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11. 发明申请

US20090189277A1 PHOTOSENSITIVE COMPOSITIONS BASED ON POLYCYCLIC POLYMERS FOR LOW STRESS, HIGH TEMPERATURE FILMS 有权
标题翻译：基于低分子聚合物，高温胶片的光敏组合物
公开(公告)号：US20090189277A1
公开(公告)日：2009-07-30
申请号：US12327611
申请日：2008-12-03
申请人： Christopher Apanius , Matthew Apanius , Edmund Elce , Hendra Ng , Brian Knapp , Takashi Hirano , Junya Kusunoki , Robert A. Shick
发明人： Christopher Apanius , Matthew Apanius , Edmund Elce , Hendra Ng , Brian Knapp , Takashi Hirano , Junya Kusunoki , Robert A. Shick
IPC分类号： H01L23/06 , C08F132/08 , B05D3/06 , G03F7/004
CPC分类号： C08G59/3218 , C08G59/24 , C08G61/02 , C08G61/06 , C08L63/00 , G03F7/0382
摘要： Vinyl addition polymer compositions, methods for forming such compositions, methods for using such compositions to form microelectronic and optoelectronic devices are provided. The vinyl addition polymer encompassed by such compositions has a polymer backbone having two or more distinct types of repeat units derived from norbornene-type monomers independently selected from monomers of Formula I: wherein each of X, m, R1, R2, R3, and R4 is as defined herein and wherein a first type of repeat unit is derived from a glycidyl ether substituted norbornene monomer and a second type of repeat unit is derived from an aralkyl substituted norbornene monomer.
摘要翻译：提供乙烯基加成聚合物组合物，形成这种组合物的方法，使用这种组合物形成微电子和光电子器件的方法。由这种组合物包含的乙烯基加成聚合物具有聚合物主链，其具有两种或更多种不同类型的衍生自独立地选自式I的单体的降冰片烯型单体的重复单元：其中X，m，R 1，R 2，R 3和R 4中的每一个如本文所定义，并且其中第一类型的重复单元衍生自缩水甘油醚取代的降冰片烯单体，第二类型的重复单元衍生自芳烷基取代的降冰片烯单体。

12. 发明申请

US20090008682A1 Light-Receiving Device 审中-公开
标题翻译：光接收装置
公开(公告)号：US20090008682A1
公开(公告)日：2009-01-08
申请号：US11664919
申请日：2005-10-05
申请人： Junya Kusunoki , Takashi Hirano
发明人： Junya Kusunoki , Takashi Hirano
IPC分类号： H01L31/113
CPC分类号： H01L31/0203 , H01L23/3192 , H01L27/14618 , H01L27/14627 , H01L2924/0002 , H01L2924/3025 , H01L2924/00
摘要： Disclosed is a light-receiving device comprising a substrate provided with at least one light-receiving element and a transparent cover (6) arranged above the surface of the substrate on which the light-receiving element is formed. A sealing member (5) is provided between the substrate and the transparent cover (6) at least in the region of the substrate surrounding the light-receiving element. This sealing member (5) is composed of a material containing cyclic olefin resin.
摘要翻译：公开了一种光接收装置，其包括设置有至少一个光接收元件的基板和布置在其上形成有光接收元件的基板的表面上方的透明盖（6）。至少在围绕光接收元件的基板的区域中，密封构件（5）设置在基板和透明盖（6）之间。该密封构件（5）由含有环状烯烃树脂的材料构成。

