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11. 发明授权

US07632236B2 Catheter and production method thereof 失效
标题翻译：导管及其制造方法
公开(公告)号：US07632236B2
公开(公告)日：2009-12-15
申请号：US11300517
申请日：2005-12-15
申请人： Masayuki Kaneto , Yasuhito Ohwaki , Tetsuya Ohsawa
发明人： Masayuki Kaneto , Yasuhito Ohwaki , Tetsuya Ohsawa
IPC分类号： A61B5/00 , A61B5/02
CPC分类号： A61M25/0043 , A61B5/0215 , A61M25/0015 , A61M25/007 , H05K1/056 , H05K1/189
摘要： The present invention provides a catheter 100 having a structure wherein an electronic component 2 is mounted on the anterior end or an intermediate part of a tube 1, a signal line electrically connecting to the electronic component 2 extends from the vicinity of the electronic component 2 through the aforementioned tube 1 to the posterior end of the aforementioned tube 1, which is characterized in that the signal line consists of a wiring pattern 4 of the flexible printed circuit board 10 inserted in the tube 1. Consequently, an electronic component-loaded catheter can control increase in the size of the tube caused by multiple signal lines to be connected to the electronic component.
摘要翻译：本发明提供一种具有其中电子部件2安装在管1的前端或中间部分的结构的导管100，电连接到电子部件2的信号线从电子部件2的附近延伸到电子部件2的附近，上述管1到上述管1的后端，其特征在于，信号线由插入管1中的柔性印刷电路板10的布线图案4构成。因此，电子部件负载导管可以控制由连接到电子部件的多个信号线引起的管的尺寸的增加。

12. 发明授权

US07571540B2 Production method of suspension board with circuit 有权
标题翻译：带电路的悬挂板的生产方法
公开(公告)号：US07571540B2
公开(公告)日：2009-08-11
申请号：US11505995
申请日：2006-08-18
申请人： Hidenori Aonuma , Yasuhito Ohwaki
发明人： Hidenori Aonuma , Yasuhito Ohwaki
IPC分类号： H05K3/02 , H05K3/10
CPC分类号： H05K3/44 , H05K1/056 , H05K3/108 , H05K3/243 , H05K2201/0305 , H05K2201/09554 , H05K2201/0969 , Y10T29/49126 , Y10T29/4913 , Y10T29/49144 , Y10T29/49155 , Y10T29/49165
摘要： A method of producing a suspension board with circuit, wherein after an insulating base layer is formed on a metal supporting board, a conductive pattern including a ground wiring pattern and a signal wiring pattern is formed on the insulating base layer. Then, an insulating cover layer to cover the conductive pattern is formed on the insulating base layer in such a manner that a first cover opening portion and a second cover opening portion are formed in the insulating cover layer. Then, an electrolytic plating layer is formed on a surface of the ground terminal exposed from the first cover opening portion and on a surface of the ground connecting portion exposed from the second cover opening portion, feeding electric power from the ground wire. Thereafter, a metal filling layer is formed in the base opening portion to electrically connect the ground connecting portion and the metal supporting board.
摘要翻译：一种制造具有电路的悬挂板的方法，其中在金属支撑板上形成绝缘基底层之后，在绝缘基底层上形成包括接地布线图案和信号布线图案的导电图案。然后，在绝缘基底层上形成覆盖导电图案的绝缘覆盖层，使得在绝缘覆盖层中形成第一盖开口部和第二盖开口部。然后，在从第一盖开口部露出的接地端子的表面和从第二盖开口部露出的接地连接部的表面上形成电解镀层，从地线供电。此后，在基座开口部分形成金属填充层，以电连接接地连接部分和金属支撑板。

