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11. 发明申请

US20060239103A1 Semiconductor memory circuit 有权
公开(公告)号：US20060239103A1
公开(公告)日：2006-10-26
申请号：US11472252
申请日：2006-06-22
申请人： Takesada Akiba , Shigeki Ueda , Toshikazu Tachibana , Masashi Horiguchi
发明人： Takesada Akiba , Shigeki Ueda , Toshikazu Tachibana , Masashi Horiguchi
IPC分类号： G11C5/14
CPC分类号： G11C5/147 , G11C11/4074 , G11C2207/2227
摘要： The present invention provides a semiconductor memory circuit capable of reducing current consumption at non-operation in a system equipped with a plurality of chips that share the use of a power supply, address signals and a data bus. The semiconductor memory circuit has an internal circuit which is capable of selectively performing the supply and stop of an operating voltage via switch means and includes a memory array. An input circuit, which receives a predetermined control signal therein, controls the supply and stop of the operating voltage by the switch means to reduce a DC current and a leak current when no memory operation is done, whereby low power consumption can be realized.

12. 发明授权

US07106643B2 Method for manufacturing memory device provided with a defect recovery mechanism featuring a redundancy circuit 失效
标题翻译：一种具有冗余电路的缺陷恢复机构的存储装置的制造方法
公开(公告)号：US07106643B2
公开(公告)日：2006-09-12
申请号：US11139513
申请日：2005-05-31
申请人： Masashi Horiguchi , Jun Etoh , Masakazu Aoki , Kiyoo Itoh
发明人： Masashi Horiguchi , Jun Etoh , Masakazu Aoki , Kiyoo Itoh
IPC分类号： G11C29/04 , G11C29/18 , G11C29/24 , G11C8/12
CPC分类号： G11C29/80 , G11C29/785 , G11C29/808
摘要： Method for manufacturing a memory device, the memory being a memory array with a spare bit line and being provided with a defect recovery scheme featuring a redundancy circuit. The redundancy circuit includes one or more comparing circuits having programmable elements which function as a memory for storing therein a defective address existing in the memory array. The programmable elements of the redundancy circuit can be programmed in accordance with any of a number of different types of defect modes. Each comparing circuit of the redundancy circuit compares information (data) inputted therein, for example, the column and row addresses which may be under the control of an address multiplex system, with that programmed in the programmable elements of the comparing circuit. On the basis of this comparison, an appropriate defect recovery is effected.
摘要翻译：用于制造存储器件的方法，所述存储器是具有备用位线的存储器阵列，并且提供具有冗余电路的缺陷恢复方案。冗余电路包括具有可编程元件的一个或多个比较电路，其作为用于在其中存储存在于存储器阵列中的缺陷地址的存储器。冗余电路的可编程元件可以根据多种不同类型的缺陷模式中的任何一种进行编程。冗余电路的每个比较电路将在其中输入的信息（数据），例如可能在地址多路复用系统的控制下的列和行地址与在比较电路的可编程元件中编程的信息（数据）进行比较。在此比较的基础上，进行适当的缺陷恢复。

