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    • 13. 发明申请
    • SOLID-STATE IMAGING DEVICE
    • 固态成像装置
    • US20110075005A1
    • 2011-03-31
    • US12990051
    • 2009-04-22
    • Hisanori SuzukiYasuhito YonetaShinya OtsukaMasaharu Muramatsu
    • Hisanori SuzukiYasuhito YonetaShinya OtsukaMasaharu Muramatsu
    • H04N5/335
    • H01L27/14831H01L27/14825H04N5/37213
    • A solid-state imaging device 1 is provided with a plurality of photoelectric converting portions 3 and first and second shift registers 9, 13. Each photoelectric converting portion 3 has a photosensitive region 15 which generates a charge according to incidence of light and which has a planar shape of a nearly rectangular shape composed of two long sides and two short sides, and a potential gradient forming region 17 which forms a potential gradient increasing along a predetermined direction parallel to the long sides forming the planar shape of the photosensitive region 15, in the photosensitive region, 15. The plurality of photoelectric converting portions 3 are juxtaposed along a direction intersecting with the predetermined direction. The first and second shift registers 9, 13 acquire charges transferred from the respective photoelectric converting portions 3 and transfer them in the direction intersecting with the predetermined direction to output them. This achieves the solid-state imaging device capable of quickly reading out the charge generated in the photosensitive region, without complicating image processing.
    • 固态成像装置1设置有多个光电转换部分3和第一和第二移位寄存器9,13。每个光电转换部分3具有光敏区域15,其根据光的入射产生电荷,并且具有 由两个长边和两个短边组成的近似矩形形状的平面形状以及形成沿着平行于形成感光区域15的平面形状的长边的预定方向增加的电位梯度的电位梯度形成区域17 感光区域15.多个光电转换部分3沿着与预定方向相交的方向并置。 第一移位寄存器9和第二移位寄存器13获取从各个光电转换部分3传送的电荷并沿与预定方向相交的方向传送它们以输出它们。 这实现了能够快速读出感光区域中产生的电荷的固态成像装置,而不会使图像处理复杂化。
    • 14. 发明申请
    • IMAGING DEVICE HOLDING STRUCTURE AND IMAGING DEVICE
    • 成像装置保持结构和成像装置
    • US20100188564A1
    • 2010-07-29
    • US12445630
    • 2007-10-12
    • Hiroya KobayashiYasuhito MiyazakiMasaharu Muramatsu
    • Hiroya KobayashiYasuhito MiyazakiMasaharu Muramatsu
    • H04N5/225
    • H04N5/2253
    • A holding structure 100 for an image pickup device includes a back-incident type image pickup device 1 and a holding member 51 that holds the image pickup element 1, and the image pickup device 1 has an image pickup element 11 that performs imaging and a wiring board 12 electrically connected to the image pickup element 11. The holding member 51 is freely attachably and detachably attached to a side face 27 of the wiring board 12, at each of the opposing side faces 27a, 27a in the wiring board 12, a to-be-fitted portion 28 is formed, and the to-be-fitted portion 28 and a fitting portion 54 formed at the holding member 51 are fitted together. This relieves, even when an impact is applied to the image pickup device 1 during an inspection, delivery, etc., the impact to be applied to the wiring board 12 and the image pickup element 11 by the holding member 51 while suppressing the holding member 51 from coming off. Further, handling of the image pickup device 1 is facilitated, and an unnecessary impact to be applied to the image pickup device 1 is suppressed.