13. 发明授权

US07272889B2 Production method of suspension board with circuit 有权
标题翻译：带电路的悬挂板的生产方法
公开(公告)号：US07272889B2
公开(公告)日：2007-09-25
申请号：US11156607
申请日：2005-06-21
申请人： Hidenori Aonuma , Yasuhito Ohwaki
发明人： Hidenori Aonuma , Yasuhito Ohwaki
IPC分类号： H01K3/10
CPC分类号： H05K3/44 , H05K1/056 , H05K3/06 , H05K3/108 , H05K3/243 , H05K2201/09554 , H05K2201/0969 , H05K2203/0323 , Y10T29/49126 , Y10T29/4913 , Y10T29/49144 , Y10T29/49165
摘要： A production method of a suspension board with circuit that can provide reduced number of man-hour and complicated processes for forming the ground terminal, to provide production cost reduction. An insulating base layer 4 having a base opening portion 3 is formed on a metal board 2 at a ground terminal 13 forming position, and a thin metal film 5 is formed on the metal board 2 exposed in the base opening portion 3 and on the insulating base layer 4. Then, a conductive pattern 7 is formed on the thin metal film 5. Then, an insulating cover layer 9 covering the conductive pattern 7 and having a cover opening portion 8 which correspond in position to the base opening portion 3 is formed on the insulating base layer 4. Then, a metal board opening portion 11 from which the base opening portion 3 and the insulating base layer 4 around it are exposed is formed in the metal board 2. Then, an electrolytic plating layer 12 is formed on each side of the conductive pattern 7 exposed in the cover opening portion 8, feeding electric power from the conductive pattern 7, and a metal filling layer 14 is formed in the metal board opening portion 11, to allow the electrolytic plating layer 12 and the metal board 2 to be conductive with each other.
摘要翻译：一种具有电路的悬挂板的制造方法，其能够提供减少的工时数量和复杂的用于形成接地端子的工艺，以提供生产成本降低。在接地端子13的形成位置的金属板2上形成具有基部开口部3的绝缘基底层4，在露出于基部开口部3的绝缘金属板2上形成金属薄膜5，基层4。然后，在金属薄膜5上形成导电图案7。然后，在基底绝缘层4上形成覆盖导电图案7并且具有与基部开口部3相对应的盖开口部8的绝缘覆盖层9。然后，在金属板2上形成金属基板开口部11，基部开口部3及其周围的绝缘基底层4露出。然后，在暴露于盖开口部8的导电图案7的两侧形成电解镀层12，从导电图案7供给电力，在金属板开口部11形成有金属填充层14，以使电解镀层12和金属板2彼此导电。

14. 发明申请

US20070074899A1 Production method of suspension board with circuit 有权
标题翻译：带电路的悬挂板的生产方法
公开(公告)号：US20070074899A1
公开(公告)日：2007-04-05
申请号：US11505995
申请日：2006-08-18
申请人： Hidenori Aonuma , Yasuhito Ohwaki
发明人： Hidenori Aonuma , Yasuhito Ohwaki
IPC分类号： H05K1/16
CPC分类号： H05K3/44 , H05K1/056 , H05K3/108 , H05K3/243 , H05K2201/0305 , H05K2201/09554 , H05K2201/0969 , Y10T29/49126 , Y10T29/4913 , Y10T29/49144 , Y10T29/49155 , Y10T29/49165
摘要： A production method of a suspension board with circuit that can form the ground terminal for connection with the ground, while reducing the number of man-hour and complicated processes, and reduce production cost. After an insulating base layer is formed on a metal supporting board in such a manner that the base opening portion is formed in the metal supporting board, a conductive pattern comprising a ground wiring pattern and a signal wiring pattern is formed on the insulating base layer. Then, an insulating cover layer to cover the conductive pattern is formed on the insulating base layer in such a manner that a first cover opening portion and a second cover opening portion are formed in the insulating cover layer. Then, an electrolytic plating layer is formed on a surface of the ground terminal exposed from the first cover opening portion and on a surface of the ground connecting portion exposed from the second cover opening portion, feeding electric power from the ground wire. Thereafter, a metal filling layer is formed in the base opening portion so as to conduct the ground connecting portion and the metal supporting board.
摘要翻译：具有电路的悬挂板的制造方法，其可以形成用于与地面连接的接地端子，同时减少工时数量和复杂的工艺，并降低生产成本。在基板开口部分形成在金属支撑板上的金属支撑板上形成绝缘基底层之后，在绝缘基底层上形成包括接地布线图形和信号布线图形的导电图案。然后，在绝缘基底层上形成覆盖导电图案的绝缘覆盖层，使得在绝缘覆盖层中形成第一盖开口部和第二盖开口部。然后，在从第一盖开口部露出的接地端子的表面和从第二盖开口部露出的接地连接部的表面上形成电解镀层，从地线供电。此后，在基部开口部分形成金属填充层，以便导通接地连接部分和金属支撑板。

