Redeker , John M. Boyd , Robert Maraschin , Carl Woods
IPC分类号： C25D17/00
CPC分类号： C25D17/14 , C25D5/06 , C25D7/123 , C25D17/001 , C25D21/12 , H01L21/2885
摘要： An electroplating apparatus for electroplating a surface of a wafer is provided. The wafer is capable of being electrically charged as a cathode. The electroplating apparatus includes a plating head capable of being positioned either over or under the surface of a wafer and capable of being electrically charged as an anode. The plating head is capable of enabling metallic plating between the surface of the wafer and the plating head when the wafer and plating head are charged. The plating head further comprises a voltage sensor pair capable of sensing a voltage present between the plating head and the surface of the wafer, and a controller capable of receiving data from the voltage sensor pair. The data received from the voltage sensor pair is used by the controller to maintain a substantially constant voltage to be applied by the anode when the plating head is placed in positions over the surface of the wafer. A method of electroplating a wafer is also provided.
摘要翻译：提供了一种用于电镀晶片表面的电镀设备。该晶片能够作为阴极充电。电镀装置包括能够位于晶片表面的上方或下方并能够作为阳极带电的电镀头。当晶片和电镀头被充电时，电镀头能够在晶片的表面和电镀头之间实现金属电镀。电镀头还包括能够感测电镀头和晶片表面之间的电压的电压传感器对，以及能够从电压传感器对接收数据的控制器。当电镀头位于晶片表面上方时，由电压传感器对接收的数据由控制器使用以保持由阳极施加的基本上恒定的电压。还提供了一种电镀晶片的方法。

15. 发明申请

US20090321250A1 Apparatus for Plating Semiconductor Wafers 有权
标题翻译：用于电镀半导体晶片的装置
公开(公告)号：US20090321250A1
公开(公告)日：2009-12-31
申请号：US12554860
申请日：2009-09-04
申请人： Yezdi N. Dordi , Fred C. Redeker , John M. Boyd , Robert Maraschin , Carl Woods
发明人： Yezdi N. Dordi , Fred C. Redeker , John M. Boyd , Robert Maraschin , Carl Woods
IPC分类号： C25D21/12
CPC分类号： C25D17/14 , C25D5/06 , C25D7/123 , C25D17/001 , C25D21/12 , H01L21/2885
摘要： An electroplating apparatus for electroplating a surface of a wafer is provided. The wafer is capable of being electrically charged as a cathode. The electroplating apparatus includes a plating head capable of being positioned either over or under the surface of a wafer and capable of being electrically charged as an anode. The plating head is capable of enabling metallic plating between the surface of the wafer and the plating head when the wafer and plating head are charged. The plating head further comprises a voltage sensor pair capable of sensing a voltage present between the plating head and the surface of the wafer, and a controller capable of receiving data from the voltage sensor pair. The data received from the voltage sensor pair is used by the controller to maintain a substantially constant voltage to be applied by the anode when the plating head is placed in positions over the surface of the wafer. A method of electroplating a wafer is also provided.
摘要翻译：提供了一种用于电镀晶片表面的电镀设备。该晶片能够作为阴极充电。电镀装置包括能够位于晶片表面的上方或下方并能够作为阳极带电的电镀头。当晶片和电镀头被充电时，电镀头能够在晶片的表面和电镀头之间实现金属电镀。电镀头还包括能够感测电镀头和晶片表面之间的电压的电压传感器对，以及能够从电压传感器对接收数据的控制器。当电镀头位于晶片表面上方时，由电压传感器对接收的数据被控制器使用以保持由阳极施加的基本恒定的电压。还提供了一种电镀晶片的方法。

