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    • 15. 发明授权
    • Method for hardening gate oxides using gate etch process
    • 使用栅极蚀刻工艺硬化栅极氧化物的方法
    • US06756291B1
    • 2004-06-29
    • US10350604
    • 2003-01-24
    • Ching Chen HaoJing Chiang ChangNai-Chen LuChao-Chi Chen
    • Ching Chen HaoJing Chiang ChangNai-Chen LuChao-Chi Chen
    • H01L213205
    • H01L21/28202H01L21/28061H01L21/28176H01L21/32137H01L29/518
    • A method for repairing a damaged gate oxide layer while making the gate oxide layer resistant to gate oxide degradation including providing a silicon substrate having an overlying gate oxide layer and a polysilicon layer overlying the gate oxide layer; forming a polycide layer over the polysilicon layer; photolithographically patterning the polycide layer for dry etching a gate structure; dry etching a gate structure including etching through a thickness of the polycide layer including a fluorine containing etching chemistry to produce implanted fluorine in the polycide layer; and, thermally annealing the silicon substrate including the gate structure to thermally diffuse the implanted fluorine to an interface region of the gate oxide and the silicon substrate to form chemical bonds with silicon.
    • 一种在使栅极氧化层对栅极氧化物降解有抵抗力的同时修复损坏的栅极氧化物层的方法,包括提供具有覆盖栅极氧化物层的硅衬底和覆盖栅极氧化物层的多晶硅层; 在所述多晶硅层上形成多晶硅化物层; 光刻地图形化多晶硅化物层用于干蚀刻栅极结构; 干蚀刻栅极结构,包括通过包含含氟蚀刻化学品的多晶硅化物层的厚度进行蚀刻以在多晶硅化物层中产生注入的氟; 并且对包括栅极结构的硅基板进行热退火以将注入的氟热扩散到栅极氧化物和硅衬底的界面区域以与硅形成化学键。
    • 16. 发明申请
    • INPUT/OUTPUT SIGNAL PROCESSING CIRCUIT AND INPUT/OUTPUT SIGNAL PROCESSING METHOD
    • 输入/输出信号处理电路和输入/输出信号处理方法
    • US20160241304A1
    • 2016-08-18
    • US15097240
    • 2016-04-12
    • Yi-Min ShiuChao-Chi ChenPei-Sheng Tsu
    • Yi-Min ShiuChao-Chi ChenPei-Sheng Tsu
    • H04B3/54G06F1/26G06F13/42
    • H04B3/54G06F1/26G06F13/4282G09G2300/0408G09G2310/0289G11C5/14G11C11/4074G11C11/4096
    • The present invention discloses an input/output (I/O) signal processing circuit and processing method. The I/O signal processing circuit includes a level adjustable I/O circuit and an adjustment circuit. The I/O signal processing circuit includes an output driver and/or an input comparator. The output driver transmits an output signal via a signal transmission line according to an output data. The output driver has an adjustable high operation voltage level and an adjustable low operation voltage level, which determine a high level and a low level of the output signal, respectively. The input comparator receives an input signal via the signal transmission line and comparing the input signal with an adjustable reference voltage, so as to generate an input data. The adjustment circuit generates an adjustment signal according to voltage drop related information, to correspondingly adjust the adjustable high and low operation voltage level and/or the adjustable reference voltage.
    • 本发明公开了一种输入/输出(I / O)信号处理电路及其处理方法。 I / O信号处理电路包括电平可调I / O电路和调整电路。 I / O信号处理电路包括输出驱动器和/或输入比较器。 输出驱动器根据输出数据通过信号传输线传输输出信号。 输出驱动器具有可调节的高工作电压电平和可调节的低工作电压电平,分别决定输出信号的高电平和低电平。 输入比较器经由信号传输线接收输入信号,并将输入信号与可调参考电压进行比较,以产生输入数据。 调整电路根据电压降相关信息生成调整信号,相应地调整可调高低电平操作电压和/或可调参考电压。
    • 18. 发明授权
    • System and methods for semiconductor device performance prediction during processing
    • 处理过程中半导体器件性能预测的系统和方法
    • US08962353B2
    • 2015-02-24
    • US13234964
    • 2011-09-16
    • Jen-Pan WangChao-Chi ChenYaling Huang
    • Jen-Pan WangChao-Chi ChenYaling Huang
    • H01L21/66
    • H01L22/20H01L22/12
    • Methods and systems for predicting semiconductor device performance criteria during processing. A method is described that includes receiving a semiconductor wafer; performing semiconductor processing on the semiconductor wafer forming active devices that, when completed, will exhibit a device performance criteria; during the semiconductor processing, measuring in line at least one device performance criteria related physical parameter; projecting an estimated value for the device performance criteria of the active devices using the at least one in line measurement and using estimated measurements for device performance criteria related physical parameters corresponding to later semiconductor processing steps; comparing the estimated value for the device performance criteria to an acceptable range; and determining, based on the comparing, whether the active devices on the semiconductor wafer will have a device performance criteria within the acceptable range. A system for processing semiconductor wafers that includes a programmable processor for performing the methods is described.