13. 发明申请

US20060120125A1 Semiconductor memory device and defect remedying method thereof 失效
公开(公告)号：US20060120125A1
公开(公告)日：2006-06-08
申请号：US11330220
申请日：2006-01-12
申请人： Kazuhiko Kajigaya , Kazuyuki Miyazawa , Manabu Tsunozaki , Kazuyoshi Oshima , Takashi Yamazaki , Yuji Sakai , Jiro Sawada , Yasunori Yamaguchi , Tetsurou Matsumoto , Shinji Udo , Hiroshi Yoshioka , Hirokazu Saito , Mitsuhiro Takano , Makoto Morino , Sinichi Miyatake , Eiji Miyamoto , Yasuhiro Kasama , Akira Endo , Ryoichi Hori , Jun Etoh , Masashi Horiguchi , Shinichi Ikenaga , Atsushi Kumata
发明人： Kazuhiko Kajigaya , Kazuyuki Miyazawa , Manabu Tsunozaki , Kazuyoshi Oshima , Takashi Yamazaki , Yuji Sakai , Jiro Sawada , Yasunori Yamaguchi , Tetsurou Matsumoto , Shinji Udo , Hiroshi Yoshioka , Hirokazu Saito , Mitsuhiro Takano , Makoto Morino , Sinichi Miyatake , Eiji Miyamoto , Yasuhiro Kasama , Akira Endo , Ryoichi Hori , Jun Etoh , Masashi Horiguchi , Shinichi Ikenaga , Atsushi Kumata
IPC分类号： G11C19/08
CPC分类号： H01L24/06 , G11C5/025 , G11C5/04 , G11C5/063 , G11C11/406 , G11C29/06 , G11C29/12005 , G11C29/12015 , G11C29/24 , G11C29/34 , G11C29/50 , G11C29/50012 , G11C29/70 , G11C29/80 , G11C29/804 , G11C29/832 , G11C29/844 , G11C2029/2602 , H01L24/05 , H01L24/45 , H01L24/48 , H01L27/0207 , H01L27/105 , H01L27/10897 , H01L27/11898 , H01L2224/04042 , H01L2224/05553 , H01L2224/05556 , H01L2224/05624 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/4826 , H01L2224/48465 , H01L2224/48624 , H01L2224/73215 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/01021 , H01L2924/01023 , H01L2924/01024 , H01L2924/01028 , H01L2924/01037 , H01L2924/01038 , H01L2924/01039 , H01L2924/01041 , H01L2924/01043 , H01L2924/0105 , H01L2924/01051 , H01L2924/01052 , H01L2924/01054 , H01L2924/01055 , H01L2924/01058 , H01L2924/01059 , H01L2924/01074 , H01L2924/01075 , H01L2924/01079 , H01L2924/01083 , H01L2924/01084 , H01L2924/12042 , H01L2924/1305 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/30105 , H01L2924/3011 , H01L2924/3025 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor memory device formed on a semiconductor chip comprises a plurality of first memory arrays, a plurality of second memory arrays, a first voltage generator, and a plurality of first bonding pads. The semiconductor chip is divided into a first rectangle region, a second rectangle region, and a third rectangle region and the third rectangle region is arranged between the first rectangle region and the second rectangle region. The plurality of first memory arrays are formed in the first rectangle region. The plurality of second memory arrays are formed in the second rectangle region. The voltage generator and the plurality of first bonding pads are arranged in the third rectangle region. The plurality of first bonding pads are arranged between the first rectangle region and the voltage generator and no bonding pads are arranged between the voltage generator and the plurality of second memory arrays.

14. 发明授权

US07023237B2 Semiconductor integrated circuits with power reduction mechanism 失效
公开(公告)号：US07023237B2
公开(公告)日：2006-04-04
申请号：US11004823
申请日：2004-12-07
申请人： Takeshi Sakata , Kiyoo Itoh , Masashi Horiguchi
发明人： Takeshi Sakata , Kiyoo Itoh , Masashi Horiguchi
IPC分类号： H03K17/16
CPC分类号： G11C8/18 , G11C5/147 , G11C7/065 , G11C8/08 , G11C8/12 , G11C11/4074 , H03K19/0016 , H03K19/0027 , H03K19/00361
摘要： Power dissipation of a semiconductor integrated circuit chip is reduced when it is operated at an operating voltage of 2.5 V or below. A switching element is provided in each circuit block within the chip. Constants of the switching element are set so that leakage current in each switching element in their off-state is smaller than the subthreshold current of MOS transistors within the corresponding circuit block. Active current is supplied to active circuit blocks, while switching elements of non-active circuit blocks are turned off. Thus, dissipation currents of non-active circuit blocks are limited to leakage current value of corresponding switching elements. Thus, the sum of dissipation currents of non-active circuit blocks is made smaller than the active current in the active circuit blocks. As a result, power dissipation in the semiconductor integrated circuit chip can be reduced even in the active state.