15. 发明申请

US20070017695A1 Wired circuit board 有权
标题翻译：有线电路板
公开(公告)号：US20070017695A1
公开(公告)日：2007-01-25
申请号：US11477935
申请日：2006-06-30
申请人： Jun Ishii , Yasuhito Ohwaki , Yasuhito Funada
发明人： Jun Ishii , Yasuhito Ohwaki , Yasuhito Funada
IPC分类号： H05K1/09
CPC分类号： H05K3/38 , H05K1/056 , H05K3/06 , H05K3/205 , H05K3/44 , H05K2201/0379 , H05K2201/0969 , H05K2201/09781 , H05K2201/2072 , H05K2203/0323
摘要： A wired circuit board that can provide an enhanced adhesion of a metal supporting board at a marginal portion of an opening formed in the metal supporting board with a simple structure to prevent stripping of the metal supporting board. In a suspension board with circuit, in order to reduce a transmission loss of a conductive pattern, a metal foil embedded in an insulating base layer is formed in a pattern comprising a first metal foil portion and a second metal foil portion surrounding the first metal foil portion spaced apart therefrom, and an opening is formed in the metal supporting board so that a marginal portion of the opening is located in a space between the first metal foil portion and the second metal foil portion.
摘要翻译：一种布线电路板，其能够以简单的结构提供在金属支撑板上形成的开口的边缘部分处的金属支撑板的增强的附着，以防止金属支撑板的剥离。在具有电路的悬挂板中，为了减少导电图案的传输损耗，嵌入绝缘基底层中的金属箔以包括第一金属箔部分和围绕第一金属箔的第二金属箔部分的图案形成部分间隔开，并且在金属支撑板上形成开口，使得开口的边缘部分位于第一金属箔部分和第二金属箔部分之间的空间中。

16. 发明授权

US07129418B2 Suspension board with circuit and producing method thereof 有权
标题翻译：具有电路的悬挂板及其制造方法
公开(公告)号：US07129418B2
公开(公告)日：2006-10-31
申请号：US10944827
申请日：2004-09-21
申请人： Hidenori Aonuma , Yasuhito Ohwaki
发明人： Hidenori Aonuma , Yasuhito Ohwaki
IPC分类号： H05K1/03
CPC分类号： H05K3/243 , H05K1/056 , H05K3/06 , H05K3/108 , H05K3/244 , H05K3/28 , H05K3/384 , H05K3/388 , H05K3/4007 , H05K3/44 , H05K2201/0969 , H05K2203/0323 , H05K2203/0723
摘要： A suspension board with circuit permits a terminal portion to be formed by electrolysis plating without exposing a conductor layer to outside and a production method thereof. After an insulating base layer is formed on a suspension board in a specific pattern in which a second opening is formed, a thin metal film is formed on the insulating base layer and on the suspension board including the second opening exposed from the insulating base layer. A conductor layer is formed in the form of a wired circuit pattern on the thin metal film. An insulating cover layer is formed with a pad opening therein, and a pad portion formed in the pad opening using the suspension board as a lead portion of the electrolysis plating. A first opening larger than the second opening is formed in the suspension board at a portion thereof corresponding to the second opening.
摘要翻译：具有电路的悬挂板允许通过电解电镀形成端子部分而不将导体层暴露于外部及其制造方法。在形成有第二开口的特定图案的悬垂基板上形成绝缘基底层之后，在绝缘基底层和包括从绝缘基底层露出的第二开口的悬挂基板上形成薄金属膜。在薄金属膜上以布线电路图案的形式形成导体层。绝缘覆盖层在其中形成有焊盘开口，并且使用悬挂板形成在焊盘开口中的焊盘部分作为电解电镀的引线部分。在悬挂板上形成有比第二开口大的第一开口，在其对应于第二开口的部分。