13. 发明授权

US07999354B2 Resin composition, filling material, insulating layer and semiconductor device 失效
标题翻译：树脂组合物，填充材料，绝缘层和半导体器件
公开(公告)号：US07999354B2
公开(公告)日：2011-08-16
申请号：US12664003
申请日：2008-06-11
申请人： Toyosei Takahashi , Rie Takayama , Hirohisa Dejima , Junya Kusunoki
发明人： Toyosei Takahashi , Rie Takayama , Hirohisa Dejima , Junya Kusunoki
IPC分类号： H01L29/40
CPC分类号： C08L63/10 , H01L21/76898 , H01L23/481 , H01L2224/02372 , H01L2224/0401 , H01L2224/05548 , H01L2224/06181 , H01L2224/13022 , H01L2224/13024 , H01L2224/131 , Y10T428/24273 , H01L2924/014
摘要： A resin composition of the present invention is used for forming a filling material which fills at least a through-hole of a semiconductor substrate, the through-hole extending through the semiconductor substrate in a thickness direction thereof and having a conductive portion therein. The resin composition is composed of: a resin having a radical-polymerizable double bond, a thermosetting resin and a resin which differs from the resin having the radical-polymerizable double bond and has an alkali-soluble group and a double bond; or a cyclic olefin resin. A filling material of the present invention is formed of a cured product of the above resin composition. An insulating layer of the present invention is formed of a cured product of the above resin composition. The insulating layer includes: a layer-shaped insulating portion provided on a surface opposite to a functional surface of the semiconductor substrate; and a filling portion integrally formed with the insulating portion and filling the through-hole. A semiconductor device of the present invention includes the above insulating layer.
摘要翻译：本发明的树脂组合物用于形成填充半导体衬底的至少通孔的填充材料，所述通孔在其厚度方向上延伸穿过半导体衬底并且在其中具有导电部分。树脂组合物由具有自由基聚合性双键的树脂，热固性树脂和树脂组成，该树脂与具有自由基聚合双键的具有碱溶性基团和双键的树脂不同; 或环状烯烃树脂。本发明的填充材料由上述树脂组合物的固化物形成。本发明的绝缘层由上述树脂组合物的固化物形成。绝缘层包括：设置在与半导体衬底的功能表面相对的表面上的层状绝缘部分; 以及与所述绝缘部一体形成并填充所述通孔的填充部。本发明的半导体器件包括上述绝缘层。

14. 发明授权

US07808083B2 Semiconductor device 失效
标题翻译：半导体器件
公开(公告)号：US07808083B2
公开(公告)日：2010-10-05
申请号：US11663924
申请日：2005-09-29
申请人： Junya Kusunoki , Takashi Hirano
发明人： Junya Kusunoki , Takashi Hirano
IPC分类号： H01L23/48
CPC分类号： H01L23/3114 , C08G59/3218 , H01L23/293 , H01L24/10 , H01L24/13 , H01L2224/05001 , H01L2224/05022 , H01L2224/05124 , H01L2224/05147 , H01L2224/05166 , H01L2224/05171 , H01L2224/056 , H01L2224/13 , H01L2224/13099 , H01L2224/16 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/15787 , H01L2924/00 , H01L2924/00014
摘要： Disclosed is a semiconductor device having a wafer level package structure which is characterized by containing a resin layer composed of a resin composition which is curable at 250° C. or less. Such a semiconductor device having a wafer level package structure is excellent in low stress properties, solvent resistance, low water absorbency, electrical insulation properties, adhesiveness and the like.
摘要翻译：公开了一种具有晶片级封装结构的半导体器件，其特征在于包含由在250℃以下可固化的树脂组合物构成的树脂层。具有晶片级封装结构的这种半导体器件的低应力性，耐溶剂性，低吸水性，电绝缘性，粘合性等优异。