15. 发明授权

US06970019B2 Semiconductor integrated circuit device having power reduction mechanism 失效
标题翻译：具有功率降低机构的半导体集成电路装置
公开(公告)号：US06970019B2
公开(公告)日：2005-11-29
申请号：US10704849
申请日：2003-11-12
申请人： Masashi Horiguchi , Kunio Uchiyama , Kiyoo Itoh , Takeshi Sakata , Masakazu Aoki , Takayuki Kawahara
发明人： Masashi Horiguchi , Kunio Uchiyama , Kiyoo Itoh , Takeshi Sakata , Masakazu Aoki , Takayuki Kawahara
IPC分类号： G11C5/00 , H01L27/02 , H03K3/356 , H03K19/00 , H03K19/0185 , H03K19/094 , H03K19/0948 , H03K19/096 , H03K19/20
CPC分类号： H01L27/0207 , G06F1/3203 , G11C5/14 , H01L27/0218 , H03K3/356113 , H03K19/0013 , H03K19/0016 , H03K19/01721
摘要： A semiconductor integrated circuit device is composed of logic gates each provided with MOS transistors. The semiconductor integrated circuit device includes a current control device. The circuit can be used in devices that cycle in operation between high and low power consumption modes, such as microprocessors, that have both an operation mode and a low power back-up or sleep mode used for power reduction.
摘要翻译：半导体集成电路器件由各自提供有MOS晶体管的逻辑门组成。半导体集成电路装置包括电流控制装置。该电路可用于在具有操作模式和用于功率降低的低功率备用或睡眠模式的高功耗模式和低功耗模式之间运行的设备中，例如微处理器。

16. 发明授权

US06909647B2 Semiconductor device having redundancy circuit 失效
标题翻译：具有冗余电路的半导体器件
公开(公告)号：US06909647B2
公开(公告)日：2005-06-21
申请号：US10813240
申请日：2004-03-31
申请人： Masashi Horiguchi , Jun Etoh , Masakazu Aoki , Kiyoo Itoh
发明人： Masashi Horiguchi , Jun Etoh , Masakazu Aoki , Kiyoo Itoh
IPC分类号： G11C5/00 , G11C7/00 , G11C8/00 , G11C29/00
CPC分类号： G11C29/80 , G11C29/785 , G11C29/808
摘要： A semiconductor memory is provided with a defect recovery scheme featuring a redundancy circuit. The memory array in the memory has a plurality of word lines, a plurality of bit lines, a spare bit line, and a plurality of memory cells. The redundancy circuit includes one or more comparing circuits having programmable elements which function as a memory for storing therein a defective address existing in the memory array. The programmable elements of the redundancy circuit can be programmed in accordance with any of a number of different types of defect modes. Each comparing circuit of the redundancy circuit compares information (data) inputted therein, for example, the column and row addresses which may be under the control of an address multiplex system, with that programmed in the programmable elements of the comparing circuit. On the basis of this comparison, an appropriate defect recovery is effected.
摘要翻译：半导体存储器具有冗余电路的缺陷恢复方案。存储器中的存储器阵列具有多个字线，多个位线，备用位线和多个存储器单元。冗余电路包括具有可编程元件的一个或多个比较电路，其作为用于在其中存储存在于存储器阵列中的缺陷地址的存储器。冗余电路的可编程元件可以根据多种不同类型的缺陷模式中的任何一种进行编程。冗余电路的每个比较电路将在其中输入的信息（数据），例如可能在地址多路复用系统的控制下的列和行地址与在比较电路的可编程元件中编程的信息（数据）进行比较。在此比较的基础上，进行适当的缺陷恢复。

17. 发明申请

US20050073895A1 Semiconductor memory device 有权
标题翻译：半导体存储器件
公开(公告)号：US20050073895A1
公开(公告)日：2005-04-07
申请号：US10636558
申请日：2003-08-08
申请人： Hideharu Yahata , Masashi Horiguchi , Yoshikazu Saitoh , Yasushi Kawase
发明人： Hideharu Yahata , Masashi Horiguchi , Yoshikazu Saitoh , Yasushi Kawase
IPC分类号： G11C11/403 , G11C7/00 , G11C11/34 , G11C11/401 , G11C11/406
CPC分类号： G11C11/40615 , G11C11/406 , G11C11/408 , G11C2211/4061
摘要： With the objective of providing a semiconductor memory device which is made identical in usability to a static RAM by use of dynamic memory cells and realizes a high-speed memory cycle time, there is provided a pseudo static RAM having a time multiplex mode which, when instructions for a memory operation for reading memory information from each of memory cells each requiring a refresh operation for periodically holding the memory information, or writing the same therein is issued, carries out an addressing-based autonomous refresh operation different from the memory operation before or after the memory operation. The pseudo static RAM includes address signal transition detectors for a row and a column, and a page mode which independently performs a column address selecting operation according to an address signal transition detect signal of the second address signal transition detector.
摘要翻译：为了提供通过使用动态存储器单元使与静态RAM相同的半导体存储器件的目的，实现高速存储器周期时间，提供了一种具有时间多路复用模式的伪静态RAM，当时发出用于从每个存储单元读取存储器信息的存储器操作的指令，每个存储器单元需要周期性地保持存储器信息的刷新操作，或者写入其中的存储器信息，执行与之前或之前的存储器操作不同的基于寻址的自主刷新操作，内存操作后。伪静态RAM包括用于行和列的地址信号转换检测器，以及根据第二地址信号转换检测器的地址信号转移检测信号独立地执行列地址选择操作的页模式。