    • 用于图像拾取装置的保持结构100包括后入射型图像拾取装置1和保持图像拾取元件1的保持构件51,并且图像拾取装置1具有执行成像和布线的图像拾取元件11 基板12电连接到图像拾取元件11.保持构件51在布线板12的每个相对侧面27a,27a处可自由地安装和拆卸地附接到布线板12的侧面,a至 被嵌合部28和形成在保持构件51上的嵌合部54嵌合在一起。 即使当在检查,传送等期间对图像拾取装置1施加冲击时,也可以通过保持构件51对保持构件51施加的对冲击的影响,同时抑制保持构件 来自51 此外,便于图像拾取装置1的处理,并且抑制对图像拾取装置1施加不必要的影响。
    • 16. 发明授权
    • Photoelectric tube using electron beam irradiation diode as anode
    • 光电管采用电子束照射二极管作为阳极
    • US5780913A
    • 1998-07-14
    • US954616
    • 1997-10-27
    • Masaharu MuramatsuMotohiro SuyamaKoei Yamamoto
    • Masaharu MuramatsuMotohiro SuyamaKoei Yamamoto
    • H01J31/49H01L31/115
    • H01J31/49
    • When light is incident on the photoelectric surface of this electron tube, photoelectrons are emitted. These photoelectrons are accelerated and incident on an electron beam irradiation diode. A reverse voltage of about 100 V is applied to the electron beam irradiation diode to form a depletion region almost throughout an anode layer and near the p-n junction interface of a silicon substrate. The incident accelerated electrons release a kinetic energy in a heavily doped p-type layer having an electron incidence surface and the depleted anode layer to form electron-hole pairs. In this case, since the heavily doped p-type layer having the electron incidence surface is very thin, the energy is hardly released in this layer, and almost all energy is released in the depletion region. Signal charges extracted from the electron-hole pairs formed upon releasing the energy are output as a signal from two electrodes.
    • 当光入射到该电子管的光电表面上时,发射光电子。 这些光电子被加速并入射在电子束照射二极管上。 大约100V的反向电压被施加到电子束照射二极管,以在整个阳极层和硅衬底的p-n结界面附近形成耗尽区。 事件加速电子在具有电子入射表面和耗尽的阳极层的重掺杂p型层中释放动能以形成电子 - 空穴对。 在这种情况下,由于具有电子入射面的重掺杂p型层非常薄,所以在该层中几乎不释放能量,几乎所有能量在耗尽区中释放。 从释放能量时形成的电子 - 空穴对提取的信号电荷作为来自两个电极的信号被输出。
    • 19. 发明授权
    • Imaging device holding structure and imaging device
    • 成像装置保持结构和成像装置
    • US08947587B2
    • 2015-02-03
    • US12445630
    • 2007-10-12
    • Hiroya KobayashiYasuhito MiyazakiMasaharu Muramatsu
    • Hiroya KobayashiYasuhito MiyazakiMasaharu Muramatsu
    • H04N5/222H04N5/225
    • H04N5/2253
    • A holding structure 100 for an image pickup device includes a back-incident type image pickup device 1 and a holding member 51 that holds the image pickup element 1, and the image pickup device 1 has an image pickup element 11 that performs imaging and a wiring board 12 electrically connected to the image pickup element 11. The holding member 51 is freely attachably and detachably attached to a side face 27 of the wiring board 12, at each of the opposing side faces 27a, 27a in the wiring board 12, a to-be-fitted portion 28 is formed, and the to-be-fitted portion 28 and a fitting portion 54 formed at the holding member 51 are fitted together. This relieves, even when an impact is applied to the image pickup device 1 during an inspection, delivery, etc., the impact to be applied to the wiring board 12 and the image pickup element 11 by the holding member 51 while suppressing the holding member 51 from coming off. Further, handling of the image pickup device 1 is facilitated, and an unnecessary impact to be applied to the image pickup device 1 is suppressed.
    • 用于图像拾取装置的保持结构100包括后入射型图像拾取装置1和保持图像拾取元件1的保持构件51,并且图像拾取装置1具有执行成像和布线的图像拾取元件11 基板12电连接到图像拾取元件11.保持构件51在布线板12的每个相对侧面27a,27a处可自由地安装和拆卸地附接到布线板12的侧面,a至 被嵌合部28和形成在保持构件51上的嵌合部54嵌合在一起。 即使当在检查,传送等期间对图像拾取装置1施加冲击时,也可以通过保持构件51对保持构件51施加的对冲击的影响,同时抑制保持构件 来自51 此外,便于图像拾取装置1的处理,并且抑制对图像拾取装置1施加不必要的影响。