15. 发明申请

US20060228562A1 Semiconductor device, resin composition for buffer coating, resin composition for die bonding, and resin composition for encapsulating 审中-公开
标题翻译：半导体装置，缓冲涂层用树脂组合物，芯片接合用树脂组合物和用于封装的树脂组合物
公开(公告)号：US20060228562A1
公开(公告)日：2006-10-12
申请号：US11388791
申请日：2006-03-24
申请人： Ken Ukawa , Keiichiro Saito , Hiroyuki Yasuda , Junya Kusunoki
发明人： Ken Ukawa , Keiichiro Saito , Hiroyuki Yasuda , Junya Kusunoki
IPC分类号： B32B27/00 , B32B27/38 , H01L21/56 , C08L83/10 , C08L63/00 , C08G77/42
CPC分类号： C08G59/027 , C08G59/3218 , C08G59/4021 , C08G61/06 , C08G77/455 , C09D163/00 , H01L23/293 , H01L23/3142 , H01L23/49513 , H01L24/48 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/01019 , H01L2924/01057 , H01L2924/01077 , H01L2924/01079 , H01L2924/01322 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , Y10T428/31511 , Y10T428/31663 , Y10T428/31721 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： This invention can provide a semiconductor device exhibiting excellent anti-solder reflow resistance and higher reliability in surface mounting using a lead-free solder. In accordance with the present invention, there is provided a semiconductor device formed by placing a semiconductor chip whose surface is coated with a cured resin composition for buffer coating on a pad in a lead frame via a cured resin composition for die bonding and encapsulating the semiconductor chip on the pad in the lead frame by a cured resin composition for encapsulating, wherein the cured resin composition for buffer coating has an elastic modulus of 0.5 GPa to 2.0 GPa both inclusive at 25° C.; the cured resin composition for die bonding has an elastic modulus of 1 MPa to 120 MPa both inclusive at 260° C.; and the cured resin composition for encapsulating has an elastic modulus of 400 MPa to 1200 MPa both inclusive at 260° C. and a thermal expansion coefficient of 20 ppm to 50 ppm both inclusive at 260° C., and the product of the elastic modulus of the cured resin composition for encapsulating and thermal expansion coefficient of the cured resin composition for encapsulating is 8000 to 45000 both inclusive.
摘要翻译：本发明可以提供一种使用无铅焊料显示优异的抗焊料回流电阻和更高的表面安装可靠性的半导体器件。根据本发明，提供了一种半导体器件，其通过将用于芯片焊接的固化树脂组合物放置在表面上涂覆有用于缓冲涂层的固化树脂组合物的半导体芯片在引线框架中的焊盘上，并将半导体通过用于封装的固化树脂组合物将引线框架上的焊盘切片，其中用于缓冲涂层的固化树脂组合物在25℃下具有0.5GPa至2.0GPa（包括端值）的弹性模量; 用于模片粘合的固化树脂组合物在260℃下的弹性模量为1MPa至120MPa（包括端值）。并且用于封装的固化树脂组合物在260℃下的弹性模量为400MPa至1200MPa（包括端值）和260℃下的热膨胀系数为20ppm至50ppm，并且弹性模量用于封装的固化树脂组合物和用于封装的固化树脂组合物的热膨胀系数为8000〜45000。

16. 发明申请

US20100181684A1 RESIN COMPOSITION, FILLING MATERIAL, INSULATING LAYER AND SEMICONDUCTOR DEVICE 失效
标题翻译：树脂组合物，填充材料，绝缘层和半导体器件
公开(公告)号：US20100181684A1
公开(公告)日：2010-07-22
申请号：US12664003
申请日：2008-06-11
申请人： Toyosei Takahashi , Rie Takayama , Hirohisa Dejima , Junya Kusunoki
发明人： Toyosei Takahashi , Rie Takayama , Hirohisa Dejima , Junya Kusunoki
IPC分类号： H01L23/48 , C08L1/00 , C08L75/00 , C08L67/00 , B32B3/10
CPC分类号： C08L63/10 , H01L21/76898 , H01L23/481 , H01L2224/02372 , H01L2224/0401 , H01L2224/05548 , H01L2224/06181 , H01L2224/13022 , H01L2224/13024 , H01L2224/131 , Y10T428/24273 , H01L2924/014
摘要： A resin composition of the present invention is used for forming a filling material which fills at least a through-hole of a semiconductor substrate, the through-hole extending through the semiconductor substrate in a thickness direction thereof and having a conductive portion therein. The resin composition is composed of: a resin having a radical-polymerizable double bond, a thermosetting resin and a resin which differs from the resin having the radical-polymerizable double bond and has an alkali-soluble group and a double bond; or a cyclic olefin resin. A filling material of the present invention is formed of a cured product of the above resin composition. An insulating layer of the present invention is formed of a cured product of the above resin composition. The insulating layer includes: a layer-shaped insulating portion provided on a surface opposite to a functional surface of the semiconductor substrate; and a filling portion integrally formed with the insulating portion and filling the through-hole. A semiconductor device of the present invention includes the above insulating layer.
摘要翻译：本发明的树脂组合物用于形成填充半导体衬底的至少通孔的填充材料，所述通孔在其厚度方向上延伸穿过半导体衬底并且在其中具有导电部分。树脂组合物由具有自由基聚合性双键的树脂，热固性树脂和树脂组成，该树脂与具有自由基聚合双键的具有碱溶性基团和双键的树脂不同; 或环状烯烃树脂。本发明的填充材料由上述树脂组合物的固化物形成。本发明的绝缘层由上述树脂组合物的固化物形成。绝缘层包括：设置在与半导体衬底的功能表面相对的表面上的层状绝缘部分; 以及与所述绝缘部一体形成并填充所述通孔的填充部。本发明的半导体器件包括上述绝缘层。