18. 发明授权

US06762963B2 Semiconductor memory having dynamic memory cells and a redundancy relief circuit 失效
标题翻译：具有动态存储单元的半导体存储器和冗余消除电路
公开(公告)号：US06762963B2
公开(公告)日：2004-07-13
申请号：US10192615
申请日：2002-07-11
申请人： Yoshihiko Inoue , Hisashi Motomura , Masashi Horiguchi
发明人： Yoshihiko Inoue , Hisashi Motomura , Masashi Horiguchi
IPC分类号： G11C700
CPC分类号： G11C11/406
摘要： A semiconductor memory capable of reducing refresh cycle time, which includes normal memory cells provided at predetermined intersections of plural normal word lines and plural bit lines, and redundant memory cells of redundant word lines and the plural bit lines, a redundancy relief circuit evaluates whether each of an internal address signal for a memory operation and a refresh address signal corresponds to the address of a defective word line of the plural normal word lines. An address selecting circuit switches the defective word line to a redundant word line according to the evaluation result. The redundancy relief circuit then evaluates whether a refresh address added to the refresh address signal corresponds to a defective address, and during refresh, the address selecting circuit selects a normal or redundant word line according to the evaluation result in a preceding cycle.
摘要翻译：一种能够减少刷新周期时间的半导体存储器，其包括在多个正常字线和多个位线的预定交点处提供的正常存储器单元以及冗余字线和多个位线的冗余存储器单元，冗余消除电路评估每个用于存储器操作的内部地址信号和刷新地址信号对应于多个正常字线的缺陷字线的地址。地址选择电路根据评估结果将缺陷字线切换成冗余字线。然后，冗余解除电路评估添加到刷新地址信号的刷新地址是否对应于缺陷地址，并且在刷新期间，地址选择电路根据前一周期的评估结果选择正常或冗余字线。

19. 发明授权

US06680875B2 Semiconductor device, such as a synchronous DRAM, including a control circuit for reducing power consumption 有权
标题翻译：诸如同步DRAM的半导体器件，包括用于降低功耗的控制电路
公开(公告)号：US06680875B2
公开(公告)日：2004-01-20
申请号：US10259579
申请日：2002-09-30
申请人： Masashi Horiguchi , Masayuki Nakamura , Sadayuki Ohkuma , Kazuhiko Kajigaya , Yoshinobu Nakagome
发明人： Masashi Horiguchi , Masayuki Nakamura , Sadayuki Ohkuma , Kazuhiko Kajigaya , Yoshinobu Nakagome
IPC分类号： G11C800
CPC分类号： G11C5/063 , G11C5/14 , G11C5/147 , G11C7/1072 , G11C8/12 , G11C11/406 , G11C11/40615 , G11C11/40618 , G11C11/4074 , G11C11/4076 , G11C2207/2227 , G11C2211/4067 , G11C2211/4068
摘要： A semiconductor device comprising a plurality of memory banks and a plurality of power supply circuits corresponding to the memory banks. Each of the memory banks is independently activated by an activating command. Given an externally supplied voltage, each of the power supply circuits outputs a predetermined internal supply voltage. Each power supply circuit has its output connected to the corresponding memory bank. In response to a command for activating one of the memory banks, the corresponding power supply circuit is activated while the remaining power supply circuits is deactivated.
摘要翻译：一种半导体器件，包括多个存储体和对应于存储体的多个电源电路。每个存储体被激活命令独立地激活。给定外部提供的电压，每个电源电路输出预定的内部电源电压。每个电源电路的输出连接到相应的存储体。响应于用于激活存储体之一的命令，相应的电源电路被激活，而剩余的电源电路被去激活。