17. 发明授权

US07084493B2 Wiring circuit board and production method thereof 有权
标题翻译：接线电路板及其制作方法
公开(公告)号：US07084493B2
公开(公告)日：2006-08-01
申请号：US11020350
申请日：2004-12-22
申请人： Yasuhito Funada , Tetsuya Ohsawa , Yasuhito Ohwaki
发明人： Yasuhito Funada , Tetsuya Ohsawa , Yasuhito Ohwaki
IPC分类号： H01L23/14 , H01L51/40
CPC分类号： G11B33/122 , G11B5/3103 , G11B5/3967 , H05K3/0023 , H05K3/0082 , H05K3/28 , H05K2201/0154 , H05K2201/0191
摘要： In the vicinity of the exposed part 1A of the multiply formed plural wiring conductors 1, of the thicknesses of the insulating cover layer 2 made of a polyimide layer, the thickness (T1) of a part located at about the middle point between the adjacent wiring conductors 1 is made smaller than the thickness (T2) of a part located on wiring conductor 1. Preferably, the difference in the thicknesses of a part located at about the middle point between the adjacent wiring conductors of the insulating cover layer 2 and that of a part located on wiring conductor is made to fall within the range of 1–5 μm. As a result, the insulating cover layer does not peel off easily.
摘要翻译：在由聚酰亚胺层制成的绝缘覆盖层2的厚度的多重形成的多个布线导体1的露出部分1A的附近，位于中间点之间的部分的厚度（T 1）使相邻布线导体1小于位于布线导体1上的部分的厚度（T 2）。优选地，将位于绝缘覆盖层2的相邻布线导体和位于布线导体的部分的相邻布线导体之间的中点附近的部分的厚度差设为在1-5μm的范围内。结果，绝缘覆盖层不容易剥离。

18. 发明授权

US07500780B2 Flexible wired circuit board for temperature measurement 有权
标题翻译：柔性布线电路板进行温度测量
公开(公告)号：US07500780B2
公开(公告)日：2009-03-10
申请号：US10694772
申请日：2003-10-29
申请人： Yosuke Miki , Yasuhito Ohwaki
发明人： Yosuke Miki , Yasuhito Ohwaki
IPC分类号： G01K7/16
CPC分类号： G01K7/183 , H05K1/0201 , H05K1/0393 , H05K1/09 , H05K2201/10151
摘要： A flexible wired circuit board for temperature measurement that can provide an accurate temperature measurement even when placed in a high-temperature atmosphere and can also be provided at a reduced cost. In the flexible wired circuit board for temperature measurement, a conductor layer formed from a metal foil, such as a stainless foil, having a proportional relation between temperature and specific electric resistance is formed on a base insulating layer. Also, a single thin sensor wiring in a sensor portion exposed from a cover insulating layer is formed into a certain pattern by folding back the sensor wiring in a continuous S-shaped form, such that adjacent parts of the wiring extending in parallel are spaced apart from each other at a predetermined interval in a widthwise direction of the conductor layer. The flexible wired circuit board for temperature measurement thus constructed can prevent occurrence of errors in measured temperature even when used in high-temperature atmosphere, thus achieving accurate measurement of temperature, different from the flexible wired circuit board having the conductor layer comprising a copper foil.
摘要翻译：一种用于温度测量的柔性布线电路板，即使在放置在高温气氛中也能提供准确的温度测量，并且还可以以较低的成本提供。在用于温度测量的柔性布线电路板中，在基底绝缘层上形成由诸如不锈钢箔的金属箔形成的导体层，其具有温度和比电阻之间的比例关系。此外，通过将传感器布线以连续的S形形式折回，使得从盖绝缘层露出的传感器部分中的单个薄传感器布线形成为一定的图案，使得平行延伸的布线的相邻部分间隔开在导体层的宽度方向上以预定间隔彼此相对。用于这样构成的用于温度测量的柔性布线电路板即使在高温环境中使用也可以防止测量温度误差的发生，从而实现与具有包含铜箔的导体层的柔性布线电路板的温度的精确测量。