17. 发明申请

US20080090176A1 Semiconductor Wafer And Semiconductor Device 失效
标题翻译：半导体晶圆和半导体器件
公开(公告)号：US20080090176A1
公开(公告)日：2008-04-17
申请号：US11665543
申请日：2005-10-20
申请人： Junya Kusunoki , Takashi Hirano
发明人： Junya Kusunoki , Takashi Hirano
IPC分类号： G03C1/73
CPC分类号： C08G59/3218 , G03F7/0382 , H01L23/293 , H01L23/3171 , H01L2924/0002 , H01L2924/00
摘要： Disclosed is a semiconductor wafer which is characterized in that a resin layer composed of a resin composition containing a cyclic olefin resin (A) having an epoxy group and a photoacid generator (B) is arranged on a surface on which a circuit element is formed, and the residual stress of the resin layer after curing is 1-20 MPa. Also disclosed is a semiconductor device comprising such a semiconductor wafer.
摘要翻译：公开了一种半导体晶片，其特征在于，在其上形成有电路元件的表面上设置由包含环氧基的环烯烃树脂（A）和光酸产生剂（B）的树脂组合物构成的树脂层，固化后树脂层的残余应力为1-20MPa。还公开了包括这种半导体晶片的半导体器件。

18. 发明申请

US20060020068A1 Photosensitive compositions based on polycyclic polymers for low stress, high temperature films 审中-公开
标题翻译：基于用于低应力，高温膜的多环聚合物的光敏组合物
公开(公告)号：US20060020068A1
公开(公告)日：2006-01-26
申请号：US11105494
申请日：2005-04-14
申请人： Edmund Elce , Chris Apanius , Matt Apanius , Robert Shick , Takashi Hirano , Junya Kusunoki
发明人： Edmund Elce , Chris Apanius , Matt Apanius , Robert Shick , Takashi Hirano , Junya Kusunoki
IPC分类号： C08G18/66 , C08F132/08
CPC分类号： C08F232/08 , C08F216/1416 , C08G61/06 , G03F7/0382
摘要： Vinyl addition polymer compositions, methods for forming such compositions, methods for using such compositions to form microelectronic and optoelectronic devices are provided. The vinyl addition polymer encompassed by such compositions has a polymer backbone having two or more distinct types of repeat units derived from norbornene-type monomers independently selected from monomers of Formula I: wherein each of X, m, R1, R2, R3, and R4 is as defined herein and wherein a first type of repeat unit is derived from a glycidyl ether substituted norbornene monomer and a second type of repeat unit is derived from an aralkyl substituted norbornene monomer.
摘要翻译：提供乙烯基加成聚合物组合物，形成这种组合物的方法，使用这种组合物形成微电子和光电子器件的方法。由这种组合物包含的乙烯基加成聚合物具有聚合物主链，其具有两种或更多种不同类型的衍生自独立地选自式I的单体的降冰片烯型单体的重复单元：其中X，m，R 1， >，R 2，R 3和R 4如本文所定义，并且其中第一类型的重复单元衍生自缩水甘油醚取代的降冰片烯单体和第二类型的重复单元衍生自芳烷基取代的降冰片烯单体。

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