20. 发明授权

US06657901B2 Semiconductor device formed in a rectangle region on a semiconductor substrate including a voltage generating circuit 失效
标题翻译：半导体器件形成在包括电压产生电路的半导体衬底上的矩形区域中
公开(公告)号：US06657901B2
公开(公告)日：2003-12-02
申请号：US10254980
申请日：2002-09-26
申请人： Kazuhiko Kajigaya , Kazuyuki Miyazawa , Manabu Tsunozaki , Kazuyoshi Oshima , Takashi Yamazaki , Yuji Sakai , Jiro Sawada , Yasunori Yamaguchi , Tetsurou Matsumoto , Shinji Udo , Hiroshi Yoshioka , Hirokazu Saito , Mitsuhiro Takano , Makoto Morino , Sinichi Miyatake , Eiji Miyamoto , Yasuhiro Kasama , Akira Endo , Ryoichi Hori , Jun Etoh , Masashi Horiguchi , Shinichi Ikenaga , Atsushi Kumata
发明人： Kazuhiko Kajigaya , Kazuyuki Miyazawa , Manabu Tsunozaki , Kazuyoshi Oshima , Takashi Yamazaki , Yuji Sakai , Jiro Sawada , Yasunori Yamaguchi , Tetsurou Matsumoto , Shinji Udo , Hiroshi Yoshioka , Hirokazu Saito , Mitsuhiro Takano , Makoto Morino , Sinichi Miyatake , Eiji Miyamoto , Yasuhiro Kasama , Akira Endo , Ryoichi Hori , Jun Etoh , Masashi Horiguchi , Shinichi Ikenaga , Atsushi Kumata
IPC分类号： G11C1604
CPC分类号： H01L24/06 , G11C5/025 , G11C5/04 , G11C5/063 , G11C11/406 , G11C29/06 , G11C29/12005 , G11C29/12015 , G11C29/24 , G11C29/34 , G11C29/50 , G11C29/50012 , G11C29/70 , G11C29/80 , G11C29/804 , G11C29/832 , G11C29/844 , G11C2029/2602 , H01L24/05 , H01L24/45 , H01L24/48 , H01L27/0207 , H01L27/105 , H01L27/10897 , H01L27/11898 , H01L2224/04042 , H01L2224/05553 , H01L2224/05556 , H01L2224/05624 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/4826 , H01L2224/48465 , H01L2224/48624 , H01L2224/73215 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/01021 , H01L2924/01023 , H01L2924/01024 , H01L2924/01028 , H01L2924/01037 , H01L2924/01038 , H01L2924/01039 , H01L2924/01041 , H01L2924/01043 , H01L2924/0105 , H01L2924/01051 , H01L2924/01052 , H01L2924/01054 , H01L2924/01055 , H01L2924/01058 , H01L2924/01059 , H01L2924/01074 , H01L2924/01075 , H01L2924/01079 , H01L2924/01083 , H01L2924/01084 , H01L2924/12042 , H01L2924/1305 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/30105 , H01L2924/3011 , H01L2924/3025 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor memory device, in which peripheral circuits are arranged in a cross area of a semiconductor chip composed of the longitudinal center portions and the transverse center portions, and in which memory arrays are arranged in the four regions which are divided by the cross area. A benefit of this structure in which the peripheral circuits are arranged at the center portion of the chip, is that the longest signal transmission paths can be shortened to about one half of the chip size to speed up the DRAM which is intended to have a large storage capacity.
摘要翻译：一种半导体存储器件，其中外围电路布置在由纵向中心部分和横向中心部分组成的半导体芯片的交叉区域中，并且其中存储器阵列布置在由横截面划分的四个区域中。外围电路布置在芯片的中心部分的这种结构的好处是，最长的信号传输路径可以缩短到芯片尺寸的大约一半，以加快DRAM的意图。存储容量。

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