16. 发明授权

US07862693B2 Apparatus for plating semiconductor wafers 有权
标题翻译：半导体晶片电镀设备
公开(公告)号：US07862693B2
公开(公告)日：2011-01-04
申请号：US12554860
申请日：2009-09-04
申请人： Yezdi N. Dordi , Fred C. Redeker , John M. Boyd , Robert Maraschin , Carl Woods
发明人： Yezdi N. Dordi , Fred C. Redeker , John M. Boyd , Robert Maraschin , Carl Woods
IPC分类号： C25D21/12 , C25D19/00 , C25B15/00
CPC分类号： C25D17/14 , C25D5/06 , C25D7/123 , C25D17/001 , C25D21/12 , H01L21/2885
摘要： An electroplating apparatus for electroplating a surface of a wafer is provided. The wafer is capable of being electrically charged as a cathode. The electroplating apparatus includes a plating head capable of being positioned either over or under the surface of a wafer and capable of being electrically charged as an anode. The plating head is capable of enabling metallic plating between the surface of the wafer and the plating head when the wafer and plating head are charged. The plating head further comprises a voltage sensor pair capable of sensing a voltage present between the plating head and the surface of the wafer, and a controller capable of receiving data from the voltage sensor pair. The data received from the voltage sensor pair is used by the controller to maintain a substantially constant voltage to be applied by the anode when the plating head is placed in positions over the surface of the wafer. A method of electroplating a wafer is also provided.
摘要翻译：提供了一种用于电镀晶片表面的电镀设备。该晶片能够作为阴极充电。电镀装置包括能够位于晶片表面的上方或下方并能够作为阳极带电的电镀头。当晶片和电镀头被充电时，电镀头能够在晶片的表面和电镀头之间实现金属电镀。电镀头还包括能够感测电镀头和晶片表面之间的电压的电压传感器对，以及能够从电压传感器对接收数据的控制器。当电镀头位于晶片表面上方时，由电压传感器对接收的数据由控制器使用以保持由阳极施加的基本上恒定的电压。还提供了一种电镀晶片的方法。

17. 发明授权

US07975708B2 Proximity head with angled vacuum conduit system, apparatus and method 有权
标题翻译：接近头带有倾斜的真空管道系统，设备和方法
公开(公告)号：US07975708B2
公开(公告)日：2011-07-12
申请号：US11731532
申请日：2007-03-30
申请人： Michael Ravkin , John M. de Larios , Fred C. Redeker , Mikhail Korolik , Erik M. Freer
发明人： Michael Ravkin , John M. de Larios , Fred C. Redeker , Mikhail Korolik , Erik M. Freer
IPC分类号： B08B3/00
CPC分类号： H01L21/67051
摘要： A proximity head including a head surface. The head surface including a first flat region and a plurality of first conduits. Each one of the plurality of first conduits being defined by corresponding one of a plurality of first discrete holes. The plurality of first discrete holes residing in the head surface and extending through the first flat region. The head surface also including a second flat region and a plurality of second conduits. The plurality of second conduits being defined by a corresponding plurality of second discrete holes that reside in the head surface and extend through the second flat region. The head surface also including a third flat region disposed between and adjacent to the first flat region and the second flat region and a plurality of third conduits. The plurality of third conduits being defined by a corresponding plurality of third discrete holes that reside in the head surface and extend through the third flat region. The third conduits being formed at a first angle relative to the third flat region. The first angle being between 30 and 60 degrees. A system and method for processing a substrate with a proximity head is also described.
摘要翻译：包括头表面的接近头。头表面包括第一平坦区域和多个第一管道。多个第一导管中的每一个由多个第一离散孔中的对应的一个限定。多个第一离散孔位于头表面并延伸穿过第一平坦区域。头表面还包括第二平坦区域和多个第二管道。多个第二导管由位于头表面中并延伸穿过第二平坦区域的相应多个第二离散孔限定。头表面还包括设置在第一平坦区域和第二平坦区域之间并与之相邻的第三平坦区域和多个第三导管。多个第三导管由位于头表面中并延伸穿过第三平坦区域的对应的多个第三离散孔限定。第三导管相对于第三平坦区域以第一角度形成。第一个角度在30到60度之间。还描述了用于处理具有邻近头的衬底的系统和方法。

18. 发明授权

US07737097B2 Method for removing contamination from a substrate and for making a cleaning solution 有权
标题翻译：用于从衬底去除污染物和制造清洁溶液的方法
公开(公告)号：US07737097B2
公开(公告)日：2010-06-15
申请号：US11346894
申请日：2006-02-03
申请人： Erik M. Freer , John M. de Larios , Katrina Mikhaylichenko , Michael Ravkin , Mikhail Korolik , Fred C. Redeker
发明人： Erik M. Freer , John M. de Larios , Katrina Mikhaylichenko , Michael Ravkin , Mikhail Korolik , Fred C. Redeker
IPC分类号： C11D7/50
CPC分类号： H01L21/02052 , B08B7/02 , C11D9/00 , C11D9/02 , C11D9/267 , C11D11/0047 , C11D17/0013 , C11D17/0017 , C23G1/18 , G03F7/42 , H01L21/02057 , H01L21/02096
摘要： A method is provided for removing contamination from a substrate. The method includes applying a cleaning solution having a dispersed phase, a continuous phase and particles dispersed within the continuous phase to a surface of the substrate. The method includes forcing one of the particles dispersed within the continuous phase proximate to one of the surface contaminants. The forcing is sufficient to overcome any repulsive forces between the particles and the surface contaminants so that the one of the particles and the one of the surface contaminants are engaged. The method also includes removing the engaged particle and surface contaminant from the surface of the substrate. A process to manufacture the cleaning material is also provided.
摘要翻译：提供了一种用于从衬底去除污染物的方法。该方法包括将具有分散相，连续相和分散在连续相内的颗粒的清洗溶液施加到基材的表面。该方法包括迫使分散在连续相内的颗粒中的一种接近一种表面污染物。强制足以克服颗粒和表面污染物之间的任何排斥力，使得颗粒中的一个和表面污染物之一接合。该方法还包括从基材的表面除去接合的颗粒和表面污染物。还提供了制造清洁材料的方法。