    • 用于在处理过程中预测半导体器件性能标准的方法和系统。 描述了一种包括接收半导体晶片的方法; 在形成有源器件的半导体晶片上执行半导体处理,其在完成时将呈现器件性能标准; 在半导体处理期间,测量至少一个器件性能标准相关的物理参数; 使用所述至少一个在线测量来估计所述有源器件的器件性能标准的估计值,并使用对应于后续半导体处理步骤的器件性能标准相关物理参数的估计测量值; 将设备性能标准的估计值与可接受范围进行比较; 以及基于所述比较来确定所述半导体晶片上的有源器件是否将器件性能标准在可接受的范围内。 描述了一种用于处理半导体晶片的系统,其包括用于执行该方法的可编程处理器。
    • 19. 发明申请
    • System and Methods for Semiconductor Device Performance Prediction During Processing
    • 半导体器件性能预测的系统和方法
    • US20130071957A1
    • 2013-03-21
    • US13234964
    • 2011-09-16
    • Jen-Pan WangChao-Chi ChenYaling Huang
    • Jen-Pan WangChao-Chi ChenYaling Huang
    • H01L21/66
    • H01L22/20H01L22/12
    • Methods and systems for predicting semiconductor device performance criteria during processing. A method is described that includes receiving a semiconductor wafer; performing semiconductor processing on the semiconductor wafer forming active devices that, when completed, will exhibit a device performance criteria; during the semiconductor processing, measuring in line at least one device performance criteria related physical parameter; projecting an estimated value for the device performance criteria of the active devices using the at least one in line measurement and using estimated measurements for device performance criteria related physical parameters corresponding to later semiconductor processing steps; comparing the estimated value for the device performance criteria to an acceptable range; and determining, based on the comparing, whether the active devices on the semiconductor wafer will have a device performance criteria within the acceptable range. A system for processing semiconductor wafers that includes a programmable processor for performing the methods is described.
    • 用于在处理过程中预测半导体器件性能标准的方法和系统。 描述了一种包括接收半导体晶片的方法; 在形成有源器件的半导体晶片上执行半导体处理,其在完成时将呈现器件性能标准; 在半导体处理期间,测量至少一个器件性能标准相关的物理参数; 使用所述至少一个在线测量来估计所述有源器件的器件性能标准的估计值,并使用对应于后续半导体处理步骤的器件性能标准相关物理参数的估计测量值; 将设备性能标准的估计值与可接受范围进行比较; 以及基于所述比较来确定所述半导体晶片上的有源器件是否将器件性能标准在可接受的范围内。 描述了一种用于处理半导体晶片的系统,其包括用于执行该方法的可编程处理器。
    • 20. 发明申请
    • Method for forming a trench capacitor
    • 形成沟槽电容器的方法
    • US20070117337A1
    • 2007-05-24
    • US11285449
    • 2005-11-21
    • Chao-Chi ChenChuan-Ping Hou
    • Chao-Chi ChenChuan-Ping Hou
    • H01L21/20
    • H01L27/1087H01L27/10829H01L29/945
    • A method for forming a trench capacitor is presented in the following process steps. A trench is formed on a semiconductor substrate. A first trench dielectric is deposited into the trench without reaching a full height thereof. An etch stop layer is formed on the first trench dielectric and along inner surfaces of the trench. A second trench dielectric is deposited on the etch stop layer. The second trench dielectric and the etch stop layer are removed to expose the first trench dielectric in the trench. A conductive layer is formed on the first trench dielectric in the trench, such that the conductive layer, the first trench dielectric and the semiconductor substrate function as a trench capacitor.
    • 用于形成沟槽电容器的方法在以下工艺步骤中呈现。 在半导体衬底上形成沟槽。 第一沟槽电介质沉积到沟槽中而不达到其整个高度。 蚀刻停止层形成在第一沟槽电介质上并且沿着沟槽的内表面。 第二沟槽电介质沉积在蚀刻停止层上。 去除第二沟槽电介质和蚀刻停止层以暴露沟槽中的第一沟槽电介质。 导电层形成在沟槽中的第一沟槽电介质上,使得导电层,第一沟槽电介质和半导体衬底用作沟槽电容器。