19. 发明授权

US07056014B2 Flexible wired circuit board for temperature measurement 有权
公开(公告)号：US07056014B2
公开(公告)日：2006-06-06
申请号：US10694772
申请日：2003-10-29
申请人： Yosuke Miki , Yasuhito Ohwaki
发明人： Yosuke Miki , Yasuhito Ohwaki
IPC分类号： G01K7/16
摘要： A flexible wired circuit board for temperature measurement that can provide an accurate temperature measurement even when placed in a high-temperature atmosphere and can also be provided at a reduced cost. In the flexible wired circuit board for temperature measurement, a conductor layer formed from a metal foil, such as a stainless foil, having a proportional relation between temperature and specific electric resistance is formed on a base insulating layer. Also, a single thin sensor wiring in a sensor portion exposed from a cover insulating layer is formed into a certain pattern by folding back the sensor wiring in a continuous S-shaped form, such that adjacent parts of the wiring extending in parallel are spaced apart from each other at a predetermined interval in a widthwise direction of the conductor layer. The flexible wired circuit board for temperature measurement thus constructed can prevent occurrence of errors in measured temperature even when used in high-temperature atmosphere, thus achieving accurate measurement of temperature, different from the flexible wired circuit board having the conductor layer comprising a copper foil.

20. 发明申请

US20060027393A1 Partially completed wiring circuit board assembly sheet and production method of wiring circuit board using said sheet 有权
标题翻译：部分完成布线电路板组装片及使用该片的布线电路板的生产方法
公开(公告)号：US20060027393A1
公开(公告)日：2006-02-09
申请号：US11195965
申请日：2005-08-03
申请人： Hidenori Aonuma , Tetsuya Ohsawa , Yasuhito Ohwaki
发明人： Hidenori Aonuma , Tetsuya Ohsawa , Yasuhito Ohwaki
IPC分类号： H05K1/00 , C25D5/02
CPC分类号： H05K3/242 , H05K1/056 , H05K3/0052 , H05K3/28 , H05K2201/0969
摘要： The present invention provides a partially completed wiring circuit board assembly sheet capable of preventing deposition of a plating metal on the surface of a metal sheet, even when pinholes are produced in an insulating layer for insulating a lead wire for electroplating from a metal sheet. The assembly sheet 100 of the present invention has a metal sheet 1, multiple wiring circuit board forming area 1A in compartments on the metal sheet and area 1B for forming a lead wire for electroplating, which is in compartment on the metal sheet 1. Each area 1A has a partially completed wiring circuit board 10. The partially completed wiring circuit board 10 is equipped with a base insulating layer 2, a wiring pattern 3 and a cover insulating layer 4. In the area 1B, a first insulating layer 12, a lead wire 13 for electroplating and a second insulating layer 14 are laminated in this order. Of the metal sheet 1, an opening 16 is formed in the part under the lead wire 13.
摘要翻译：本发明提供了一种部分完成的布线电路板组装片，即使在用于使金属片的电镀用引线绝缘的绝缘层中产生针孔时，也能够防止电镀金属在金属片的表面上的沉积。本发明的组装片100具有金属片1，金属片上的隔室中的多个布线电路板形成区域1A和金属片1上的隔室中形成用于电镀的导线的区域1B。每个区域1A具有部分完成的布线电路板10。部分完成的布线电路板10配备有基底绝缘层2，布线图案3和覆盖绝缘层4。在区域1B中，依次层叠第一绝缘层12，电镀用引线13和第二绝缘层14。在金属片1中，在引线13下面的部分中形成开口16。

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