19. 发明申请

US20100139694A1 Cleaning Compound and Method and System for Using the Cleaning Compound 失效
标题翻译：清洁剂及使用清洁剂的方法和系统
公开(公告)号：US20100139694A1
公开(公告)日：2010-06-10
申请号：US12705445
申请日：2010-02-12
申请人： Erik M. Freer , John M. de Larios , Katrina Mikhaylichenko , Michael Ravkin , Mikhail Korolik , Fred C. Redeker
发明人： Erik M. Freer , John M. de Larios , Katrina Mikhaylichenko , Michael Ravkin , Mikhail Korolik , Fred C. Redeker
IPC分类号： B08B3/00
CPC分类号： H01L21/02052 , B08B7/02 , C11D3/2079 , C11D9/02 , C11D9/26 , C11D9/267 , C11D11/0047 , C11D17/0013 , C11D17/0017 , C23G1/18 , G03F7/425 , G03F7/426 , H05K3/26
摘要： A cleaning compound is provided. The cleaning compound includes about 0.1 weight percent to about 10 weight percent of a fatty acid dispersed in water. The cleaning compound includes an amount of a base sufficient to bring a pH of the fatty acid water solution to about a level where above about 50% of the dispersed fatty acid is ionized. A method for cleaning a substrate, a system for cleaning a substrate, and a cleaning solution prepared by a process are also provided.
摘要翻译：提供清洁化合物。清洁化合物包括分散在水中的约0.1重量％至约10重量％的脂肪酸。清洁化合物包括一定量的足以使脂肪酸水溶液的pH达到大约50％的分散脂肪酸被离子化的水平的碱。还提供了清洁基板的方法，用于清洁基板的系统以及通过工艺制备的清洁溶液。

20. 发明申请

US20100059088A1 Method and Apparatus for Removing Contamination from Substrate 失效
标题翻译：从基板去除污染的方法和装置
公开(公告)号：US20100059088A1
公开(公告)日：2010-03-11
申请号：US12620288
申请日：2009-11-17
申请人： Erik M. Freer , John M. de Larios , Katrina Mikhaylichenko , Michael Ravkin , Mikhail Korolik , Fred C. Redeker , Clint Thomas , John Parks
发明人： Erik M. Freer , John M. de Larios , Katrina Mikhaylichenko , Michael Ravkin , Mikhail Korolik , Fred C. Redeker , Clint Thomas , John Parks
IPC分类号： B08B3/00 , B08B3/12
CPC分类号： H01L21/02057 , B05D3/10 , B08B7/02 , C11D1/04 , C11D3/042 , C11D3/044 , C11D3/18 , C11D3/2079 , C11D3/222 , C11D3/225 , C11D3/3765 , C11D9/00 , C11D9/02 , C11D9/267 , C11D11/0047 , C11D17/0004 , C11D17/0013 , C11D17/0017 , C11D17/003 , C11D17/041 , C23G1/00 , C23G1/18 , G03F7/42 , G03F7/423 , H01L21/02052 , H01L21/02096 , H01L21/31133 , H01L21/67051 , H01L21/67057 , H01L21/6708 , H01L21/67086
摘要： A cleaning material is disposed over a substrate. The cleaning material includes solid components dispersed within a liquid medium. A force is applied to the solid components within the liquid medium to bring the solid components within proximity to contaminants present on the substrate. The force applied to the solid components can be exerted by an immiscible component within the liquid medium. When the solid components are brought within sufficient proximity to the contaminants, an interaction is established between the solid components and the contaminants. Then, the solid components are moved away from the substrate such that the contaminants having interacted with the solid components are removed from the substrate.
摘要翻译：清洁材料设置在基板上。清洁材料包括分散在液体介质中的固体组分。将力施加到液体介质中的固体组分以使固体组分接近存在于基底上的污染物。施加到固体组分的力可以通过液体介质中的不混溶组分施加。当固体组分被充分接近污染物时，在固体组分和污染物之间建立了相互作用。然后，将固体组分从衬底移开，使得与固体组分相互作用的污染物从衬底上除去。

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